JPS60235495A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS60235495A
JPS60235495A JP9210684A JP9210684A JPS60235495A JP S60235495 A JPS60235495 A JP S60235495A JP 9210684 A JP9210684 A JP 9210684A JP 9210684 A JP9210684 A JP 9210684A JP S60235495 A JPS60235495 A JP S60235495A
Authority
JP
Japan
Prior art keywords
plating
layer
hole
forming
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9210684A
Other languages
Japanese (ja)
Inventor
魚津 信夫
横山 博義
洋一 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi Condenser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Condenser Co Ltd filed Critical Hitachi Condenser Co Ltd
Priority to JP9210684A priority Critical patent/JPS60235495A/en
Priority to US06/701,533 priority patent/US4585502A/en
Priority to DE19853505579 priority patent/DE3505579A1/en
Publication of JPS60235495A publication Critical patent/JPS60235495A/en
Pending legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はアディティブ法による印刷配線板の製造方法に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of manufacturing a printed wiring board by an additive method.

〈従来の技術) 従来、CC−4法等のようなアディティブ法により無電
解めっきして回路を形成し印刷配線板を製造する場合、
絶縁基板の表面には、予め、めっき触媒入りの接着剤層
が設けられる。この場合、絶縁基板にスルーホール用の
孔が設けられているものにあっては、孔を設けた後、無
電解めっき処理をする前に、めっき触媒を孔に付着する
処理を行なっている。
<Conventional technology> Conventionally, when manufacturing a printed wiring board by forming a circuit by electroless plating using an additive method such as the CC-4 method,
An adhesive layer containing a plating catalyst is provided in advance on the surface of the insulating substrate. In this case, if the insulating substrate is provided with holes for through-holes, after the holes are formed and before electroless plating, a plating catalyst is attached to the holes.

(発明が解決しようとする問題点〉 ところで、通常、接着剤層と無電解めっき処理により形
成されためつきの回路との接着力を向上するために、孔
にめっき触媒を付着した後に、接着剤層を粗化している
。接着剤層の粗化は、絶縁基板を硼弗化水素酸溶液や無
水クロム酸硫酸系溶液等の粗化液に浸漬することにより
行なっているが、この浸漬処理により孔壁に付着しため
つき触媒がほとんど洗い流されてしまう。そのため、後
に無電解めっき処理を行なっても孔の箇所に、めっきが
析出するのに時間が掛かり、析出しためつき膜が薄く機
械的強度が小さいという欠点があった。しかもランド等
に半田めっきをした場合、従来、孔壁面に設けられため
っき層が薄く、絶縁基板内のガスが孔内周面から放出し
、孔内にこのガスが充満するために孔表面が半田により
被われる(以下ブローホールという)欠点があった。
(Problems to be Solved by the Invention) By the way, normally, in order to improve the adhesive strength between the adhesive layer and the plating circuit formed by electroless plating, the adhesive layer is The adhesive layer is roughened by immersing the insulating substrate in a roughening solution such as a borofluoric acid solution or an anhydrous chromic acid/sulfuric acid solution. Most of the plating catalyst that adheres to the wall is washed away. Therefore, even if electroless plating is performed later, it takes time for the plating to precipitate in the holes, and the precipitated plating film is thin and has poor mechanical strength. Furthermore, when solder plating is applied to lands, etc., the plating layer provided on the hole wall surface is conventionally thin, and the gas in the insulating substrate is released from the inner peripheral surface of the hole, causing this gas to enter the hole. This has the disadvantage that the surface of the hole is covered with solder (hereinafter referred to as a blowhole) because the hole is filled with solder.

(目的) 本発明は、以上の欠点を改良し、スルーホール用の孔壁
面のめつき析出を容易にし製造時間を短縮しうるととも
に半田めっき不良を防1ニして信頼性の高い印刷配線板
の製造方法の提供を目的とするものである。
(Objective) The present invention improves the above-mentioned drawbacks, facilitates plating deposition on the hole wall surface for through holes, shortens manufacturing time, and prevents solder plating defects to provide a highly reliable printed wiring board. The purpose of this invention is to provide a method for manufacturing.

(問題を解決するだめの手段) 本発明は、上記の目的を達成するために、スルーホール
用の孔を有し、めっき触媒入り接着剤が塗布された絶縁
板に、めっきレジスト層を形成する工程と、前記接着剤
層表面を粗化する工程と、無電解めっきにより回路を形
成する工程とを施す印刷配線板の製造方法において、孔
の壁面にめっき触媒入りの熱硬化性樹脂層を形成する工
程後、めっきレジスト層を形成する工程を施づことを特
徴とする印刷配線板の製造方法を提供するものでルーホ
ール用の孔の壁面に予め、めっき触媒入りの熱硬化性樹
脂層を設けており、めっき触媒が直接壁面に+FWされ
た場合に比べて何首ノ〕が強く、その後に絶縁基板を粗
化液中に浸漬しても熱硬化性樹脂層は容易に剥離するこ
とがない。それ故、無電解めっき処理を施すことにより
孔の内壁に充分な厚さのめっきが短時間に析出しめつき
層が形成される。しかも、絶縁基板内のガスが孔壁を通
して放出されるのを熱硬化性樹脂層により防止できるた
め、その後に、半田めっき処理をした際のブローホール
を防止できる。また、めっき触媒入りの熱硬化性樹脂層
を形成した後に、めっきレジスト層を設けているために
、めっきレジスト層表面にめっき触媒が付着することな
く、めっきレジスト層表面にめっきが析出して回路間を
短絡するような不良を防止できる。
(Means for Solving the Problem) In order to achieve the above object, the present invention forms a plating resist layer on an insulating plate having through holes and coated with an adhesive containing a plating catalyst. In the method for manufacturing a printed wiring board, the method includes a step of roughening the surface of the adhesive layer, and a step of forming a circuit by electroless plating, wherein a thermosetting resin layer containing a plating catalyst is formed on the wall surface of the hole. The present invention provides a method for manufacturing a printed wiring board, characterized in that after the process of forming a plating resist layer, a process of forming a plating resist layer is performed. The plating catalyst is stronger than when the plating catalyst is applied directly to the wall surface, and the thermosetting resin layer does not peel off easily even if the insulating substrate is subsequently immersed in a roughening solution. . Therefore, by performing the electroless plating process, a sufficient thickness of plating is deposited on the inner wall of the hole in a short time to form a plated layer. Moreover, since the thermosetting resin layer can prevent the gas in the insulating substrate from being released through the hole walls, blowholes can be prevented during subsequent solder plating processing. In addition, since the plating resist layer is provided after forming the thermosetting resin layer containing the plating catalyst, the plating catalyst does not adhere to the surface of the plating resist layer and the plating precipitates on the surface of the plating resist layer. It is possible to prevent defects such as short circuits between the two.

(実施例) 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.

先ず、紙=フェノール樹脂基材や紙−エポキシ樹脂基材
からなる絶縁基板にパラジウム等のめっき触媒入りの接
着剤を塗布して接着剤層を形成する。次に、この接着剤
層が形成された絶縁基板をしてパンチによる基板カスを
除去する。この水洗μ程度の熱硬化性の樹脂層を設ける
。めっき触媒としては、パラジウム系が良く、通常はア
ルミノシリケートを担体としてその表面にパラジウムが
付着されたものを用いるが、また、エポキシ樹脂どキレ
ートを形成したタイプも用いられる。熱硬化性樹脂とし
ては、エポキシ樹脂やウレタン樹脂、ポリエステル樹脂
等を用いるが、絶縁基板がフェノール樹脂系あるいはエ
ポキシ樹脂系のものの場合には、エポキシ樹脂が基板と
の密着性がよく好ましい。また、硬化剤としては、アミ
ン系のものが安定したエマルジョンが得られるので好ま
しく、その部所としては0.3〜5wt%の範囲のもの
が特に好ましい。すなわち、0.3wt%未満のm麿で
は硬化剤としての効果が低くなって樹脂が硬化し難(な
り、また、5wt%より多いど孔を塞ぐように樹脂が被
覆されることがあり、除去作業が必要となり作業上好ま
しくない。なお、析出しためっきとの接着性を改良する
ために、粗化液に溶解する充填剤をこの熱硬化性樹脂中
に含有してもよく、このような充填剤としては、炭酸カ
ルシウムやシリカの粉末等あるいはニトリルブタジェン
ゴムやスチレンブタジェンゴム等のブタジェン系ゴムを
用いる。絶縁基板の孔に熱硬化性樹脂層を形成した後、
絶縁基板をエマルジョン中に浸漬した後取り出して、絶
縁基板を、絞りローラにより表面のエマルジョンを除去
し、さらに、高温雰囲気中に通して乾燥し孔の壁面に設
けられた樹脂層を硬化状態にする。樹脂層を硬化した後
、メツキレシストインクを所定のパターンに塗布・乾燥
してメツキレシスト層を設け、硬化する。めっきレジス
ト層を設けた後、絶縁基板を硼弗化水素酸溶液や無水ク
ロムI!@酸系溶液からなる粗化液に浸漬して、接着剤
層を粗化する。接着剤層を粗化した後、絶縁基板を無電
解銅めっき溶液中に浸漬して所定のパターンにめっきを
析出して回路を形成する。回路を形成後、通常の方法ぐ
絶縁基板を処理し、印刷配線板を製造する。
First, an adhesive containing a plating catalyst such as palladium is applied to an insulating substrate made of a paper-phenol resin base material or a paper-epoxy resin base material to form an adhesive layer. Next, the insulating substrate with the adhesive layer formed thereon is removed by punching to remove substrate debris. A thermosetting resin layer having a washability μ level is provided. As a plating catalyst, a palladium-based catalyst is preferred, and one in which palladium is adhered to the surface of an aluminosilicate carrier is usually used, but a type formed with an epoxy resin chelate is also used. As the thermosetting resin, epoxy resin, urethane resin, polyester resin, etc. are used, but when the insulating substrate is made of phenol resin or epoxy resin, epoxy resin is preferred because of its good adhesion to the substrate. Further, as the curing agent, an amine type curing agent is preferable since a stable emulsion can be obtained, and a curing agent in the range of 0.3 to 5 wt% is particularly preferable. In other words, if the amount is less than 0.3 wt%, the effect as a curing agent will be low, making it difficult for the resin to harden, and if it is more than 5 wt%, the resin may be coated to block the pores, making it difficult to remove. This requires additional work, which is undesirable from a work standpoint.In addition, in order to improve the adhesion to the precipitated plating, this thermosetting resin may contain a filler that dissolves in the roughening liquid. As the agent, calcium carbonate or silica powder or butadiene rubber such as nitrile butadiene rubber or styrene butadiene rubber is used.After forming a thermosetting resin layer in the holes of the insulating substrate,
After the insulating substrate is immersed in the emulsion, it is taken out, the emulsion on the surface of the insulating substrate is removed using a squeezing roller, and the insulating substrate is dried by passing it through a high-temperature atmosphere to harden the resin layer provided on the wall of the hole. . After the resin layer is cured, a mesh resist ink is applied in a predetermined pattern and dried to form a mesh resist layer, which is then cured. After forming the plating resist layer, the insulating substrate is coated with a borofluoric acid solution or anhydrous chromium I! The adhesive layer is roughened by immersing it in a roughening solution consisting of an acid solution. After roughening the adhesive layer, the insulating substrate is immersed in an electroless copper plating solution to deposit plating in a predetermined pattern to form a circuit. After forming the circuit, the insulating substrate is processed using conventional methods to produce a printed wiring board.

次に、本発明と従来例とについて、スルーホールの孔内
のめつき付着性、スルーホール信頼性、ブローホール発
生率及びめっきレジスト層表面のめっき析出状態につい
て測定したところ表の通りの結果が得られた。
Next, we measured the plating adhesion inside the through-hole, the through-hole reliability, the blowhole occurrence rate, and the plating precipitation state on the surface of the plating resist layer for the present invention and the conventional example, and the results are shown in the table. Obtained.

表 スルーホールの孔内のめつき付着性は孔内壁全面にめっ
きが析出するまでの時間、スルーホール信頼性はMIL
−107D (−65℃、30分〜125℃、30分の
サイクルによる熱衝撃テスト)により抵抗値が10%増
加するサイクル数、ブローホール発生率は半田あげ条件
を240℃、5秒、めつきレジスト層表面のめつき析出
状態は目視により測定した。
The adhesion of plating inside the surface through hole is the time required for the plating to deposit on the entire inner wall of the hole, and the reliability of the through hole is the MIL.
-107D (thermal shock test with cycles of -65℃, 30 minutes to 125℃, 30 minutes) The number of cycles at which the resistance value increases by 10%, the blowhole occurrence rate is the soldering condition: 240℃, 5 seconds, plating The state of plating precipitation on the surface of the resist layer was visually measured.

なお、製造条件は、実施例1)が、 a)絶縁基板:エポキシ樹脂積層板にめっき触媒入り接
着剤(日立化成工業社製HA−04)を塗布硬化したも
の。
The manufacturing conditions of Example 1) were as follows: a) Insulating substrate: An adhesive containing a plating catalyst (HA-04 manufactured by Hitachi Chemical Co., Ltd.) was applied and cured on an epoxy resin laminate.

b)熱硬化性樹脂層形成工程:エポキシ樹脂エマルジョ
ン(ラネボウN80社製エポルジョンEA−1の固形分
100m1部に対し硬化剤EB−1を80重間部添加し
たもの)中に樹脂分100ffi!部に対して炭酸カル
シウム20重量部とめつき触媒(日立化成工業社製Ca
t−10)5重量部とを添加分散さけた8度1%の液中
に浸漬後、パフで接着剤表面のエマルジョンを取り除き
、100℃?′−10秒間乾燥し、さらに160℃で3
0分間加熱硬化する。
b) Thermosetting resin layer forming step: Resin content 100ffi in epoxy resin emulsion (80 weight parts of curing agent EB-1 added to 100 ml solid content of Epolsion EA-1 manufactured by Lanebou N80)! 20 parts by weight of calcium carbonate and a plating catalyst (manufactured by Hitachi Chemical Co., Ltd.)
t-10) 5 parts by weight was added and dispersed in an 8°C 1% solution, the emulsion on the surface of the adhesive was removed with a puff, and the adhesive was heated to 100°C. ' - Dry for 10 seconds and then dry at 160℃ for 3
Heat and cure for 0 minutes.

C)めつきレジスト■稈:めつさレジストインク(日立
化成工業社!N HG M −028K−1〉をスクリ
ーン印刷し、160℃で30分間乾燥硬化する。
C) Plating resist ■Culm: Screen-printing the plating resist ink (Hitachi Chemical Co., Ltd.! NHG M-028K-1) and drying and curing at 160° C. for 30 minutes.

d)粗化工程:無水クロム酸、硫酸及び弗化ソーダー系
粗化液中に浸漬し、洗浄する。
d) Roughening step: Immerse and wash in a roughening solution based on chromic anhydride, sulfuric acid, and sodium fluoride.

e)無電解めっき工程二通常の無電解銅めっき処理(C
G−4めっき処理)を行ない、厚さ30μの銅層を形成
する。
e) Electroless plating process 2 Normal electroless copper plating treatment (C
G-4 plating treatment) to form a 30μ thick copper layer.

エン系ゴムく日本ゼオン社製バイヤー 1522)を10重量部添加し、 実施例3)は、実施例2)において熱硬化性樹脂から炭
酸カルシウムを除去し、 実施例4)は、実施例1)において粗化液を硼弗化水素
酸系とし、 従来例1)は、実施例1〉において熱硬化性樹脂層形成
工程を省略し、 従来例2)は、実施例1)において熱硬化性樹脂層形成
工程の代りにシーダー処理(シーダー:日立化成工業社
製H8−101B)を施し、 比較例は、実施例1〉において熱硬化性樹脂形成工程を
めっきレジスト工程後に行い、めっきレジスト層表面の
エマルジョンをパフで取り除いたものである。
In Example 3), calcium carbonate was removed from the thermosetting resin in Example 2), and in Example 4), Example 1) was added. In Conventional Example 1), the step of forming a thermosetting resin layer was omitted in Example 1, and in Conventional Example 2), the thermosetting resin was used in Example 1). Seeder treatment (seeder: H8-101B manufactured by Hitachi Chemical Co., Ltd.) was performed instead of the layer forming step, and in the comparative example, the thermosetting resin forming step was performed after the plating resist step in Example 1>, and the surface of the plating resist layer was The emulsion is removed with a puff.

表から明らかな通り、本発明によれば従来例に比べてス
ルーホール用の孔壁面のめつき付着性は約67%以上短
縮されてめっき析出速度が3倍以上早くなり、スルーホ
ールの信頼性は約1.6倍以上となり、ブローホール発
生率は1/10以下に減少している。また、本発明によ
れば、熱硬化性樹脂形成工程をめっきレジスト工程後に
行なった比較例と比べ、めっきレジスト層表面のめつき
析出がなく、短絡不良を防[トできる。
As is clear from the table, according to the present invention, compared to the conventional example, the plating adhesion on the hole wall surface for through-holes is reduced by about 67% or more, the plating deposition rate is more than three times faster, and the reliability of through-holes is improved. is approximately 1.6 times or more, and the blowhole occurrence rate has been reduced to less than 1/10. Further, according to the present invention, compared to a comparative example in which the thermosetting resin forming step was performed after the plating resist step, there is no plating precipitation on the surface of the plating resist layer, and short circuit defects can be prevented.

(効果) 以上の通り、本発明によれば、スルーホール用の孔壁面
に、予め、めっき触媒入りの熱硬化性樹脂層を設ける工
程をめっきレジスト工程前に施すことにより、孔壁面へ
のめつき析出が♀くなり製造時間を短縮できるとともに
ブ[1−ホールの発生率が低く、短絡不良を防止できる
信頼性の高い印刷配線板の製造方法が得られる。
(Effects) As described above, according to the present invention, by performing the step of providing a thermosetting resin layer containing a plating catalyst on the hole wall surface of a through hole before the plating resist step, the metallization on the hole wall surface can be improved. It is possible to obtain a method for manufacturing a highly reliable printed wiring board, which can reduce the production time by reducing the occurrence of black deposits, have a low occurrence rate of b[1-holes, and prevent short-circuit defects.

特許出願人 日立コンデンザ株式会社Patent applicant: Hitachi Condenser Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] (1)スルーホール用の孔を有し、めっき触媒入り接着
剤が塗布された絶縁板に、めっきレジスト層を形成する
工程と、前記接着剤層表面を粗化する工程と、無電解め
っきにより回路を形成する工程とを施寸印刷配線板の製
造方法において、孔の壁面にめっき触媒入りの熱硬化性
樹脂層を形成する工程後、めっきレジスト層を形成する
工程を施すことを特徴とする印刷配線板の製造方法。
(1) A process of forming a plating resist layer on an insulating plate having holes for through holes and coated with an adhesive containing a plating catalyst, a process of roughening the surface of the adhesive layer, and an electroless plating process. The method for manufacturing a printed wiring board is characterized in that after the step of forming a thermosetting resin layer containing a plating catalyst on the wall surface of the hole, a step of forming a plating resist layer is performed. A method for manufacturing printed wiring boards.
JP9210684A 1984-04-27 1984-05-09 Method of producing printed circuit board Pending JPS60235495A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9210684A JPS60235495A (en) 1984-05-09 1984-05-09 Method of producing printed circuit board
US06/701,533 US4585502A (en) 1984-04-27 1985-02-14 Process for producing printed circuit board
DE19853505579 DE3505579A1 (en) 1984-04-27 1985-02-18 METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9210684A JPS60235495A (en) 1984-05-09 1984-05-09 Method of producing printed circuit board

Publications (1)

Publication Number Publication Date
JPS60235495A true JPS60235495A (en) 1985-11-22

Family

ID=14045182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9210684A Pending JPS60235495A (en) 1984-04-27 1984-05-09 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS60235495A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107567207A (en) * 2017-08-28 2018-01-09 东莞市卡小二智能卡有限公司 The manufacture craft of Contact Type Ic Card PCB support plates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914977A (en) * 1972-05-22 1974-02-08
JPS5544476A (en) * 1978-09-25 1980-03-28 Shin Meiwa Ind Co Ltd Garbage galling preventing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914977A (en) * 1972-05-22 1974-02-08
JPS5544476A (en) * 1978-09-25 1980-03-28 Shin Meiwa Ind Co Ltd Garbage galling preventing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107567207A (en) * 2017-08-28 2018-01-09 东莞市卡小二智能卡有限公司 The manufacture craft of Contact Type Ic Card PCB support plates

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