JPS60238487A - 金属条材の表面処理方法 - Google Patents

金属条材の表面処理方法

Info

Publication number
JPS60238487A
JPS60238487A JP59096075A JP9607584A JPS60238487A JP S60238487 A JPS60238487 A JP S60238487A JP 59096075 A JP59096075 A JP 59096075A JP 9607584 A JP9607584 A JP 9607584A JP S60238487 A JPS60238487 A JP S60238487A
Authority
JP
Japan
Prior art keywords
mixture
metal
strip
wire rod
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59096075A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0362797B2 (enExample
Inventor
Hajime Sasaki
元 佐々木
Shinichi Nishiyama
西山　進一
Hajime Abe
元 阿部
Kuniaki Seki
関　邦彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP59096075A priority Critical patent/JPS60238487A/ja
Publication of JPS60238487A publication Critical patent/JPS60238487A/ja
Publication of JPH0362797B2 publication Critical patent/JPH0362797B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP59096075A 1984-05-14 1984-05-14 金属条材の表面処理方法 Granted JPS60238487A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59096075A JPS60238487A (ja) 1984-05-14 1984-05-14 金属条材の表面処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59096075A JPS60238487A (ja) 1984-05-14 1984-05-14 金属条材の表面処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP27746485A Division JPS61179880A (ja) 1985-12-10 1985-12-10 ラジエ−タ用フイン材の製造方法

Publications (2)

Publication Number Publication Date
JPS60238487A true JPS60238487A (ja) 1985-11-27
JPH0362797B2 JPH0362797B2 (enExample) 1991-09-27

Family

ID=14155279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59096075A Granted JPS60238487A (ja) 1984-05-14 1984-05-14 金属条材の表面処理方法

Country Status (1)

Country Link
JP (1) JPS60238487A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892141A (en) * 1986-07-28 1990-01-09 The Furukawa Electric Co., Ltd. Fin of heat exchanger and method of making it
JP2006299408A (ja) * 2005-03-24 2006-11-02 Nippon Steel Corp 金属帯板のめっき方法
WO2012128025A1 (ja) * 2011-03-24 2012-09-27 日本碍子株式会社 Ｃｕ薄板処理方法
USRE45987E1 (en) 2003-09-11 2016-04-26 Renesas Electronics Coporation Electronic component and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49106920A (enExample) * 1973-02-17 1974-10-11
JPS5121377A (ja) * 1974-08-14 1976-02-20 Hitachi Ltd Hodento
JPS54137439A (en) * 1978-04-18 1979-10-25 Minoru Isono Formation of hardened layer on metal surface
JPS54147135A (en) * 1978-05-12 1979-11-17 Minoru Isono Formation of saw teeth hard quality chips and apparatus therefor
JPS5638456A (en) * 1979-09-04 1981-04-13 Senjiyu Kinzoku Kogyo Kk Zinc plating method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49106920A (enExample) * 1973-02-17 1974-10-11
JPS5121377A (ja) * 1974-08-14 1976-02-20 Hitachi Ltd Hodento
JPS54137439A (en) * 1978-04-18 1979-10-25 Minoru Isono Formation of hardened layer on metal surface
JPS54147135A (en) * 1978-05-12 1979-11-17 Minoru Isono Formation of saw teeth hard quality chips and apparatus therefor
JPS5638456A (en) * 1979-09-04 1981-04-13 Senjiyu Kinzoku Kogyo Kk Zinc plating method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892141A (en) * 1986-07-28 1990-01-09 The Furukawa Electric Co., Ltd. Fin of heat exchanger and method of making it
USRE45987E1 (en) 2003-09-11 2016-04-26 Renesas Electronics Coporation Electronic component and method of manufacturing the same
JP2006299408A (ja) * 2005-03-24 2006-11-02 Nippon Steel Corp 金属帯板のめっき方法
WO2012128025A1 (ja) * 2011-03-24 2012-09-27 日本碍子株式会社 Ｃｕ薄板処理方法
JP2012200752A (ja) * 2011-03-24 2012-10-22 Ngk Insulators Ltd Ｃｕ薄板処理方法
US9676060B2 (en) 2011-03-24 2017-06-13 Ngk Insulators, Ltd. Method for treating Cu thin sheet

Also Published As

Publication number Publication date
JPH0362797B2 (enExample) 1991-09-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees