JP3981478B2 - Electronic component mounting device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an electronic component mounting apparatus and method used in the industry for assembling and mounting electronic components.
[0002]
[Prior art]
As shown in FIG. 18A, the electronic component 82 is mounted on the printed circuit board or the like by the mounting head 81 in the electronic component mounting apparatus 80 that is arbitrarily moved in the XY direction. Are mounted in a predetermined manner by repeating the adsorption and separation.
[0003]
In the conventional electronic component mounting apparatus 80, as shown in FIG. 18 (b), a plurality of mounting heads 81 (for example, four or six) are fixed to the movable body 85 moving in the XY direction at a predetermined interval. Has been.
[0004]
The electronic components 82, 82, 82... Sucked and held by the plurality of mounting heads 81, 81, 81... Are mounted on the mounting head by a sensor 86 such as a CCD camera that travels below the electronic components 82. When the holding state at the time of being sucked by the suction nozzle 87 in 81 is detected and detection information other than predetermined data is obtained, the posture, position, etc. of the electronic component 82 is changed before mounting on the printed circuit board 88. It is corrected.
[0005]
However, the mounting heads 81 arranged in a plurality are arranged in a fixed state in which their respective mounting pitches are constant (invariable). If the intervals (pitch) between the plurality of electronic components 82 are not equal to the mounting intervals (pitch) of the mounting heads 81, 81, 81.
[0006]
Therefore, the entire movable body 85 supporting the plurality of mounting heads 81, 81, 81... Is moved with respect to the individual mounting heads 81, and each mounting head 81 is moved to the electronic of the supply unit 83. In order to shorten the tact time, which is a major issue for the electronic component mounting industry, it is necessary to correspond to the suction positions of the components 82, and it takes time to work on the suction holding of the electronic components 82 for all the mounting heads 81. It has become a major obstacle.
[0007]
This also occurs in the mounting of the electronic component 82 in the mounting portion 84. The mounting interval (pitch) of a large number of electronic components 82 to be mounted on the printed circuit board 88 is different from that of the electronic component 82. If the mounting heads 81, 81, 81... That are held by suction do not match the mounting interval (pitch), simultaneous mounting cannot be performed (generally, they do not substantially match).
[0008]
Therefore, the entire movable body 85 supporting the plurality of mounting heads 81, 81, 81... Is moved with respect to each mounting head 81, and each mounting head 81 is printed on the mounting portion 84. It is necessary to correspond to the mounting position of the electronic component 82 on the substrate 88, and it takes time to mount the electronic component 82 by all the mounting heads 81, and the tact time cannot be shortened.
[0009]
Even if the electronic components 82 are not simultaneously picked up and mounted simultaneously, if the mounting interval (pitch) of the mounting heads 81 is invariant, the movement adjustment of the individual mounting heads 81 in the left-right direction can be performed. Therefore, by the same operation as described above, the entire movable body 85 supporting the plurality of mounting heads 81, 81, 81... Must be adjusted.
[0010]
Further, the sensor 86 and the mounting head 81 for detecting the suction holding state of the electronic component 82 held by suction by each mounting head 81 have a configuration such as a moving camera shaft mechanism, a Z-axis servo motor, a ball screw, a spline shaft, and the like. Thus, the number of parts increases, leading to an increase in the cost of the entire apparatus. Etc. have various problems.
[0011]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems, and a plurality of mounting heads are individually variably controlled, and each of them is arbitrarily spread and sucks an electronic component, and the sucked electronic component is retained. The state is detected by the detection means located below the electronic component, and is mounted at a predetermined position on the printed circuit board determined in advance. Each member is controlled so that the amount of movement is minimized, the mounting operation time can be shortened as much as possible, the tact time can be shortened, and the configuration of the mounting head and the detection means can be simplified. An object of the present invention is to provide an electronic component mounting apparatus and method.
[0012]
Means of the present invention for achieving the above-mentioned object includes an advancing / retracting body that is provided in an airframe and moves in the front-rear direction, a movable body that is provided on one side of the advancing / retreating body and moves in the left-right direction, and the movable body of the upper vertical plane to move individually to the left and right direction or the left-right direction and the vertical direction, and a plurality of mounting heads which move the mounting portion and the supply portion of the electronic component together with the movable member, provided in said mounting head An electronic component suction member that moves in the vertical direction and rotates about the vertical axis direction, a detection means that detects the electronic component sucked by the electronic component suction member, and a detection signal from the detection means, is determined in advance. The electronic component mounting apparatus includes control means for calculating based on the obtained data.
[0013]
And the said detection means exists in the structure of the electronic component mounting apparatus which moves below the said mounting head .
[0016]
1 to 4, A is an electronic component mounting apparatus that receives an electronic component b such as a chip component or an IC component from its supply unit m, transfers it to the mounting unit n, and mounts it on a predetermined location on the printed circuit board c. It is.
[0017]
In the electronic component mounting apparatus A described above, the supply part m of the electronic component b which is sequentially transported by a parts feeder or the like to the one side or both sides in the body 1 and waits is also provided in the body 1 as a transfer member (see FIG. (Not shown) is provided with a mounting portion n for the electronic component b into which the printed circuit board c is carried in and out.
[0018]
As shown in FIGS. 1, 2, and 4, the structure includes an advancing / retracting body 3 that is attached to the airframe 1 and arbitrarily moves in the front-rear direction (Y-axis direction) by the first driving means 2, A movable body 5 which is attached to the body 3 and arbitrarily moves in the left-right direction (X-axis direction) by the second driving means 4 is provided.
[0019]
In this movable body 5, a plurality of (or even a single) mounting heads 7 can be moved vertically (up and down direction) or vertically and horizontally (up and down direction and X-axis direction) by a fifth drive means 6 b described later. It is engaged so that it can move forward and backward.
[0020]
A suction nozzle 9 which is an electronic component suction member such as a suction pad type that sucks the upper surface of the electronic component b and a chuck type that grips the outer periphery of the electronic component b is attached to the lower ends of the plurality of mounting heads 7. In this embodiment, the suction pad type is shown. The suction nozzle 9 is rotatable about the vertical axis direction (Z-axis direction) by the rotating means 8a. The drive means 8b can be moved up and down with respect to the mounting head 7.
[0021]
The first driving means 2, the second driving means 4, the third driving means 8b, and the rotating means 8a are, for example, means including a conventional motor and a screw shaft, and the motor can be numerically controlled. It is operated with high accuracy using a servo motor or the like.
[0022]
Further, in the first drive means 2, as shown in FIG. 5, conventional linear motor means comprising a fixed member 11 provided on the machine body 1 side and a movable member 12 provided on the advance / retreat body 3 side is provided. Can be used.
[0023]
Further, as shown in FIG. 6, the second driving means 4 uses a conventional linear motor means comprising a fixed member 11 provided on the advancing / retracting body 3 side and a movable member 12 provided on the movable body 5 side. be able to.
[0024]
Furthermore, as shown in FIG. 4, the third driving means 8b described above has a fixing member 11 provided on the mounting head 7 side, as well as a lifting / lowering configuration by a screw shaft and a motor, as shown in FIG. Conventional linear motor means comprising a movable member 12 provided on the suction nozzle 9 side can be used.
[0025]
As shown in FIG. 2, the fixing member 11 in each of the linear motor means is made of a flattened flat magnetic material, and grooves 13 having a predetermined width are formed on the surface in a vertical and horizontal matrix form at a predetermined pitch. By forming the two-dimensional array, a large number of teeth 14 are formed as protrusions surrounded by the grooves 13.
[0026]
Further, these grooves 13 are filled with, for example, a nonmagnetic material such as synthetic resin, and the entire surface of the fixing member 11 is processed as a flat smooth surface.
[0027]
On the other hand, the movable member 12 includes, for example, a plurality of pairs of electromagnets 15, and the magnetic poles 16 of the electromagnets 15 are opposed to the teeth 14 of the fixed member 11.
[0028]
Each of these magnetic poles 16 has teeth 17 having a pitch corresponding to the teeth 14 of the fixing member 11, and each electromagnet 15 has a predetermined deviation with respect to the teeth 14 of the fixing member 11. Be placed.
[0029]
The paired electromagnets 15 are energized and controlled with a predetermined phase difference by, for example, a sin current and a cos current, and form a magnetic loop with the fixed member 11 via the teeth 14 and 17. The thrust in the vertical direction and the horizontal direction is generated on the surface of the fixing member 11.
[0030]
With this thrust, the movable member 12, that is, the mounting head 7 is driven to move in the above-described directions on the surface of the fixed member 11.
[0031]
Note that the amount of movement of the movable member 12 can be controlled in a predetermined manner by applying an energization current of the electromagnet 15 in a pulsed manner and counting the number of pulses via the control means 18 or the like.
[0032]
Further, as shown in FIGS. 2 and 3, the mounting heads 7, 7, 7... Are mounted on the vertical plane of the movable body 5 in the up / down direction or in the up / down / left / right direction by the fifth drive means 6b. It has been.
[0033]
As the fifth drive means 6b, linear motor means comprising a fixed member 11 provided on the movable body 5 side and a movable member 12 provided on the mounting head 7 side is used.
[0034]
As this linear motor means, the same structure as that employed in the first, second and third driving means 2, 4 and 8b is used.
[0035]
In the movement of the mounting head 7 using the fifth driving means 6b, as shown in FIGS. 6 (a) and 17, the movement only in the left-right direction or as shown in FIG. 6 (b). In addition to the linear motor means, a means comprising a conventional screw shaft and a motor (not shown) may be used in addition to the linear motor means.
[0036]
Further, as shown in FIG. 6 (c), the configuration of the fifth driving means 6b is appropriately combined with the fifth driving means 6b1 that moves only in the horizontal direction and the fifth driving means 6b2 that moves only in the vertical direction. It can also be configured.
[0037]
In addition, the electronic component b sucked and held by the suction nozzle 9 is recognized by the detection means 20 in the suction state.
[0038]
The detection means 20 is attached to the movable body 5 or the advancing / retreating body 3 via the attachment body 24, and detects the holding state of the electronic component b held by the mounting head 7, and is a camera sensor such as a CCD. In this embodiment, as shown in FIG. 7 to FIG. 10 and the like, the visual sensor 21, the light image incident means 22, the light source, and the like are used. 23.
[0039]
Among these, the visual sensor 21 is attached to one side of a substantially horizontal mounting body 24 and is disposed laterally with respect to the electronic component b held by the mounting head 7 and uses a conventional CCD camera. It recognizes and captures the image of the electronic part b, and transmits this detection signal to the control means 18 described later.
[0040]
In the image recognition described above, the overall size of the electronic component b held by suction, the overall position in the front-rear and left-right directions, the lead pitch, the lead bend, the number of leads, etc. are checked. As a result, the electronic device b is matched with the determined correct position by the control means 18 described later.
[0041]
The light image incident means 22 is mounted on the movement locus of the mounting body 24 just below the electronic component b of the mounting head 7 on the other side of the mounting body 24 corresponding to the visual sensor 21. A prism or mirror having a light emitting surface of 45 ° is used, and the light emitting surface corresponds to the visual sensor 21 and the electronic component b surface of the mounting head 7, respectively.
[0042]
The light source 23 described above sends illumination light to the electronic component b of the mounting head 7 and the visual sensor 21 via the light image incident means 22 to stabilize the measurement by the visual sensor 21, and is the same as the visual sensor 21. It is disposed on the front side of the visual sensor 21 using a coaxial incident type having an optical axis.
[0043]
The detection means 20 is provided with a position detection member 25 that regulates the light emission position and the light emission time of the light source 23 and uses a phototube, a proximity switch, etc. Detectors 26 and 27 for starting and stopping the irradiation of the light source 23 are attached to the advancing / retracting body 3 in correspondence with the respective mounting heads 7, and detecting bodies 28 corresponding to these detectors 26 and 27 are provided on the attaching body 24. It is.
[0044]
The detection means 20 may be fixedly provided at an appropriate position of the machine body 1, but if it is configured to move together with the mounting head 7, the electronic component b is moved during the movement of the electronic component b held by suction. The adsorption state of b is detected.
[0045]
For example, as shown in FIGS. 3 and 4, the attachment structure of the detection means 20 is moved with respect to the movable body 5 by a servo motor or the like that can be numerically controlled with respect to the movable body 5. The fourth drive means 6a to be controlled is attached so as to move forward and backward in the left-right direction below the mounting head 7.
[0046]
As shown in FIG. 7, the detection means 20 may be attached to the advance / retreat body 3 via an attachment member 31. In this case, the movable body 5 is moved by the second drive means 4, that is, When the mounting head 7 is moved laterally, the suction holding state of the electronic component b can be detected by the detection means 20.
[0047]
Further, as shown in FIG. 8, the detection means 20 may be provided to the advance / retreat body 3 by the attachment member 31 and the attachment body 24 via the fourth drive means 6a, and the movement of the detection means 20 is the fourth drive. The detection process is performed by the means 6a, and the detection process is performed by setting the forward or return path of the detection means 20 as one detection process, or by making the detection means 20 reciprocate.
[0048]
Further, the detection means 20 is moved in the left-right direction by the fourth drive means 6a to the vertical surface of the movable body 5 as shown in FIGS. 9 and 10 or to the predetermined surface of the advancement and retraction body 3 as shown in FIG. It can also be attached to move forward and backward.
[0049]
The fourth driving means 6a is composed of a linear motor means similar to the first, second, third and fifth driving means 2, 4, 8b and 6b described above, and is movable. It comprises a fixed member 11 provided on the body 5 side and a movable member 12 provided on the detection means 20 side. The detailed configuration of the linear motor means includes the first, second, third and fifth drive means described above. The description of 2, 4, 8b and 6b is incorporated.
[0050]
Further, as shown in FIGS. 9 and 10, the detection means 20 to be used is configured such that the lower surface of the electronic component b directly corresponds to the visual sensor 21 such as a CCD provided with the light source 23.
[0051]
The control means 18 is linked to the detection means 20, receives this detection signal, calculates based on predetermined data, and each of the means 2, 4, 6a, 6b, or 8a, 8b, the suction nozzle. Nine suction means (not shown) are individually and arbitrarily controlled, and a conventional computer is used.
[0052]
A signal such as image information from the detection means 20 is sent to the control means 18 formed of a computer and subjected to predetermined calculations and the like, and the electronic component b is determined when the electronic component b is mounted on the printed circuit board c. The control means 18 controls each of the above-mentioned means 2, 4, 6a, 6b, 8a and 8b so as to be mounted at the correct position.
[0053]
Therefore, the operation of one embodiment of the electronic component mounting apparatus A and method according to the present invention is as follows.
[0054]
On the board c, electronic components b are respectively mounted at predetermined positions. In this work, data such as setting values and operation order are stored in the control means 18 in advance.
[0055]
The electronic component b is mounted by first control means 2, second drive means 4, fourth drive means 6 a, fifth drive means 6 b, rotation means 8 a and third drive means by each control by the control means 18. By operating 8b, the mounting head 7 is moved to the supply part m of the electronic component b to receive the electronic component b.
[0056]
At this time, the fifth drive means 6b comprising the linear motor means of the mounting head 7 is changed from the state shown in FIGS. 12 (a) and 13 (a) to the state shown in FIGS. 12 (b) and 13 (b). The individual mounting heads 7 are operated so as to be independently moved in accordance with the program described above, and the fixing member 11 surface provided on the vertical surface of the movable body 5 is provided on each mounting head 7. The movable member 12 moves in the vertical direction and the horizontal direction.
[0057]
The type of the detection means 20 shown in FIG. 12 is such that the detection means 20 is reciprocated in the left-right direction by a fourth drive means 6a comprising a screw shaft and a motor provided on the movable body 5 (or the advance / retreat body 3). The type of the detection means 20 shown in FIG. 13 is one in which the detection means 20 is reciprocated in the left-right direction by a fourth drive means 6 a comprising linear motor means provided on the movable body 5.
[0058]
Then, the individual mounting heads 7 are adjusted in accordance with the standby position (predetermined pitch) of the electronic component b prepared for suction in the supply unit m, and the electronic component b is simultaneously sucked or continuously sucked. It is what
[0059]
This adjustment operation is all completed while the mounting head 7 attached to the movable body 5 moves to the supply unit m.
[0060]
As shown in FIGS. 12 (c) and 13 (c), the mounting heads 7 holding the electronic component b by suction again actuate the fifth drive means 6b comprising linear motor means, as shown in FIGS. 12 (c) and 13 (c). To adjust the distance (pitch) between the mounting heads 7 to a minimum.
[0061]
In this state, the detection means 20 attached to the movable body 5 is sucked and held by each mounting head 7 from the outermost position of each mounting head 7 as shown in FIGS. 12 (c) and 13 (c). The electronic component b is imaged and its suction holding state is detected. The detection of the electronic component b held by each mounting head 7 with a reduced interval is shortened because the amount of movement of the detecting means 20 is shortened. Is done.
[0062]
The detected image information of the electronic component b is transmitted to the control means 18, subjected to predetermined image processing, compared with predetermined data, and when the value is different from the data, the control means 18. Is corrected so as to be a normal value, and a predetermined movement signal is given to the first driving means 2, the second driving means 4, and the rotating means 8a.
[0063]
In particular, in the present embodiment, data (coordinate values) based on the mounting information on the printed circuit board c and the corrected values are transmitted to the fifth driving means 6b comprising linear motor means, as shown in FIG. As shown in d) and FIG. 13 (d), an adjustment is made to match the mounting position of the electronic component b, and the electronic component b is mounted simultaneously or continuously in the mounting portion n.
[0064]
The above correction based on the information obtained by the detection means 20 is all completed during the movement of the mounting head 7 to the printed circuit board c in the mounting portion n.
[0065]
As a result, the time required for sucking and holding the electronic component b in the supply part m of the electronic component b and the mounting of the electronic component b in the mounting part n is significantly shortened compared to the conventional apparatus. The tact time can be greatly shortened.
[0066]
In particular, when the mounting head 7 is moved by the first driving means 2 and the second driving means 4, each electronic component b of each mounting head 7 is individually moved by the fifth driving means 6 b of each mounting head 7. Then, since the correction of the coordinate value with respect to the X-axis direction (left-right direction) has already been performed, it is only necessary to correct the coordinate value only with respect to the Y-axis direction (front-rear direction). The tact time can be shortened.
[0067]
As shown in FIG. 14, the mounting heads 7 may be arranged on both sides of the advancing / retracting body 3 or the movable body 5, and each mounting head 7 is moved to the movable body 5 by the fifth driving means 6b. It is attached so that it can move forward and backward in the left-right direction or left-right / up-down direction.
[0068]
Accordingly, the detection means 20 is also arranged so as to be movable in the left-right direction on the movable body 5 by the fourth drive means 6a, and this attachment is performed as shown in FIG. 11, for example. You may perform with respect to the advance / retreat body 3.
[0069]
In the above-described embodiment in which the mounting pitch of the plurality of mounting heads 7 is variably controlled with respect to the movable body 5, the fifth drive means 6b can adopt a configuration other than the linear motor means. For example, as shown in FIG. 15 (a), a plurality of mounting heads 7 engaged with the left and right guides 40 of the movable body 5 so as to be able to advance and retreat are individually connected to a screw shaft 41 and a motor 42, respectively. As shown in FIG. 15B, the fifth drive means 6b such as a belt 43 and a motor 44 that are individually linked to each other can be used.
[0070]
FIG. 16 shows an example in which a plurality of, for example, two advance / retreat bodies 3 are provided in the present embodiment, and the movable bodies 5 and 5 are respectively connected to the two advance / retreat bodies 3 by respective second drive means. 4 and 4 to move left and right.
[0071]
In addition, in the case shown in FIG. 16A, the mounting head 7 that is movably attached to the movable body 5 by the fifth drive means 6b is directed outward relative to the advancing / retracting body 3, respectively. In the case shown in 16 (b), each is directed inward relative to the advance / retreat body 3.
[0072]
As shown in FIG. 16 (c), the configuration of the mounting head 7 facing inward can be arranged in a straight line, and the airframe 1 as shown in FIG. When the supply part m of the electronic component b is arranged on both sides, the mounting heads 7 and 7 of the movable bodies 5 and 5 attached to the advancing and retracting bodies 3 and 3 The supply unit m and the supply unit m on the other side can be freely moved back and forth, and the electronic component b can be efficiently sucked by the suction nozzle 9.
[0073]
【The invention's effect】
As described above, the electronic component mounting apparatus according to the present invention can individually change a plurality of mounting heads, whereby both or both of the steps of simultaneous adsorption and simultaneous mounting of electronic components by the plurality of mounting heads are performed. Since one process can be performed, the time required for the entire electronic component can be reduced when mounting the electronic component compared to the conventional apparatus, and the efficiency of the electronic component mounting process can be greatly improved.
[0074]
By using linear motor means for at least one of the drive means of the first, second, third, fourth and fifth drive means, the structure of the drive means is simplified, and the device The overall production cost can be reduced. It has a special effect such as.
[Brief description of the drawings]
FIG. 1 is a plan view showing an outline of an embodiment of an electronic component mounting apparatus employing an electronic component mounting method according to the present invention.
FIG. 2 is an enlarged side view showing a schematic part of fifth drive means of the mounting head in FIG. 1;
3 is a perspective view showing a main part of a mounting head of the apparatus in FIG. 1. FIG.
4 is a side view of the device in FIG. 3. FIG.
FIG. 5 is an explanatory diagram showing another example of the first driving means of the apparatus in FIG. 1;
6 is an explanatory view showing another example of the second driving means of the apparatus in FIG. 1. FIG.
7 is a side view showing another example of attachment of the detection means of the apparatus in FIG. 1. FIG.
8 is a side view showing a modified example of attachment of the detection means of the apparatus in FIG. 1. FIG.
9 is a perspective view showing another example of attachment of the detection means of the apparatus in FIG. 1. FIG.
10 is a side view of the device in FIG. 9. FIG.
11 is a side view showing another example of attachment of the detection means of the apparatus in FIG. 1. FIG.
12 is an explanatory view showing an operation of mounting an electronic component of the apparatus in FIG. 1. FIG.
13 is an explanatory diagram showing an electronic component mounting operation by a detection unit of another example of the apparatus in FIG. 1. FIG.
14 is a side view showing another example of arrangement of the mounting head of the apparatus in FIG. 1. FIG.
FIG. 15 is an explanatory view showing another example of the fifth drive means of the apparatus in FIG. 1;
16 is an explanatory view showing still another arrangement example of the mounting head of the apparatus in FIG. 1. FIG.
FIG. 17 is a perspective view showing fifth drive means of the apparatus in FIG.
18A and 18B show a conventional electronic component mounting apparatus, in which FIG. 18A is a schematic plan view and FIG. 18B is a perspective view of a main part.
[Explanation of symbols]
A Electronic component mounting apparatus b Electronic component 1 Airframe 2 First driving means 3 Advance / Retreat body 4 Second driving means 5 Movable body 6a Fourth driving means 6b Fifth driving means 7 Mounting head 8a Rotating means 8b Third driving means 9 Electronic parts Adsorption member (adsorption nozzle)
DESCRIPTION OF SYMBOLS 11 Fixed member 12 Movable member 18 Control means 20 Detection means 21 Visual sensor 22 Optical image incident means 23 Light source

Claims (2)

Advancing and retreating body that is provided in the aircraft and moves in the front-rear direction,
A movable body provided on one side of the advancing and retracting body and moving in the left-right direction;
A plurality of mounting heads that individually move in the left-right direction or the left-right direction / up-down direction on the vertical surface of the movable body, and that move the electronic component supply unit and the mounting unit together with the movable body;
An electronic component suction member that is provided in the mounting head and moves in the vertical direction and rotates around the vertical axis direction;
Detection means for detecting an electronic component adsorbed on the electronic component adsorption member;
An electronic component mounting apparatus comprising: control means for receiving a detection signal from the detection means and calculating based on predetermined data.   The electronic component mounting apparatus according to claim 1, wherein the detection unit moves below the mounting head.

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