JPWO2023276850A1 - - Google Patents
Info
- Publication number
- JPWO2023276850A1 JPWO2023276850A1 JP2023531879A JP2023531879A JPWO2023276850A1 JP WO2023276850 A1 JPWO2023276850 A1 JP WO2023276850A1 JP 2023531879 A JP2023531879 A JP 2023531879A JP 2023531879 A JP2023531879 A JP 2023531879A JP WO2023276850 A1 JPWO2023276850 A1 JP WO2023276850A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021107836 | 2021-06-29 | ||
PCT/JP2022/025115 WO2023276850A1 (en) | 2021-06-29 | 2022-06-23 | Piezoelectric vibration device manufacturing apparatus and piezoelectric vibration device manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023276850A1 true JPWO2023276850A1 (en) | 2023-01-05 |
JPWO2023276850A5 JPWO2023276850A5 (en) | 2023-11-22 |
Family
ID=84691302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023531879A Pending JPWO2023276850A1 (en) | 2021-06-29 | 2022-06-23 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023276850A1 (en) |
CN (1) | CN116964932A (en) |
TW (1) | TWI823447B (en) |
WO (1) | WO2023276850A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5184142B2 (en) * | 2008-02-26 | 2013-04-17 | セイコーインスツル株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic device, radio timepiece, and method of manufacturing piezoelectric vibrating piece |
JP5654745B2 (en) * | 2009-11-30 | 2015-01-14 | 京セラクリスタルデバイス株式会社 | Piezoelectric vibration element mounting device |
JP2012099560A (en) * | 2010-10-29 | 2012-05-24 | Kyocera Kinseki Corp | Element component mounting apparatus |
JP5845546B1 (en) * | 2014-10-31 | 2016-01-20 | アキム株式会社 | Conveying apparatus, assembling apparatus and assembling method |
JP6502666B2 (en) * | 2014-12-26 | 2019-04-17 | 京セラ株式会社 | Piezoelectric device and method of manufacturing the same |
-
2022
- 2022-06-23 JP JP2023531879A patent/JPWO2023276850A1/ja active Pending
- 2022-06-23 CN CN202280019601.XA patent/CN116964932A/en active Pending
- 2022-06-23 WO PCT/JP2022/025115 patent/WO2023276850A1/en active Application Filing
- 2022-06-28 TW TW111124121A patent/TWI823447B/en active
Also Published As
Publication number | Publication date |
---|---|
TW202310082A (en) | 2023-03-01 |
CN116964932A (en) | 2023-10-27 |
TWI823447B (en) | 2023-11-21 |
WO2023276850A1 (en) | 2023-01-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230821 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230821 |