JPS5856493A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS5856493A JPS5856493A JP15393181A JP15393181A JPS5856493A JP S5856493 A JPS5856493 A JP S5856493A JP 15393181 A JP15393181 A JP 15393181A JP 15393181 A JP15393181 A JP 15393181A JP S5856493 A JPS5856493 A JP S5856493A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- acid
- aqueous solution
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- -1 sodium fluoride-fluoroborate Chemical compound 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 102100026933 Myelin-associated neurite-outgrowth inhibitor Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- CNGSOCHSRNOEDQ-UHFFFAOYSA-M sodium;boric acid;chloride Chemical compound [Na+].[Cl-].OB(O)O CNGSOCHSRNOEDQ-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は印刷配線板の製造方法に関するものである。[Detailed description of the invention] The present invention relates to a method of manufacturing a printed wiring board.
従来−２印刷配線板は２紙−フェノール樹脂や紙−エポ
キシ樹脂あるいは鉄板等の基板に、この基板を樹脂液に
浸漬したりあるいは粉体の樹脂を塗布することによって
合成樹脂層を形成し、その後この樹脂を硬化する。そし
て硬化した樹脂の表面を粗面化処理するためにクロム酸
＋硫酸系水溶液に浸漬する。粗面化した後は電気メッキ
や化学メにキ等による金属メッキを施し、所定のパター
ンケ樹脂表面に形成する。Conventional-2 printed wiring boards are made by forming a synthetic resin layer on a substrate such as paper-phenol resin, paper-epoxy resin, or iron plate by dipping the substrate in a resin liquid or applying powdered resin. This resin is then cured. Then, in order to roughen the surface of the cured resin, it is immersed in an aqueous solution of chromic acid and sulfuric acid. After the surface has been roughened, metal plating is applied by electroplating or chemical coating to form a predetermined pattern on the resin surface.
ところで、金属メッキは樹脂の表面に密着性よく形成す
る必要があるが、従来のクロム酸−硫酸系水溶液は粗化
がおおざ、ばなため密着性が悪く。Incidentally, metal plating must be formed on the surface of the resin with good adhesion, but conventional chromic acid-sulfuric acid-based aqueous solutions have poor adhesion due to rough roughening.
製造中に金属メッキが剥れる不良が生じる欠点があった
。There was a drawback that the metal plating peeled off during manufacturing.
本発明は９以上の欠点を改良するために、金属メッキの
合成樹脂層に対する密着性を向上した印刷配線板の製造
方法を提供するものである。The present invention provides a method for manufacturing a printed wiring board in which the adhesion of metal plating to a synthetic resin layer is improved in order to improve the above-mentioned drawbacks.
本発明は、上記の目的を達成するために、印１１１３配
線板の製造方法において２合成樹脂の表面をりｐム酸〜
硫酸系水溶液により処理した後に、ターム酸ナトリウム
ーフ、化ホウ素酸系水溶液により処理して粗面化するこ
とを特徴とする印刷配線板の製造方法な提供するもので
ある。In order to achieve the above object, the present invention provides a method for manufacturing a wiring board marked 1113, in which the surface of a synthetic resin is
The present invention provides a method for manufacturing a printed wiring board, characterized in that the surface is roughened by treatment with a sulfuric acid-based aqueous solution and then with a sodium chloride-boric acid-based aqueous solution.
以下に２本発明の詳細な説明する。Two aspects of the present invention will be described in detail below.
基板として鉄板を用いる。この鉄板に任意に穴加工を施
す。そして触媒入りの粉体のエポキシ樹脂を塗布し、は
ぼ完全に硬化して厚さ２５０μ程度の合成樹脂層を形成
する。樹脂を硬化後、クロム酸、 １００Ｐ、ｉ 、
ｆｉｔ酸６００ ｇＡ／ｌカラナルｌ ａ Ａ 酸＊
酸水溶液中に浸漬する。浸漬時のこの液の温度は５０〜
４０℃、浸漬時間は１０〜１５分である。次に、このエ
ツチング液から基板を取り出し水洗して１重クロム酸ナ
トリウム２０ ’／１ 、 フッ化ホウ素酸２４０ｆ
ｔ／、からなるクロム酸ナトリウムーフ、化ホウ素酸水
溶液中に浸漬する。この時の液温は４０℃、漫ｉ！ 時
間は１５〜２０分である。そしてこれらの粗化処理を施
した後に、基板に無電解銅メッキを施し所定の回路を形
成する。A steel plate is used as the substrate. Drill holes as desired on this iron plate. Then, a powdered epoxy resin containing a catalyst is applied and completely cured to form a synthetic resin layer approximately 250 μm thick. After curing the resin, chromic acid, 100P, i,
fit acid 600 gA/l caranal l a A acid *
Immerse in acid solution. The temperature of this liquid during immersion is 50~
The temperature is 40°C and the immersion time is 10-15 minutes. Next, the substrate was taken out from the etching solution, washed with water, and treated with sodium monochromate 20'/1 and fluoroboric acid 240f.
Sodium chromate powder, consisting of t/, is immersed in an aqueous solution of boronic acid. The liquid temperature at this time was 40℃, Mani! The time is 15-20 minutes. After performing these roughening treatments, electroless copper plating is applied to the substrate to form a predetermined circuit.
すなわち１本発明によれば１合成樹脂層の表面を先ずク
ロム酸−硫酸系水溶液により粗くエツチングし、さらに
この粗くエツチングされた面を。That is, according to the present invention, the surface of the synthetic resin layer is first roughly etched with a chromic acid-sulfuric acid based aqueous solution, and then this roughly etched surface is further etched.
クロム酸ナトリウム−７フ化ホウ素酸系水溶液により細
かくエツチングできる。そのために、この後に形成され
た金属メッキが合成樹脂に凹凸に接する面が多（なり合
成樹脂層に対する金属メッキこれは従来のクロム酸−硫
酸系水溶液のみの場合のほぼ２倍以上の密着力である。It can be finely etched with a sodium chromate-7-fluoroboric acid aqueous solution. For this reason, the metal plating formed after this has many surfaces that are in contact with the synthetic resin unevenly (as a result, the metal plating on the synthetic resin layer has almost twice the adhesion strength of the conventional chromic acid-sulfuric acid-based aqueous solution only). be.
なお、上記の実施例においては、鉄芯入り配線板Ｊ一つ
いて述べたカ１紙−７．７−ルや紙−エポキシ等の絶縁
基板を用いてもよい。In the above embodiments, an insulating substrate such as paper-coal or paper-epoxy may be used for the iron-core wiring board J.
以上の通り９本発明によれば、金属メッキと合成樹脂層
との密着力が向上し、そのため製造中に金属メッキが刺
れる不良をほとんど防止できる。As described above, according to the present invention, the adhesion between the metal plating and the synthetic resin layer is improved, and therefore defects such as pricking of the metal plating during manufacturing can be almost completely prevented.
特許出願人 日立コンデンサ株式会社Patent applicant: Hitachi Capacitor Co., Ltd.
Claims (1)
な粗面化した後に金属メッキを施してなる印刷配線板の
製造方法において合成樹脂の表面をクロム酸−硫酸系水
溶液により処理した後に、クロム酸ナトリウム−フッ化
ホウ素酸系水溶液により処理して粗面化することを特徴
とする印刷配線板の製造方法。111 In a method for manufacturing a printed wiring board in which a synthetic resin is formed on a substrate, the surface of the synthetic resin is roughened, and then metal plating is applied, the surface of the synthetic resin is treated with a chromic acid-sulfuric acid-based aqueous solution, and then chromium 1. A method for manufacturing a printed wiring board, comprising roughening the surface by treating with a sodium fluoride-fluoroborate aqueous solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393181A JPS5856493A (en) | 1981-09-30 | 1981-09-30 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393181A JPS5856493A (en) | 1981-09-30 | 1981-09-30 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5856493A true JPS5856493A (en) | 1983-04-04 |
Family
ID=15573206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15393181A Pending JPS5856493A (en) | 1981-09-30 | 1981-09-30 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856493A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192006U (en) * | 1987-05-29 | 1988-12-12 |
-
1981
- 1981-09-30 JP JP15393181A patent/JPS5856493A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192006U (en) * | 1987-05-29 | 1988-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3982045A (en) | Method of manufacture of additive printed circuitboards using permanent resist mask | |
| US3666549A (en) | Method of making additive printed circuit boards and product thereof | |
| US4430154A (en) | Method of producing printed circuit boards | |
| US4717439A (en) | Process for the treatment of copper oxide in the preparation of printed circuit boards | |
| JPS63168077A (en) | Manufacture of printed wiring board | |
| CA1224276A (en) | Process for producing printed circuits | |
| JPS5856493A (en) | Method of producing printed circuit board | |
| KR100235930B1 (en) | Printed wiring board and method for preparing the same | |
| JPH02238942A (en) | Improvement of adhesive property between copper foil and resin | |
| JPH05259611A (en) | Production of printed wiring board | |
| US3682785A (en) | Process for forming an isolated circuit pattern on a conductive substrate | |
| JPS5952557B2 (en) | Manufacturing method for printed wiring boards | |
| GB1332041A (en) | Process for forming a conductive coating on a substrate | |
| JPS5821394A (en) | Method of producing printed circuit board | |
| JPS6133907B2 (en) | ||
| JPH09321443A (en) | Manufacture of multilayer board | |
| JPH05167248A (en) | Method of manufacturing printed wiring board | |
| JPS60263496A (en) | Method of producing circuit board | |
| JPS5967692A (en) | Method of producing printed circuit board | |
| JPS63188992A (en) | Manufacture of printed wiring board | |
| JPS62252993A (en) | Manufacture of multilayer interconnection board | |
| JPS6034094A (en) | Method of producing printed circuit board | |
| JPH02238696A (en) | Method of improving adhesion between copper foil and resin | |
| JPH05206639A (en) | Treating method for copper circuit of circuit board | |
| JPH01124286A (en) | Manufacture of printed-circuit board |