JP5654745B2 - Piezoelectric vibration element mounting device - Google Patents

Description

  The present invention relates to a piezoelectric vibration element mounting apparatus for mounting a piezoelectric vibration element on an element mounting member.

A conventional piezoelectric vibration element mounting apparatus is an apparatus for mounting a piezoelectric vibration element on an element mounting pad of an element mounting member.
Such a conventional piezoelectric vibration element mounting device includes a first transport unit, a second transport unit, a recognition unit, a mounting unit, and a control unit.
The first transport means plays a role of moving a piezoelectric vibration element arranging jig in which the piezoelectric vibration elements are arranged to a predetermined position and stopping it at the predetermined position.
The second transport means plays a role of moving the element mounting member arrangement jig in which the element mounting members are arranged to a predetermined position and stopping at the predetermined position.
The recognition means includes a camera, and the element mounting pad of the element mounting member stored in the piezoelectric vibration element or the element mounting member arraying jig stored in the piezoelectric vibration element arraying jig disposed on the holding table by the camera. Play a role to recognize.
The mounting means is constituted by a nozzle and an operating part, and the piezoelectric vibration element is taken out from the piezoelectric vibration element arranging jig by the nozzle, and the removed piezoelectric vibration element is element of each element mounting member of the element mounting member alignment jig. It plays the role of mounting on the mounting pad.
The control means plays a role of controlling the mounting means by information obtained from the recognition means. Such a piezoelectric vibration element mounting device is known (see, for example, Patent Document 1).

JP 2006-229837 A

However, in the conventional piezoelectric vibration element mounting apparatus, one piezoelectric vibration element is taken out from the piezoelectric vibration element array jig by one nozzle of the mounting means, and the elements are mounted in the element mounting member array jig arranged on the holding table. Since it is mounted on the element mounting pad provided in the bottom of the recess space of the member, it takes a lot of time to mount the piezoelectric vibration element on all the element mounting members, and there is a problem that productivity is lowered. It was.
Further, in the conventional piezoelectric vibration element mounting device, when the piezoelectric vibration element is taken out from the piezoelectric vibration element arraying jig by the nozzle, the position of the piezoelectric vibration element is shifted, and the element mounting pad of the element mounting member remains in that state. As a result, there is a problem that productivity is reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a piezoelectric vibration element mounting device that shortens the mounting time of the piezoelectric vibration element and improves productivity.

In the piezoelectric vibration element mounting apparatus of the present invention, a first conveying means for moving a piezoelectric vibration element arranging jig in which a plurality of piezoelectric vibration elements are arranged to a predetermined position and stopping at a predetermined position, and an element mounting member are arranged. A second conveying means for moving the element mounting member arrangement jig to a predetermined position and stopping it at the predetermined position, and the piezoelectric vibration element in the piezoelectric vibration element arrangement jig are individually taken out and provided on the element mounting member. Mounting means having a first nozzle and a second nozzle for mounting on the element mounting pad, a piezoelectric vibration element adsorbed by the first nozzle , and a piezoelectric vibration element adsorbed by the second nozzle a first camera for recognizing the door and a second camera for recognizing the device mounting pad provided on the element mounting member, and a recognition unit having, in the image data obtained from said recognition means And a control means for controlling the mounting means in order to obtain a positional deviation width of the piezoelectric vibration element and correct the positional deviation. The mounting means includes the first nozzle and the second nozzle. A first movable portion including an X-direction movable portion that corrects the X-direction of the piezoelectric vibration element adsorbed by the nozzle , a Y-direction movable portion that corrects the Y-direction, and a Z-direction movable portion that corrects the Z-direction. A rotating unit that corrects the θ direction of the piezoelectric vibration element adsorbed by the first nozzle , and a movable rotating unit that corrects the X direction and θ direction of the piezoelectric vibrating element adsorbed by the second nozzle. and a second movable part, is provided with, a distance between the first nozzle and the second nozzle is characterized in that is corrected by the movable rotating portion.

In the piezoelectric vibration element mounting device of the present invention, the piezoelectric vibration element is taken out from the piezoelectric vibration element arrangement jig by the two nozzles of the first nozzle and the second nozzle, and is accommodated in the element mounting member arrangement jig 2. Since it can be mounted on an element mounting pad provided on one element mounting member, the time for mounting the piezoelectric vibration element on the element mounting member can be shortened, and productivity can be improved.
A first camera for recognizing the piezoelectric vibration element adsorbed by the first nozzle and the second nozzle; a second camera for recognizing an element mounting pad provided on the element mounting member; And a control means for controlling the mounting means for correcting the positional deviation by obtaining the positional deviation width of the crystal vibration element from the image data obtained from the recognition means. Since the positional deviation of the vibration element is corrected and mounted on the element mounting pad of the element mounting member, the positional deviation of the piezoelectric vibration element can be prevented, so that productivity can be improved.

  Further, the mounting means includes a first movable part for correcting the X direction, the Y direction, and the Z direction of the first nozzle and the second nozzle, and θ of the first nozzle and the second nozzle. By providing the second movable portion for correcting the direction, it is possible to prevent the nozzle from coming into contact with the element mounting member, and thus it is possible to improve productivity.

It is a disassembled perspective view which shows the piezoelectric vibrator manufactured with the piezoelectric vibration element mounting apparatus concerning embodiment of this invention. It is AA sectional drawing of FIG. It is a perspective view which shows an example of the piezoelectric vibration element mounting apparatus which concerns on embodiment of this invention. It is the elements on larger scale of the piezoelectric vibration element mounting apparatus shown in FIG. It is a top view which shows the 1st image data image | photographed by the recognition means of the piezoelectric vibration element mounting apparatus which concerns on embodiment of this invention. It is a top view which shows the 2nd image data image | photographed by the recognition means of the piezoelectric vibration element mounting apparatus which concerns on embodiment of this invention. It is sectional drawing which shows the 1st nozzle and 2nd nozzle of the mounting means of the piezoelectric vibration element mounting apparatus which concerns on embodiment of this invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
For the sake of clarity, a part of the structure unnecessary for the description is not shown. In addition, some of the illustrated dimensions are exaggerated.

(Piezoelectric vibrator)
The piezoelectric vibrator 100 is mainly composed of an element mounting member 110, a piezoelectric vibration element 120, and a lid member 130. The piezoelectric vibrator 100 has a structure in which a piezoelectric vibration element 120 is mounted in a recessed space K1 formed in the element mounting member 110, and the recessed space K1 is hermetically sealed by a lid member 130.

As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 121.
Such a piezoelectric vibration element 120 includes a pair of elements to be described later formed on an extraction electrode 123 extending from an excitation electrode 122 attached to both main surfaces of the piezoelectric vibration element 120 and an inner bottom surface of a recess space K1 to be described later. The mounting pad P is mounted in the recessed space K1 by being electrically and mechanically connected via the conductive adhesive DS. At this time, the end opposite to the one side on which the extraction electrode 123 is provided is defined as a distal end that is a free end of the piezoelectric vibration element 120.

As shown in FIGS. 1 and 2, the element mounting member 110 is mainly composed of a substrate part 111, a frame part 112, an element mounting pad P, and an external connection electrode terminal G.
In the element mounting member 110, a frame portion 112 is provided on one main surface of the substrate portion 111 to form a recessed space K1.
In addition, the board | substrate part 111 which comprises this element mounting member 110 is formed by laminating | stacking multiple ceramic materials, such as an alumina ceramic and a glass-ceramic, for example. The substrate unit 110a has a structure in which ceramic materials are stacked.
The frame portion 112 uses, for example, a seal ring. In this case, the frame portion 112 is made of a metal such as 42 alloy or Kovar, and has a frame shape with a punched center.
The frame portion 112 is joined to the main surface of the sealing conductor film HM provided so as to surround the outer periphery of one main surface of the substrate portion 111 by brazing or the like.
Two pairs of element mounting pads P are provided on one main surface of the substrate portion 111 exposed in the recessed space K1.
External connection electrode terminals G are provided at the four corners of the other main surface of the substrate portion 111 of the element mounting member 110.
A wiring pattern (not shown) or the like is provided on the inner layer of the substrate unit 110a. With this wiring pattern, the element mounting pad P is connected to the external connection electrode terminal G provided on the other main surface of the substrate portion 110 a of the element mounting member 110.
The element mounting member 110 may be a flat plate. That is, you may comprise by the board | substrate part 110a except the frame part 110b.

The lid member 130 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. Such a lid member 130 hermetically seals the recessed space K1 in a nitrogen gas atmosphere or a vacuum atmosphere. Specifically, the lid member 130 is placed on the frame portion 112 of the element mounting member 110 in a nitrogen atmosphere or a vacuum atmosphere, and a metal on the surface of the frame portion 112 and a part of the metal of the lid member 130. Is welded to the frame portion 112 by applying a predetermined current so as to be welded.
In addition, you may use what formed the recessed part in one main surface of the cover member 130. FIG.

  The conductive adhesive DS contains conductive powder as a conductive filler in a binder such as silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

(Piezoelectric vibration device mounting device)
As shown in FIGS. 3 and 4, the piezoelectric vibration element mounting apparatus 200 moves the first mounting means 210 that moves the piezoelectric vibration element arrangement jig XJ to a predetermined position and the element mounting member arrangement jig TJ. The second conveying means 220 to be stopped at a predetermined position, the mounting means 230 having the first nozzle 231a and the second nozzle 231b, and the piezoelectric material adsorbed by the first nozzle 231a and the second nozzle 231b. A recognition unit 240 having a first camera 241 for recognizing the vibration element 120 and a second camera 242 for recognizing the element mounting pad P provided on the element mounting member 110; A controller 250 for controlling the mounting means 230 in order to obtain a positional deviation width of the piezoelectric vibration element 120 based on the image data obtained from the image data and to correct the positional deviation; It is provided.

Further, as shown in FIGS. 3 and 4, the piezoelectric vibration element mounting apparatus 200 is provided so that the first transport unit 210 and the second transport unit 220 are parallel to each other, and the first transport unit 210. The first camera 241 of the recognition unit 240 is provided between the first conveyance unit 220 and the second conveyance unit 220, and the first guide rail R1 straddles the first conveyance unit H210 and the second conveyance unit 220. The first guide rail R1 is provided with the mounting means 120 and the second camera 242 of the recognition means 240. Further, a second guide rail R2 is provided so that the first transport unit 210 and the second transport unit 220 are parallel to each other, and the first guide rail R1 is provided via a support column PL. .
In this piezoelectric vibration element mounting apparatus 200, the first transporting means 210 and the second transporting direction in which the moving direction of the element mounting member arranging jig TJ, that is, the transporting direction of the second transporting means 220 is parallel to the Y direction. A direction orthogonal to the conveying means 220 is defined as an X direction, and a direction perpendicular to both the X direction and the Y direction is defined as a Z direction. The direction of the angle formed by the intersection of the X-direction axis and the Y-direction axis is the θ direction.

The 1st conveyance means 210 plays the role which moves the piezoelectric vibration element arrangement | sequence jig | tool XJ to a predetermined position.
The piezoelectric vibrating element arrangement jig XJ is placed on the first conveying means 210, and a predetermined row of the concave space K1 of the element mounting member 110 is positioned below the position where the element mounting means 120 described later moves. As described above, the piezoelectric vibration element arranging jig XJ is moved. That is, the piezoelectric vibration element arrangement jig XJ can be transported in the Y direction.

The second transport unit 220 plays a role of moving the element mounting member arranging jig TJ and stopping it at a predetermined position.
For example, the second transport unit 220 can move the element mounting member arrangement jig TJ in the same direction as the first transport unit 210. That is, the element mounting member arrangement jig TJ can be transported in the Y direction. The element mounting member arrangement jig TJ is placed on the second conveying means 220, and the element mounting member arrangement jig is positioned so that the piezoelectric vibration element 120 is positioned below the position where the mounting means 230 described later moves. The tool TJ is moved.

  The piezoelectric vibration element arrangement jig XJ is a jig for aligning the piezoelectric vibration elements 120 on which the excitation electrodes 122 are formed. The element mounting member arrangement jig TJ is a jig for aligning the element mounting members 110.

The mounting means 230 is provided on the first guide rail R1.
The mounting means 230 includes a first nozzle 231a, a second nozzle 231b, a nozzle arrangement portion 232, a first movable portion 233, and a second movable portion 234.
The first movable portion 233 includes an X-direction movable portion 233a, a Y-direction movable portion 233b, and a Z-direction movable portion 233c.
Also. The second movable part 234 includes a rotating part 234a and a movable rotating part 234b.
Further, the mounting means 220 adsorbs the piezoelectric vibration elements 120 arranged in the piezoelectric vibration element arrangement jig XJ and enters the recess space K1 of the element mounting member 110 arranged in the element mounting member arrangement jig TJ. It has a first nozzle 231a and a second nozzle 231b for mounting on the provided element mounting pad P.
The first nozzle 231 a and the second nozzle 231 b are arranged in parallel with the nozzle arrangement part 232 of the mounting means 230. The first nozzle 231a and the second nozzle 231b are connected to a vacuum pump (not shown). When the vacuum pump (not shown) is operated, the first nozzle 231a and the second nozzle 231b Air is sucked from the suction hole KH (see FIG. 7) provided in the second nozzle 231b. Therefore, the piezoelectric vibration elements 120 arranged in the piezoelectric vibration element arrangement jig XJ are adsorbed by the first nozzle 231a and the second nozzle 231b.

  These mounting means 230 can move back and forth in the Z direction, and move in the Z direction when the piezoelectric vibration element 120 is attracted from the piezoelectric vibration element arraying jig XJ and mounted on the element mounting member 110. Further, when moving to the element mounting member 110 and newly attracting the piezoelectric vibration element 120, it moves in the X direction.

The first nozzle 231a is disposed at the tip of the nozzle arrangement portion 232 so as to face the piezoelectric vibration elements 120 arranged in the piezoelectric vibration element arrangement jig XJ. In addition, the first nozzle 231a includes an X-direction movable portion 233a, a Y-direction movable portion 233b, a Z-direction movable portion 233c, and a rotating portion 234a (see FIG. 4). , Θ can be operated.
The second nozzle 231b is arranged at the tip of the nozzle arrangement part 232 in parallel with the first nozzle 231a. Further, the second nozzle 231b has an X direction, a Y direction, and a Z direction by an X direction movable portion 233a, a Y direction movable portion 233b, a Z direction movable portion 233c, and a movable rotating portion 234b (see FIG. 4). It is possible to operate in the direction θ direction.

By doing so, the mounting means 230 simultaneously adsorbs two piezoelectric vibration elements 120 aligned in the X direction to the piezoelectric vibration element arraying jig XJ and is provided in the concave space K1 of the element mounting member 110. It is mounted on the element mounting pad P.
A conductive adhesive DS is attached to the element mounting pad P. Therefore, the mounting means 230 places the piezoelectric vibration element 120 on the conductive adhesive DS on the element mounting pad P. Thereby, the piezoelectric vibration element 120 can be mounted on the element mounting member 110.

The recognition unit 240 includes a first camera 241 and a second camera 242.
The first camera 241 is provided between the first transport unit 110 and the second transport unit 120. That is, the first camera 241 is provided between the piezoelectric vibration element arrangement jig XJ and the element mounting member arrangement jig TJ. As shown in FIG. 4, the first camera 241 is photographed to obtain first image data indicating the position state of the piezoelectric vibrating elements 120a and 120b adsorbed to the first nozzle 231a and the second nozzle 231b. Is to do. Thereby, the positional deviations of the piezoelectric vibration elements 120a and 120b in the X direction, Y direction, and θ direction are acquired as numerical data from the first image data.
The second camera 231b is provided so that photographing can be performed from the concave space K1 side of the element mounting member 110 arranged in the element mounting member arrangement jig TJ. Further, as shown in FIG. 5, when the second camera 231b is arranged on the element mounting member arrangement jig TJ, the center point C1 of one of the two element mounting members 110a and the other element mounting are arranged. This is for photographing the second image data indicating the state of the distance W1 from the central axis C2 of the member 110b.
Further, the second camera 242 can move so as not to collide with the mounting unit 230 after the second image data is captured.
The first image data and the second image data captured by the first camera 241 and the second camera 242 are stored in the storage unit 250.

  The storage unit 250 plays a role of storing first image data obtained from the first camera 241 of the recognition unit 240 and second image data obtained from the second camera 242.

The control unit 260 is configured by a computer and is connected to the mounting unit 120, the recognition unit 240, and the storage unit 250. The control means 260 controls the entire piezoelectric vibration element mounting apparatus 200.
That is, the control means 260 obtains numerical data from the first image data and the second image data obtained from the recognition means 240, and based on the numerical data, the first nozzle 231a of the mounting means 230 It plays a role of controlling so as to correct the positional deviation of the second nozzle 231b.

In the X direction, as shown in FIGS. 6 and 7, the control means 260 is one of the two adjacent elements arranged in the element mounting member arrangement jig TJ recognized by the second image data. The interval WN1 between the first nozzle 231a and the second nozzle 231b is corrected in accordance with the interval W1 between the center point C1 of the mounting member 110a and the center point C2 of the other element mounting member 110b.
The interval WN1 between the first nozzle 231a and the second nozzle 231b can be corrected at an interval of 4 to 13 mm, for example, by the movable rotating portion 234b (see FIG. 4).
The X-direction movable unit 233a, the Y-direction movable unit 233b, the Z-direction movable unit 233c, the rotation unit 234a, and the movable rotation unit 234b are configured to include, for example, a motor.

As shown in FIG. 5A, the control unit 260 obtains the center point CP1a of the first nozzle 231a from the first image data, passes through the center point CP1a, and is in the longitudinal direction of the piezoelectric vibration element 120a. The axis line JS1 is obtained so as to be parallel to the side. A positional deviation angle θ1 between the axis line JS1 and the axis line JS2 passing through the center point CP1a is obtained.
Similarly, as shown in FIG. 5A, the center point CP1b of the second nozzle 231b is obtained from the first image data, passes through the center point CP1b, and the side in the longitudinal direction of the piezoelectric vibration element 120b. An axis JS1 that is parallel is obtained. A misalignment angle θ2 between the axis JS1 and the axis JS2 passing through the center point CP1b is obtained.

As shown in FIG. 5B, the first nozzle 231a is rotated by the misalignment angle θ1 by the rotation unit 234a so that the axis JS1 of the first nozzle 231a overlaps the axis JS2.
As shown in FIG. 5B, the movable nozzle 234b rotates the second nozzle 231b by the misalignment angle θ2 so that the axis JS1 of the second nozzle 231b overlaps the axis JS2.

As shown in FIG. 5B, the center point CP2a of the piezoelectric vibration element 120a is obtained from the first image data, and the X axis between the center point CP1a of the first nozzle 231a and the center point CP2a of the piezoelectric vibration element 120a. A positional deviation width ΔX1 in the direction and a positional deviation width ΔY1 in the Y-axis direction are obtained.
Further, as shown in FIG. 5B, the center point CP2b of the piezoelectric vibration element 120b is obtained from the first image data, and the center point CP1b of the second nozzle 231b and the center point CP2b of the piezoelectric vibration element 120b are obtained. A positional deviation width ΔX2 in the X-axis direction and a positional deviation width ΔY2 in the Y-axis direction are obtained.

  The obtained positional deviation width ΔX1 of the first nozzle 231a in the X-axis direction, the positional deviation width ΔY1 of the first nozzle 231a in the Y-axis direction, and the positional deviation width Δ of the second nozzle 231b in the X-axis direction. X2, the displacement width ΔY2 of the second nozzle 231b in the Y-axis direction is stored in the storage unit 250, and the first nozzle 231a and the second nozzle 231b are moved to thereby move the piezoelectric vibration elements 120a and 120b. The amount of misalignment is corrected.

In the piezoelectric vibration element mounting apparatus 200 of the present invention, the two piezoelectric vibration elements 120a and 120b are taken out from the piezoelectric vibration element arrangement jig XJ by the first nozzle 231a and the second nozzle 231b, and the element mounting member arrangement jig TJ is extracted. Since it can be mounted on the element mounting pad P in the recessed space K1 of the two element mounting members 110a and 110b accommodated in the element mounting time, the time for mounting the piezoelectric vibration element 120 on the element mounting member 110 can be shortened. It becomes possible to improve productivity.
The piezoelectric vibration element mounting apparatus 200 of the present invention is provided on the element mounting member 110 and the first camera 241 for recognizing the piezoelectric vibration element 120 adsorbed by the first nozzle 231a and the second nozzle 231b. The recognition unit 230 having the second camera 242 for recognizing the received element mounting pad P, and the image data obtained from the recognition unit 240 determine the positional deviation width of the crystal resonator element 120, and the positional deviation is determined. And the control means 260 for controlling the mounting means 230 to correct the positional deviation of the piezoelectric vibration element 120 and mount it on the element mounting pad P of the element mounting member 110. Since displacement of the element 120 can be prevented, productivity can be improved.
The mounting means 230 includes a first movable portion 233 for correcting the X direction, the Y direction, and the Z direction of the first nozzle 231a and the second nozzle 231b, the first nozzle 231a, and the first nozzle 231a. By providing the second movable portion 234 for correcting the X direction and the θ direction of the two nozzles 231b, the element mounting members 110a and 110b have two first nozzles 231a and second nozzles 231b. Therefore, it is possible to improve productivity.

  The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

210: First conveying means 220: Second conveying means 230: Mounting means 231a: First nozzle 231b: Second nozzle 232: Nozzle arrangement portion 233 -1st movable part 233a ... X direction movable part 233b ... Y direction movable part 233c ... Z direction movable part 234 ... 2nd movable part 234a ... Turning part 234b ... Movable rotating part 240 ... recognition means 241 ... first camera 242 ... second camera 250 ... storage part 260 ... control means 200 ... piezoelectric vibration element mounting apparatus R1. First guideline R2 ... second guideline PL ... post XJ ... piezoelectric vibration element arrangement jig 120, 120a, 120b ... piezoelectric vibration element TJ ... element mounting member arrangement jig 110 110a, 1 DESCRIPTION OF SYMBOLS 10b ... Element mounting member 111 ... Substrate part 112 ... Frame part K1 ... Recessed space P ... Element mounting pad G ... External connection electrode terminal DS ... Conductive adhesive 130 ... Lid member 100 ... Piezoelectric vibrator

Claims (1)

First conveying means for moving a piezoelectric vibrating element arrangement jig, in which a plurality of piezoelectric vibrating elements are arranged, to a predetermined position and stopping at a predetermined position;
A second conveying means for moving the element mounting member arrangement jig in which the element mounting members are arranged to a predetermined position and stopping at a predetermined position;
Mounting means having a first nozzle and a second nozzle for individually taking out the piezoelectric vibration elements in the piezoelectric vibration element arraying jig and mounting them on an element mounting pad provided on the element mounting member;
Recognition and first camera for recognizing the piezoelectric vibrating elements adsorbed, the element mounting pad provided on the element mounting member by the second nozzle and the piezoelectric vibrating element which is adsorbed by the first nozzle A recognizing means having a second camera for
A control means for obtaining a positional deviation width of the piezoelectric vibration element from the image data obtained from the recognition means and controlling the mounting means to correct the positional deviation;
With
The mounting means includes an X direction movable portion that corrects the X direction of the piezoelectric vibration element adsorbed by the first nozzle and the second nozzle , a Y direction movable portion that corrects the Y direction, and a Z direction. A first movable part having a Z-direction movable part for correcting
A rotation unit that corrects the θ direction of the piezoelectric vibration element adsorbed by the first nozzle and a movable rotation unit that corrects the X direction and θ direction of the piezoelectric vibration element adsorbed by the second nozzle . Two movable parts;
Is provided ,
The piezoelectric vibration element mounting device , wherein an interval between the first nozzle and the second nozzle is corrected by the movable rotating portion .

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