JPH023557B2 - - Google Patents
Info
- Publication number
- JPH023557B2 JPH023557B2 JP1959984A JP1959984A JPH023557B2 JP H023557 B2 JPH023557 B2 JP H023557B2 JP 1959984 A JP1959984 A JP 1959984A JP 1959984 A JP1959984 A JP 1959984A JP H023557 B2 JPH023557 B2 JP H023557B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- adhesive
- plating
- roughening
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 238000007788 roughening Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- QDJMEUFKKDBMFB-UHFFFAOYSA-L F.S(O)(O)(=O)=O.[Cr](=O)(=O)(O)O Chemical compound F.S(O)(O)(=O)=O.[Cr](=O)(=O)(O)O QDJMEUFKKDBMFB-UHFFFAOYSA-L 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 230000007547 defect Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical group O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は表面に接着剤層を有する絶縁基板に回
路を形成しうる印刷配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board on which a circuit can be formed on an insulating substrate having an adhesive layer on its surface.
電気機器の小型化は日進月歩であり、それとと
もに内部に組み込まれる印刷配線板も益々、小型
で印刷回路間の狭い高密度のものが必要とされる
ようになつている。 The miniaturization of electrical equipment is progressing rapidly, and along with this, the printed wiring boards incorporated therein are increasingly required to be smaller and have higher density between printed circuits.
ところで、CC−４法等のように基板に予め接
着剤層及びめつきレジスト層を順次設け、接着剤
層の粗化後に無電解めつきによりめつきレジスト
層以外の箇所にめつきを設け回路を形成するよう
な印刷配線板においては、無電解めつきの際にめ
つきレジスト層に金属めつきが付着し、成長する
現象が起こる。そしてこのような金属めつきの成
長が大きくなると絶縁不良や短絡不良が生じ、特
に高密度の印刷配線板になるとこのような不良が
生じ易い欠点があつた。 By the way, as in the CC-4 method, an adhesive layer and a plating resist layer are sequentially provided on a substrate in advance, and after the adhesive layer is roughened, plating is applied to areas other than the plating resist layer by electroless plating to form a circuit. In printed wiring boards in which metal plating is formed, a phenomenon occurs in which metal plating adheres to and grows on the plating resist layer during electroless plating. When the growth of such metal plating becomes large, insulation defects and short-circuit defects occur, and especially in high-density printed wiring boards, such defects tend to occur.
このような欠点を改良するために、従来、接着
剤を粗化するために硼弗化水素酸溶液を用いてい
たが、これを無水クロム酸硫酸系溶液にした。こ
れにより絶縁不良や短絡不良が減少するという結
果をみたが、反面、無電解めつきにより形成され
た回路の半田耐熱性が低下するという欠点が生じ
た。 In order to improve these drawbacks, a borofluoric acid solution was conventionally used to roughen the adhesive, but this was replaced with a chromic anhydride sulfuric acid solution. This resulted in a reduction in insulation defects and short-circuit defects, but on the other hand, there was a drawback in that the solder heat resistance of circuits formed by electroless plating decreased.
本発明は、以上の欠点を改良し、絶縁不良や短
絡不良を減少するとともに半田耐熱性を向上しう
る印刷配線板の製造方法の提供を目的とするもの
である。 SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a printed wiring board that can improve the above-mentioned drawbacks, reduce insulation defects and short circuit defects, and improve solder heat resistance.
本発明は、上記の目的を達成するために、絶縁
基板の表面に設けられた接着剤層を無水クロム酸
硫酸弗化アルカリ系粗化液により粗化した後、無
電解めつき液により所定の回路を形成する印刷配
線板の製造方法において、接着剤を10ｇ／以上
溶解した無水クロム酸硫酸弗化アルカリ系粗化液
により接着剤層を粗化することを特徴とする印刷
配線板の製造方法を提供するものである。 In order to achieve the above object, the present invention roughens the adhesive layer provided on the surface of an insulating substrate using an anhydrous chromic acid sulfate fluoride alkaline roughening solution, and then roughens it using an electroless plating solution. A method for producing a printed wiring board forming a circuit, the method comprising roughening the adhesive layer using an alkali anhydrous chromic acid sulfate fluoride roughening solution in which 10 g or more of adhesive is dissolved. It provides:
以下、本発明を実施例に基づいて説明する。 Hereinafter, the present invention will be explained based on examples.
先ず、パラジウム系等のめつき用触媒入りの紙
−フエノール樹脂基材や紙−エポキシ樹脂基材等
の絶縁基板の表面に、めつき用触媒入りの完全硬
化型の接着剤を塗布して接着剤層を形成する。次
に、この接着剤層表面に、スクリーン印刷により
所定のパターンにめつきレジストインクを印刷・
乾燥して、めつきレジスト層を設ける。そして接
着剤層及びめつきレジスト層が設けられた絶縁基
板を、接着剤を10ｇ／以上溶解した無水クロム
酸硫酸弗化アルカリ系粗化液中に浸漬して接着剤
層を粗化する。粗化液としては、特にCrO3が20
〜60ｇ／、H2SO4が150〜500ml／及びNaF
が10〜50ｇ／の成分からなるものを用いる。ま
た、溶解する接着剤は絶縁基板の表面に設けた接
着剤層と同一のものでも良く、異なるものであつ
てもよい。そして接着剤層を粗化した後、絶縁基
板を無電解銅めつき溶液に浸漬し、接着剤層表面
に銅めつき層からなる回路を形成する。 First, a completely curing adhesive containing a plating catalyst is applied to the surface of an insulating substrate such as a paper-phenol resin base material or a paper-epoxy resin base material containing a plating catalyst such as palladium, and the adhesive is bonded. Form a layer of agent. Next, on the surface of this adhesive layer, plating resist ink is printed in a predetermined pattern by screen printing.
Dry to provide a plating resist layer. Then, the insulating substrate provided with the adhesive layer and the plating resist layer is immersed in an anhydrous chromic acid sulfate fluoride alkali roughening solution in which 10 g or more of the adhesive is dissolved to roughen the adhesive layer. As a roughening liquid, CrO 3 is especially suitable for 20
~60g/, H 2 SO 4 150-500ml/ and NaF
10 to 50g/component is used. Further, the adhesive to be dissolved may be the same as the adhesive layer provided on the surface of the insulating substrate, or may be different. After roughening the adhesive layer, the insulating substrate is immersed in an electroless copper plating solution to form a circuit made of a copper plating layer on the surface of the adhesive layer.
すなわち、上記本発明の実施例によれば、粗化
液中に接着剤を溶解すると、接着剤中に含まれて
いるゴム（２重結合の多い成分）により粗化液中
の六価クロムの一部が酸化されて酸化クロムとな
り、粗化液が老化する。すなわち、接着剤の溶解
量が10ｇ／以上であれば、粗化液が適当に老化
するため、接着剤層の表面に適切な凹凸が生じ、
接着剤層と銅めつき層との剥離強度が増大し、半
田耐熱性が向上する。また、粗化液が無水クロム
酸硫酸弗化アルカリ系粗化液であるため、その後
のめつき処理の際に、めつきレジスト層に銅めつ
きが付着し難く、絶縁不良や短絡不良を防止でき
る。 That is, according to the embodiment of the present invention, when the adhesive is dissolved in the roughening liquid, the rubber (component with many double bonds) contained in the adhesive dissolves hexavalent chromium in the roughening liquid. A part of it is oxidized to become chromium oxide, and the roughening solution ages. In other words, if the amount of adhesive dissolved is 10g/or more, the roughening liquid will age appropriately, causing appropriate unevenness on the surface of the adhesive layer.
The peel strength between the adhesive layer and the copper plating layer increases, and the soldering heat resistance improves. In addition, since the roughening liquid is an alkali-based roughening liquid based on anhydrous chromic acid sulfate fluoride, it is difficult for copper plating to adhere to the plating resist layer during the subsequent plating process, preventing poor insulation and short circuits. can.
なお、粗化液中に含まれる接着剤量が10ｇ／
より少ないと、半田耐熱性が接着剤を入れない従
来のものとほとんど変わりがない。また、絶縁基
板が特に紙−フエノール樹脂基板の場合には、接
着剤量は15ｇ／以上である方がより好ましい。 In addition, the amount of adhesive contained in the roughening liquid is 10g/
If the amount is less, the soldering heat resistance is almost the same as that of conventional products that do not include adhesive. Further, when the insulating substrate is particularly a paper-phenol resin substrate, it is more preferable that the amount of adhesive is 15 g/or more.
上記実施例では、絶縁基板の表面にめつき用触
媒入りの接着剤層を設けたが、めつき用触媒の含
まれない接着剤層でもよく、この場合には、接着
剤層の粗化後にめつき用触媒をその表面に塗布す
ればよい。 In the above embodiment, an adhesive layer containing a plating catalyst was provided on the surface of the insulating substrate, but an adhesive layer that does not contain a plating catalyst may also be used. In this case, after roughening the adhesive layer, A plating catalyst may be applied to the surface.
次に、本発明の方法と従来方法により製造した
印刷配線板について半田耐熱性を比較する。 Next, the solder heat resistance of printed wiring boards manufactured by the method of the present invention and the conventional method will be compared.
絶縁基板としては、パラジウム系のめつき用触
媒を含有する紙−フエノール樹脂基材を用い、そ
の表面にニトリルゴムフエノール樹脂にめつき用
触媒を含有した接着剤層及びめつきレジスト層を
設ける。次に、この絶縁基板を、温度40℃の粗化
液に12分間浸漬し、取り出して乾燥する。粗化液
は、CrO330ｇ／、濃H2SO4300ml／及び
NaF30ｇ／の成分からなる液に、絶縁基板に
設けた接着剤層と同一成分の接着剤を10〜50ｇ／
含有したものを用いる。接着剤層を粗化した
後、無電解銅めつき処理をして、厚さ30μの銅め
つき層を析出する。そしてこのようにして形成し
た印刷配線板の試験片（25.4×25.4mm）を温度
260℃の半田溶融液中に浸漬して、銅めつき層が
剥離したりふくれたりするまでの時間を測定し
て、半田耐熱性を求めたところ図に示す通りの結
果が得られた。この図から明らかな通り、本発明
によれば、接着剤を溶解しない従来例が2.5秒で
あるのに対して、６秒以上となり2.4倍以上、半
田耐熱性が向上している。 As the insulating substrate, a paper-phenolic resin base material containing a palladium-based plating catalyst is used, and an adhesive layer and a plating resist layer containing a nitrile rubber phenolic resin and a plating catalyst are provided on the surface thereof. Next, this insulating substrate is immersed in a roughening solution at a temperature of 40° C. for 12 minutes, taken out and dried. The roughening solution consists of 30g of CrO 3 /300ml of concentrated H 2 SO 4 / and
Add 10 to 50 g of adhesive having the same composition as the adhesive layer provided on the insulating substrate to a liquid consisting of 30 g of NaF.
Use the one that contains it. After roughening the adhesive layer, electroless copper plating treatment is performed to deposit a 30μ thick copper plating layer. Then, the test piece (25.4 x 25.4 mm) of the printed wiring board formed in this way was heated to
The solder heat resistance was determined by immersing it in a 260°C solder melt and measuring the time it took for the copper plating layer to peel or swell, and the results shown in the figure were obtained. As is clear from this figure, according to the present invention, the soldering heat resistance is improved by more than 2.4 times, taking 6 seconds or more, compared to 2.5 seconds in the conventional example in which the adhesive is not dissolved.
以上の通り、本発明によれば、絶縁不良や短絡
不良を減少しうるとともに半田耐熱性を向上しう
る印刷配線板の製造方法が得られる。 As described above, according to the present invention, there is provided a method for manufacturing a printed wiring board that can reduce insulation defects and short circuit defects and improve solder heat resistance.
図は接着剤溶解量に対する半田耐熱性のグラフ
を示す。
The figure shows a graph of solder heat resistance versus the amount of adhesive melted.
Claims (1)
クロム酸硫酸弗化アルカリ系粗化液により粗化し
た後、無電解めつき液により所定の回路を形成す
る印刷配線板の製造方法において、接着剤を10
ｇ／以上溶解した無水クロム酸硫酸弗化アルカ
リ系粗化液により接着剤層を粗化することを特徴
とする印刷配線板の製造方法。1. In a method for manufacturing a printed wiring board, the adhesive layer provided on the surface of an insulating substrate is roughened with an anhydrous chromic acid sulfate fluoride alkaline roughening solution, and then a predetermined circuit is formed with an electroless plating solution, 10 glue
1. A method for producing a printed wiring board, which comprises roughening an adhesive layer using an alkali roughening solution based on anhydrous chromic acid, sulfate, fluoride, and more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1959984A JPS60164390A (en) | 1984-02-06 | 1984-02-06 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1959984A JPS60164390A (en) | 1984-02-06 | 1984-02-06 | Method of producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60164390A JPS60164390A (en) | 1985-08-27 |
| JPH023557B2 true JPH023557B2 (en) | 1990-01-24 |
Family
ID=12003684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1959984A Granted JPS60164390A (en) | 1984-02-06 | 1984-02-06 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60164390A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022209227A1 (en) | 2021-03-31 | 2022-10-06 | ソニーグループ株式会社 | Information processing terminal, information processing method, and program |
-
1984
- 1984-02-06 JP JP1959984A patent/JPS60164390A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022209227A1 (en) | 2021-03-31 | 2022-10-06 | ソニーグループ株式会社 | Information processing terminal, information processing method, and program |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60164390A (en) | 1985-08-27 |
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