JP2016208286A - Piezoelectric element mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric element mounting apparatus capable of stably applying a conductive adhesive on electrode pads and improving productivity.SOLUTION: The piezoelectric element mounting apparatus includes a holding base TA for holding a package arranging jig PJ in which packages are arranged, coating means TS having a first nozzle NZ1 and a second nozzle NZ2 for applying a conductive adhesive to electrode pads provided on the package, recognition means NS having a camera unit CA for recognizing electrode pads, mounting means JS having a third nozzle NZ3 and a fourth nozzle NZ4 for mounting the piezoelectric element 120 on the electrode pad, cleaning means CS for cleaning the space between the first nozzle NZ1 and the second nozzle NZ2, and control means SS for controlling the coating means TS and mounting means JS according to information obtained from the camera unit CA and for moving the cleaning means CS.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a piezoelectric element mounting apparatus for mounting a piezoelectric element on a package.

  A conventional piezoelectric element mounting apparatus is an apparatus for mounting a piezoelectric element on an element mounting pad of a package. The piezoelectric element mounting apparatus includes an application unit, a recognition unit, a mounting unit, and a control unit. The applying means is for applying a conductive adhesive to the electrode pad of the package by the first nozzle and the second nozzle. The recognizing means includes a camera, and is for recognizing the electrode pad of the package accommodated in the piezoelectric element or the package arranging jig by the camera. The mounting means is for mounting the piezoelectric element on the electrode pad of the package by the third nozzle and the fourth nozzle. The control means is for controlling the coating means and the mounting means based on information obtained from the recognition means. Such a piezoelectric element mounting apparatus is known (for example, refer to Patent Document 1).

JP 2011-114775 A

  In such a piezoelectric element mounting apparatus, the distance between the electrode pads of the package becomes narrow when dealing with a miniaturized crystal resonator, and the distance between the first nozzle and the second nozzle is reduced by accommodating the electrode pads. It gets narrower. When the first nozzle and the second nozzle are used repeatedly, the conductive adhesive discharged from the first nozzle may be connected to the conductive adhesive discharged from the second nozzle. In addition, since the conductive adhesive discharged from the first nozzle and the conductive adhesive discharged from the second nozzle are connected, the conductive adhesive cannot be stably applied on the electrode pad. There was a risk of lowering.

  The present invention has been made in view of the above problems, and provides a piezoelectric element mounting apparatus that can stably apply a conductive adhesive onto an electrode pad and can improve productivity. Objective.

  The piezoelectric element mounting apparatus of the present invention includes a holding base for holding an arrangement jig in which packages are arranged, and a first nozzle and a second nozzle for applying a conductive adhesive to electrode pads provided on the package. A coating means, a recognition means having a camera unit for recognizing the electrode pad, a mounting means having a third nozzle and a fourth nozzle for mounting the piezoelectric element on the electrode pad, a first nozzle and a second nozzle And a control unit for moving the cleaning unit as well as controlling the coating unit and the mounting unit based on information obtained from the camera unit. It is.

  A piezoelectric element mounting apparatus according to the present invention includes a holding base for holding a package arranging jig in which packages are arranged, and a first nozzle and a second nozzle for applying a conductive adhesive to electrode pads provided on the package. A coating unit having a camera unit for recognizing the electrode pad, a mounting unit having a third nozzle and a fourth nozzle for mounting the piezoelectric element on the electrode pad, a first nozzle and a second A cleaning unit for cleaning the space between the nozzles, a control unit for controlling the coating unit and the mounting unit based on information obtained from the camera unit, and for moving the cleaning unit. By doing in this way, even if the conductive adhesive discharged from the first nozzle and the conductive adhesive discharged from the second nozzle overflow, the cleaning means causes a gap between the first nozzle and the second nozzle. Since the conductive adhesive can be removed, the connection between the conductive adhesive discharged from the first nozzle and the conductive adhesive discharged from the second nozzle can be reduced. Therefore, since the conductive adhesive discharged from the first nozzle and the conductive adhesive discharged from the second nozzle are not connected, the conductive adhesive can be stably applied on the electrode pad, and productivity is improved. Can be made.

It is a disassembled perspective view which shows the piezoelectric device manufactured with the piezoelectric element mounting apparatus which concerns on this embodiment. It is AA sectional drawing of FIG. It is a perspective view which shows the piezoelectric element mounting apparatus which concerns on this embodiment. It is a perspective view which shows the application means of the piezoelectric element mounting apparatus which concerns on the 1st modification of this embodiment. It is sectional drawing which shows the application means of the piezoelectric element mounting apparatus which concerns on the 1st modification of this embodiment.

(Piezoelectric device)
The piezoelectric device in this embodiment includes a package 110 and a piezoelectric element 120 joined to the package 110 as shown in FIGS. 1 and 2. The package 110 has a recessed space K surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. Such a piezoelectric device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the piezoelectric element 120 mounted on the upper surface. A pair of electrode pads 111 for mounting the piezoelectric element 120 is provided on the upper surface of the substrate 110a.

In addition, external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Further, two of the four external terminals 112 are electrically connected to the piezoelectric element 120. In addition, the pair of external terminals 112 that are electrically connected to the piezoelectric element 120 are provided to be positioned diagonally on the lower surface of the substrate 110a.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern (not shown) for electrically connecting the electrode pads 111 provided on the upper surface of the frame 110b and the external terminals 112 provided on the lower surface of the substrate 110a on the surface and inside of the substrate 110a. And via conductors (not shown).

  The frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the recess K on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  The electrode pad 111 is for mounting the piezoelectric element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the inner periphery of the substrate 110a inside the frame 110b.

  The external terminal 112 is used for bonding to a mounting pad (not shown) on an external mounting substrate such as an electric device. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. At least one of the external terminals 112 is electrically connected to the sealing conductor pattern 113 via a via conductor (not shown). In addition, at least one of the external terminals 112 is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting substrate such as an electronic device. Thereby, the lid 130 bonded to the sealing conductor pattern 113 is connected to the external terminal 112 having the ground potential. Therefore, the shielding performance in the recess K by the lid 130 is improved.

  The sealing conductor pattern 113 plays a role of improving the wettability of the bonding member 131 when bonded to the lid 130 via the bonding member 131. The sealing conductor pattern 113 is electrically connected to at least one of the external terminals 112 via a via conductor (not shown). The sealing conductor pattern 113 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of, for example, tungsten or molybdenum so as to surround the upper surface of the frame 110b in an annular shape. Has been.

  Here, a method for manufacturing the substrate 110a and the frame 110b will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, it is produced by applying nickel plating, gold plating, silver palladium, or the like to predetermined portions of the conductor pattern, specifically, the portions to be the electrode pads 111, the external terminals 112, and the sealing conductor pattern 113. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 1 and 2, the piezoelectric element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The piezoelectric element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 2, the piezoelectric element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the piezoelectric element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is between the upper surface of the substrate 110a. The piezoelectric element 120 is fixed on the substrate 110a by a cantilevered support structure with a free end.

  Here, the operation of the piezoelectric element 120 will be described. In the piezoelectric element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a method for manufacturing the piezoelectric element 120 will be described. First, the piezoelectric element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The piezoelectric element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the quartz base plate 121 by photolithography, vapor deposition, or sputtering. Is done.

The lid 130 is
For example, it consists of Fe-Ni alloy (42 alloy), Fe-Ni-Co alloy (Kovar), etc. Such a lid 130 is hermetically sealed in the recessed space K in a nitrogen gas atmosphere or a vacuum atmosphere. Specifically, the lid 130 is placed on the frame 110b of the package 110 in a nitrogen atmosphere or a vacuum atmosphere, and the surface of the sealing conductor pattern 113 provided on the upper surface of the frame 110b and the lid The seam welding is performed by applying a predetermined current so that the joining member 131 of the body 130 is melted, thereby joining the frame body 110b.

(Applicator)
As shown in FIG. 3, the coating apparatus includes a holding table TA for arranging the package arranging jig PJ and the element arranging jig XJ, and a first nozzle NZ1 and a second nozzle for applying the conductive adhesive 140. Coating means TS having NZ2, a camera part CA for recognizing the position of the electrode pad 111 or the conductive adhesive 140, and an irradiation part for irradiating the electrode pad 111 or the conductive adhesive 140 with laser light ( A recognition unit NS having a laser part LB including a light receiving part (not shown) for receiving reflected light of a laser beam and a piezoelectric element 120 are mounted on the conductive adhesive 140. The positional deviation of the electrode pad 111 or the conductive adhesive 140 is corrected by the mounting means JS having the third nozzle NZ3 and the fourth nozzle NZ4 and the image data obtained from the camera unit CA. And and a control unit SS for controlling the applying means TS in order.

  In addition, as shown in FIG. 3, the coating device is provided with a first guide rail R1 via a support column PL provided on a holding table TA. The first guide rail R1 includes a coating means TS, a recognition unit. Means NS and mounting means JS are provided. Further, a second guide rail R2 is provided so as to be orthogonal to the first guide rail R1, and the first guide rail R1 is provided via a support column PL. In this coating apparatus, the moving direction of the package arranging jig PJ, that is, the direction parallel to the long side of the second guide rail R2 is the Y direction, and the direction orthogonal to the parallel second guide rail R2 is the X direction. The direction perpendicular to both the X direction and the Y direction is taken as the Z direction. The direction of the angle formed by the intersection of the X-direction axis and the Y-direction axis is the θ direction.

  The application means TS is provided on the first guide rail R1. The application unit TS includes a first nozzle NZ1, a second nozzle NZ2, a first arrangement portion HB1, and a first movable portion (not shown). In addition, the first movable portion is configured by an X-direction movable portion KB11, a Y-direction movable portion KB12, and a Z-direction movable portion KB13. The application unit TS includes a first nozzle NZ1 and a second nozzle NZ2 for applying the conductive adhesive 140 to the electrode pads 111 of the package 110 arranged in the package arrangement jig PJ. The first nozzle NZ1 and the second nozzle NZ2 are arranged in parallel to the first arrangement part HB1 of the coating means TS.

  These application means TS can move back and forth in the Z direction, and move in the Z direction when the conductive adhesive 140 is applied to the package 110 of the package arranging jig PJ. Further, when moving to the package 110, it moves in the X direction.

  The first nozzle NZ1 and the second nozzle NZ2 are respectively arranged so as to face the package 110 arranged on the package arrangement jig PJ and in parallel with the front end portion of the first arrangement portion HB1. By doing so, the coating means TS applies the conductive adhesive 140 and the solvent 150 to the electrode pads 111 provided in the recessed spaces K of the plurality of packages 110 aligned in the X direction with the package arrangement jig PJ. Apply.

  The recognition means NS is provided in the first guide rail R1. The recognition unit NS includes a camera unit CA, a laser unit LB, a second arrangement unit HB2, and a second movable unit (not shown). The camera unit CA photographs the image data of the electrode pad 111 of one of the two adjacent packages 110 and the conductive adhesive 140 applied on the electrode pad 111 when arranged on the package arrangement jig PJ. Is to do. Further, the recognition unit NS can move so as not to collide with the coating unit TS and the mounting unit JS after taking the image data. Image data photographed by the camera unit CA is stored in the storage unit ME.

  The laser unit LB includes a laser irradiation unit (not shown) and a light receiving unit (not shown). The laser irradiation unit irradiates laser light toward an object. The laser beam reflected from the object is received and the wavelength is recognized. The wavelength when the electrode pad 111 for each package 110 arranged in the package arrangement jig PJ is irradiated with a laser beam and received is stored in the storage unit ME. Next, after applying to the conductive adhesive 140 by the applying means TS, the wavelength when the conductive adhesive 140 is irradiated with a laser beam and received is stored in the storage unit ME. The vertical direction of the conductive adhesive 140 depends on the difference between the wavelength when the electrode pad 111 of the package 110 stored in the storage unit ME is irradiated and received and the wavelength when the conductive adhesive 140 is irradiated with laser light and received. Can be confirmed.

  Further, the second movable part is configured by an X-direction movable part KB21, a Y-direction movable part KB22, and a Z-direction movable part KB23. The camera unit CA and the laser unit LB are arranged in parallel with the second arrangement unit HB2 of the recognition unit NS.

  The mounting means JS is provided on the first guide rail R1. The mounting means JS includes a third nozzle NZ3, a fourth nozzle NZ4, a third arrangement portion HB3, and a third movable portion (not shown). Further, the third movable part is configured by an X-direction movable part KB31, a Y-direction movable part KB32, and a Z-direction movable part KB33. The mounting means JS includes a third nozzle NZ3 and a fourth nozzle for mounting the piezoelectric element 120 on the conductive adhesive 140 applied to the electrode pads 111 of the package 110 arranged in the package arrangement jig PJ. NZ4 is provided. The third nozzle NZ3 and the fourth nozzle NZ4 are arranged in parallel with the third arrangement part HB3 of the mounting means JS.

  The third nozzle NZ3 and the fourth nozzle NZ4 are arranged in parallel with the third arrangement part HB3 of the mounting means JS. The third nozzle NZ3 and the fourth nozzle NZ4 are connected to a vacuum pump (not shown), and the suction holes provided in the third nozzle NZ3 and the fourth nozzle NZ4 by operating the vacuum pump. Air is drawn from (not shown). Therefore, the piezoelectric elements 120 arranged in the element arrangement jig XJ are adsorbed by the third nozzle NZ3 and the fourth nozzle NZ4.

  These mounting means JS can move back and forth in the Z direction, and move in the Z direction when the piezoelectric element 120 is attracted from the element arranging jig XJ and mounted on the package 110. Further, when moving to the package 110 and newly attracting the piezoelectric element 120, it moves in the X direction.

  The third nozzle NZ3 and the fourth nozzle NZ4 move to positions facing the piezoelectric elements 120 arranged in the element arrangement jig XJ. Next, the third nozzle NZ3 and the fourth nozzle NZ4 simultaneously adsorb two of the plurality of piezoelectric elements 120 aligned in the X direction to the element arrangement jig XJ. Finally, the third nozzle NZ3 and the fourth nozzle NZ4 move to positions facing the conductive adhesive 140 applied to the electrode pads 111 of the package 110 aligned with the package alignment jig PJ, and the conductive adhesive 140 The piezoelectric element 120 is mounted thereon.

  The cleaning means CS is provided on the holding table TA. The cleaning means CS includes a wire part WB and a drive part KB4 for moving the wire part WB. The wire part WB is constituted by the wire part WB, and is for wiping away the conductive adhesive 140 overflowing between the first nozzle NZ1 and the second nozzle NZ2. The drive unit KB4 can reliably wipe off the conductive adhesive 140 overflowing between the first nozzle NZ1 and the second nozzle NZ2 by rotating the wire unit WB in the Y-axis direction. Therefore, it is possible to reduce the connection between the conductive adhesive 140 discharged from the first nozzle NZ1 and the conductive adhesive 140 discharged from the second nozzle NZ2. Since the conductive adhesive 140 is not connected, the conductive adhesive 140 can be stably applied onto the electrode pad 111, and productivity can be improved.

  Moreover, the wire part WB is formed of a metal wire or the like. The conductive adhesive 140 overflowing between the first nozzle NZ1 and the second nozzle NZ2 adheres to the wire portion WB. Further, a removal part (not shown) for removing the conductive adhesive from the wire part WB may be provided so as to be disposed at a position in contact with the conductive adhesive 140 attached to the wire part WB. I do not care. By providing this removal portion, it is possible to remove the conductive adhesive 140 attached to the wire portion WB, and to reduce reattachment from the wire portion WB to the first nozzle NZ1 or the second nozzle NZ2. be able to.

  The control means SS is constituted by a computer and is connected to the application means TS, the recognition means NS, and the storage unit ME. The control means SS controls the entire piezoelectric element mounting apparatus. That is, the control unit SS obtains numerical data from the image data obtained from the recognition unit NS, and based on the numerical data, the first nozzle NZ1 and the second nozzle NZ2 of the coating unit TS and the third nozzle NZ3 of the mounting unit JS. And it plays the role of controlling to correct the positional deviation of the fourth nozzle NZ4.

  The piezoelectric element mounting apparatus according to the present embodiment is for applying a conductive adhesive 140 to a holding table TA for holding a package arranging jig PJ in which packages 110 are arranged and an electrode pad 111 provided on the package 110. A coating unit TS having a first nozzle NZ1 and a second nozzle NZ2, a recognition unit NS having a camera unit CA for recognizing the electrode pad 111, and a third nozzle NZ3 for mounting the piezoelectric element 120 on the electrode pad 111 And the mounting means JS having the fourth nozzle NZ4, the cleaning means CS for cleaning the space between the first nozzle NZ1 and the second nozzle NZ2, and the coating means TS and the mounting means JS according to the information obtained from the camera unit CA. A control unit SS for controlling and moving the cleaning means CS is provided. By doing in this way, even if the conductive adhesive 140 discharged from the first nozzle NZ1 and the conductive adhesive 140 discharged from the second nozzle NZ2 overflow, the cleaning means CS causes the first nozzle NZ1 and the first nozzle NZ1 to overflow. Since the conductive adhesive 140 between the two nozzles NZ2 can be removed, the conductive adhesive 140 discharged from the first nozzle NZ1 and the conductive adhesive 140 discharged from the second nozzle NZ2 are connected. Can be reduced. Therefore, since the conductive adhesive 140 discharged from the first nozzle NZ1 and the conductive adhesive 140 discharged from the second nozzle NZ2 are not connected, the conductive adhesive 140 can be stably applied onto the electrode pad 111. And productivity can be improved.

  In the piezoelectric element mounting apparatus according to the present embodiment, the cleaning means CS includes a wire part WB and a drive part KB4 for moving the wire part WB. Even if the space between the first nozzle NZ1 and the second nozzle NZ2 is changed between the electrode pads 111 provided in the package, it can be dealt with by replacing with a wire portion WB having a different width in the X-axis direction. Therefore, when manufacturing a piezoelectric device, productivity can be improved.

  In the piezoelectric element mounting apparatus according to the present embodiment, the recognition unit NS is irradiated with laser light on the upper surface of the electrode pad 111 and the upper surface of the conductive adhesive 140, and the thickness of the conductive adhesive 140 is increased by the difference in the wavelength of the reflected light. A laser unit LB for checking is provided. By checking the thickness in the vertical direction of the conductive adhesive 140 in this way, it can be confirmed that the thickness in the vertical direction of the conductive adhesive 140 provided on the pair of electrode pads 111 is uniform. When the piezoelectric element 120 is mounted, it is possible to reduce the inclination of the piezoelectric element 120 in the long side direction.

(First modification)
Hereinafter, the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same parts as those of the above-described piezoelectric element mounting apparatus are denoted by the same reference numerals, and description thereof is omitted as appropriate. In the piezoelectric element mounting apparatus according to the first modification of the present embodiment, as shown in FIGS. 4 and 5, the wire portion WB is always positioned between the first nozzle NZ1 and the second nozzle NZ2. It differs from this embodiment in the point provided in.

  The wire part WB of the cleaning means CS is provided so as to be always located between the first nozzle NZ1 and the second nozzle NZ2. The wire part WB is arranged so as to rotate in the Z-axis direction. By doing in this way, since the wire part WB removes the conductive adhesive 140 overflowing between the first nozzle NZ1 and the second nozzle NZ2, the conductive adhesive 140 is more effective than the present embodiment. Since it is not further connected, the conductive adhesive 140 can be applied very stably on the electrode pad 111, and productivity can be further improved. Moreover, by doing in this way, the application means TS is moved according to the wire part WB of the cleaning means CS, and the time for adjusting the wire part WB to be located between the first nozzle NZ1 and the second nozzle NZ2. Therefore, productivity can be improved.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. A piezoelectric element may be used.

  In the above embodiment, the case where the piezoelectric element 120 uses an AT crystal element has been described. However, a tuning fork type bending having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base is described. A crystal element may be used. The piezoelectric element includes a crystal piece, an excitation electrode provided on the surface of the crystal piece, an extraction electrode, and a frequency adjusting metal film. The crystal piece includes a crystal base portion and a crystal vibration portion, and the crystal vibration portion includes a first crystal vibration portion and a second crystal vibration portion. The crystal base has an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis as the crystal axis direction, within a range of −5 ° to + 5 ° around the X axis. This is a flat plate having a substantially rectangular shape in a plan view in which the direction of the rotated Z ′ axis is the thickness direction. The first crystal vibrating part and the second crystal vibrating part are extended in parallel with the Y′-axis direction from one side of the crystal base part. Such a crystal piece has a tuning fork shape in which a crystal base and each crystal vibration part are integrated, and is manufactured by a photolithography technique and a chemical etching technique.

DESCRIPTION OF SYMBOLS 110 ... Package 110a ... Board | substrate 110b ... Frame part 111 ... Electrode pad 112 ... External terminal 120 ... Piezoelectric element 121 ... Piezoelectric base plate 122 ... Excitation electrode 123 ... .. Extraction electrode 130 ... Lid 131 ... Joining member 140 ... Conductive adhesive NZ1 ... First nozzle NZ2 ... Second nozzle NZ3 ... Third nozzle NZ4 ... No. Four nozzles CA ... Camera unit LB ... Laser unit WB ... Wire unit TS ... Coating unit NS ... Recognizing unit JS ... Mounting unit CS ... Cleaning unit K ... Recessed space

Claims (4)

A holding stand for holding the arrangement jig in which the packages are arranged;
An application means having a first nozzle and a second nozzle for applying a conductive adhesive to an electrode pad provided in the package;
Recognizing means having a camera unit for recognizing an electrode pad;
A mounting means having a third nozzle and a fourth nozzle for mounting the piezoelectric element on the electrode pad;
A cleaning means for cleaning between the first nozzle and the second nozzle;
A piezoelectric element mounting apparatus comprising: a control unit that controls the coating unit and the mounting unit according to information obtained from the camera unit, and moves the cleaning unit. The piezoelectric element mounting apparatus according to claim 1,
The piezoelectric element mounting apparatus, wherein the cleaning means includes a wire part and a drive part for moving the wire part. The piezoelectric element mounting apparatus according to claim 2,
The piezoelectric element mounting apparatus, wherein the wire portion is provided between the first nozzle and the second nozzle. The piezoelectric element mounting apparatus according to claim 1,
The recognizing means includes a laser unit for irradiating the upper surface of the electrode pad and the upper surface of the conductive adhesive with a laser beam and confirming the thickness of the conductive adhesive based on a difference in wavelength of reflected light. A piezoelectric element mounting apparatus characterized by comprising:

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