JPH0491489A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0491489A JPH0491489A JP20504390A JP20504390A JPH0491489A JP H0491489 A JPH0491489 A JP H0491489A JP 20504390 A JP20504390 A JP 20504390A JP 20504390 A JP20504390 A JP 20504390A JP H0491489 A JPH0491489 A JP H0491489A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- plating
- wiring board
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 abstract description 7
- 238000001035 drying Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、面付部品を搭載するプリント配線基板のスル
ーホール構造に係り、特に高密度実装に好適なハイブリ
ッドＩＣに供する面付用プリント配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a through-hole structure of a printed wiring board on which surface-mounted components are mounted, and in particular, surface-mounted printed wiring used in a hybrid IC suitable for high-density mounting. Regarding the board.
［従来の技術］
従来のプリント配線基板では、例えば、公開特許公報特
開昭５５−５８７８に記載のように、スルーホールは両
面基板もしくは多層配線プリント基板の配線層間の電気
的接続を行なうことと、さらに場合によってはリード部
品を挿入することを目的としており、半田付は面積の補
強による半田付強度の増加も図れるものであって、プレ
スやドリル等による方法で基板に穴をあけたところに、
無電解めっきと電気めっきを併用するか、あるいは無電
解めっきのみにより穴内を導体化して電気的接続を行な
う構造としていた。[Prior Art] In conventional printed wiring boards, for example, as described in Japanese Unexamined Patent Publication No. 55-5878, through holes are used to make electrical connections between wiring layers of a double-sided board or a multilayer wiring printed board. Furthermore, in some cases, the purpose is to insert lead parts, and soldering can increase the soldering strength by reinforcing the area, and it is possible to increase the soldering strength by reinforcing the area. ,
The structure used a combination of electroless plating and electroplating, or electroless plating alone to make the inside of the hole conductive and to make an electrical connection.
［発明が解決しようとする課題］
最近の技術の発展に伴ない、上記従来の技術は下記のよ
うな問題が生じるに至った。即ち、近年、小型化高密度
化の実装に於いては、リードレス部品が多く用いられる
ようになり、スルーホールの意味は電気的接続のみの目
的が強くなったきた。[Problems to be Solved by the Invention] With the recent development of technology, the above-mentioned conventional technology has come to have the following problems. That is, in recent years, leadless components have been increasingly used in packaging for miniaturization and high density, and the purpose of through holes has increasingly become solely for electrical connection.
高集積実装では、スルーホール穴の存在は、電気的接続
には必要なものの、部品実装には不要なものとなってい
る。In highly integrated packaging, the presence of through holes is necessary for electrical connections, but unnecessary for component mounting.
本発明の目的は、スルーホールの本来の目的である配線
層間の電気的接続の機能を失なうことなく、スルーホー
ルの利用によりリードレス部品の実装を可能にして、部
品実装密度を高めることのできる、プリント配線基板を
提供することにある。The purpose of the present invention is to use through holes to enable mounting of leadless components and increase component mounting density without losing the function of electrical connection between wiring layers, which is the original purpose of through holes. Our objective is to provide a printed wiring board that can
［課題を解決するための手段］
上記従来技術の問題点を解消し、上記本発明の目的を達
成するため、本発明のプリント配線基板は、内面にスル
ーホールめっきを有するスルーホール内に充填物が充填
されており、その充填物の少なくとも一方の表面が、半
田付性を有してなるものである。[Means for Solving the Problems] In order to solve the problems of the above-mentioned conventional technology and achieve the above-mentioned object of the present invention, the printed wiring board of the present invention includes a filling material in the through-holes having through-hole plating on the inner surface. is filled, and at least one surface of the filling material has solderability.
上記スルーホールめっきは、サブトラクティブ法、アデ
ィティブ法等により形成される。また、基板上のパター
ン形成は、スルーホールめっき工程の後で行なう。The above-mentioned through-hole plating is formed by a subtractive method, an additive method, or the like. Furthermore, pattern formation on the substrate is performed after the through-hole plating process.
スルーホールめっき後、前記充填物は印刷法、デイツプ
法、注入法等の方法によりスルーホール穴内に充填すれ
ばよい。また、充填物を熱処理等でスルーホール内に硬
化固着した後、その充填物がスルーホール穴の外に突起
している場合には、平坦化プレスやパフ等で研磨を行な
って、表面を平坦化する工程を加えてもよい。After through-hole plating, the filler may be filled into the through-hole by a method such as a printing method, a dipping method, or an injection method. In addition, if the filling material protrudes outside the through hole after hardening and fixing it inside the through hole by heat treatment, etc., polish it with a flattening press or puff to make the surface flat. You may add a step of converting.
充填物が半田付性を有する場合は、そのままでもよいが
、そうでない時はスルーホールの上面下面の両者もしく
は一方に、銅のような半田付性を有する層を無電解めっ
き、または、電気めっきの一方または両者によりめっき
して、半田付性をもたせることで本発明の目的を達成す
ることができる。If the filler has solderability, it may be left as is, but if it does not, electroless plating or electroplating of a layer with solderability such as copper is applied to both or one of the top and bottom surfaces of the through hole. The object of the present invention can be achieved by plating with one or both of these to provide solderability.
上記充填物には、樹脂ペースト、金属粉を含有する樹脂
ペースト、半田合金のいずれかを用いることができる。The filler may be a resin paste, a resin paste containing metal powder, or a solder alloy.
樹脂ペーストは無電解めっきの可能なものとする。The resin paste should be capable of electroless plating.
樹脂ペーストに用いる樹脂は、エポキシ樹脂系もしくは
フェノール樹脂系とするのが一般的である。また、樹脂
ペーストに含有させる金属粉は、銅粉もしくはニッケル
粉がよく、その含有量は５０〜９０ｗｔ％とする。金属
粉の含有量が５０ｗｔ％未満では半田ぬれ性が低下する
とともに無電解めっきの析出性が劣化し、９０ｗｔ％を
越えると樹脂と金属の密着性に悪影響を及ぼし、いずれ
も好ましくない。金属粉の粒径は通常０．３〜１０μｍ
とする。The resin used for the resin paste is generally an epoxy resin type or a phenol resin type. Further, the metal powder contained in the resin paste is preferably copper powder or nickel powder, and the content thereof is 50 to 90 wt%. If the metal powder content is less than 50 wt%, solder wettability and electroless plating deposition properties will deteriorate, and if it exceeds 90 wt%, it will adversely affect the adhesion between the resin and the metal, both of which are undesirable. The particle size of metal powder is usually 0.3 to 10 μm.
shall be.
上記樹脂ペーストは、通常、金属粉の有無にかかわらず
導電性・半田付性の低いものである。もっとも、一般的
な充填材は、銅含有樹脂ペーストで半田付性と導電性の
低いものであるが、しかし、導電性・半田付性を有する
金属含有ペーストであっても本発明の目的は達成できる
。The above-mentioned resin paste usually has low conductivity and low solderability regardless of the presence or absence of metal powder. However, the general filler is a copper-containing resin paste that has low solderability and conductivity, but even a metal-containing paste that has conductivity and solderability can still achieve the purpose of the present invention. can.
［作用］
部品実装上不要となるスルーホールの穴上にリードレス
部品を半田付けする場合、プリント基板が完成してから
ではスルーホール内に充填物を平坦に充填することは難
しく、量産的でない。この為、プリント基板の製造工程
中でスルーホールを埋めて、しかも表面を半田付性の良
い材質にして、なおかつ平坦にしておく必要がある。[Function] When soldering leadless components onto through-holes that are unnecessary for component mounting, it is difficult to fill the through-holes evenly after the printed circuit board is completed, making it impractical for mass production. . For this reason, it is necessary to fill the through holes during the manufacturing process of the printed circuit board, and also to make the surface of the board a material with good solderability and to keep it flat.
本発明では前記した充填物のような材料をスルーホール
内に充填して、研磨やプレス等の方法で、表面を平坦化
しなおかつその表面を半田付性のよい金属をめっき法で
施すことで、一般に用いられているプリント配線板と同
様な半田付性を有する為、部品マウントおよび半田付は
作業の方法を変えることなく、高密度な部品実装が可能
である。In the present invention, a material such as the above-mentioned filler is filled into the through hole, the surface is flattened by a method such as polishing or pressing, and the surface is plated with a metal with good solderability. Since it has solderability similar to that of commonly used printed wiring boards, high-density component mounting is possible without changing the method of mounting and soldering components.
［実施例コ
以下、本発明の一実施例を第１図から第３図により説明
する。１８μｍの銅箔２を両面に有するガラスエポキシ
積層板に、スルーホール部３になる所定の位置にドリル
穴あけ後、無電解鋼めっきと電気銅めっきを併用してス
ルーホールめっき４を形成した状態を第２図に示す。そ
の後、メタルマスクにより粒径が５〜１０μｍの銅粉約
８５ｗｔ％と残部がエポキシ樹脂よりなるペーストをス
ルーホール穴内にスキージ（スクリーンを通してインキ
をこすり出すかき取りへら）を用いて充填し約８０℃で
ペーストの仮乾燥を行なった。さらにペーストの上下面
にステンレス板にて、ｌ０Ｋｇ ／ ｃＪの加圧を行な
いペーストの充填密度をあげた。しかる後、３２０番の
ベルト研磨にて穴上部の不要ペーストを平坦化除去後、
１５０℃の乾燥炉で充分ペーストを硬化した後、無電解
めっきで厚さ１５μｍの銅めっき層６を形成した。第３
図はめっき後のプリント基板の断面構造を示す。その後
、写真法により所定のパターンのエツチングマスクを形
成し、エツチングを行なった所、スルーホール上部が平
坦で高密度なパターンが形成できた。さらに半田付はラ
ンドを除く全面にソルダーレジスト膜を印刷法により形
成し、プリフラックスを塗布して本発明の面付用プリン
ト配線基板を完成した。[Example 1] An example of the present invention will be described below with reference to FIGS. 1 to 3. After drilling a hole in a glass epoxy laminate having 18 μm copper foil 2 on both sides at the predetermined position that will become the through hole portion 3, the state in which through hole plating 4 is formed using a combination of electroless steel plating and electrolytic copper plating is shown. Shown in Figure 2. Thereafter, a paste consisting of approximately 85 wt% copper powder with a particle size of 5 to 10 μm and the remainder epoxy resin was filled into the through hole using a metal mask using a squeegee (a scraping spatula that scrapes ink through a screen) at approximately 80°C. The paste was temporarily dried. Further, a pressure of 10 kg/cJ was applied to the upper and lower surfaces of the paste using stainless steel plates to increase the filling density of the paste. After that, remove the unnecessary paste on the top of the hole by polishing with No. 320 belt,
After the paste was sufficiently cured in a drying oven at 150° C., a copper plating layer 6 having a thickness of 15 μm was formed by electroless plating. Third
The figure shows the cross-sectional structure of the printed circuit board after plating. Thereafter, an etching mask with a predetermined pattern was formed using a photographic method, and etching was performed, resulting in the formation of a high-density pattern with flat upper portions of the through holes. Furthermore, for soldering, a solder resist film was formed on the entire surface except for the lands by a printing method, and preflux was applied to complete the printed wiring board for surface mounting of the present invention.
さらに、完成した基板上に半田クリームをランド部のみ
に印刷塗布してチップ部品８をマウント後、赤外線リフ
ロー炉で半田付けを行なった所、本発明の目的である高
密度で信頼性の高いハイブリットＩＣ基板が完成した。Furthermore, after mounting the chip component 8 by printing and applying solder cream only on the land portions of the completed board, soldering was performed in an infrared reflow oven. The IC board has been completed.
第１図にスルーホール上部に面付部品を半田付けした後
のプリント配線基板の断面構造を示した。FIG. 1 shows the cross-sectional structure of the printed wiring board after soldering the surface-mounted parts above the through-holes.
各図において、１はプリント配線基板の素材、５は充填
物、７は半田である。In each figure, 1 is the material of the printed wiring board, 5 is the filler, and 7 is the solder.
［発明の効果コ
本発明によれば、従来高密度実装に不要となっていたス
ルーホール穴の上部にも、リードレスの面付部品の半田
付けが可能となり、従来の高密度な基板に比べて、さら
に１，５〜２，０倍程度の高集積なハイブリッドＩＣが
得られる。[Effects of the Invention] According to the present invention, leadless surface-mounted components can be soldered to the upper part of through-hole holes, which were previously unnecessary for high-density mounting, and it is easier to solder than conventional high-density boards. As a result, a hybrid IC that is 1.5 to 2.0 times more highly integrated can be obtained.
第１図は本発明の一実施例におけるプリント配線基板を
示す断面図、第２図および第３図は本発明の一実施例に
おけるプリント配線基板の製造工程を示す断面図である
。
２・・・銅箔、３・・・スルーホール部、４・・・スル
ーホールめっき、５・・・充填物、６・・・めっき層、
７・・・半田。FIG. 1 is a cross-sectional view showing a printed wiring board according to an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views showing the manufacturing process of the printed wiring board according to an embodiment of the present invention. 2... Copper foil, 3... Through-hole part, 4... Through-hole plating, 5... Filler, 6... Plating layer,
7...Solder.
Claims (7)
いて、該スルーホール内を、少なくとも一方の露出面が
半田付性を有する充填物で、充填してなることを特徴と
するプリント配線基板。1. 1. A printed wiring board having through-hole plating, characterized in that the inside of the through-hole is filled with a filler having at least one exposed surface having solderability.
、ｉｉ）充填物本体からなり、該露出面は半田付性を有
するめっき層からなり、該充填物本体は樹脂ペースト、
もしくは金属粉を含有する樹脂ペーストからなることを
特徴とする請求項１記載のプリント配線基板。2. The filler includes i) the exposed surface having solderability, and ii) a filler body, the exposed surface includes a plating layer having solderability, and the filler body includes a resin paste,
2. The printed wiring board according to claim 1, wherein the printed wiring board is made of a resin paste containing metal powder.
ール樹脂系からなる請求項２記載のプリント配線基板。3. 3. The printed wiring board according to claim 2, wherein the resin paste is made of an epoxy resin or a phenol resin.
択した少なくとも１金属元素からなることを特徴とする
請求項２もしくは３記載のプリント配線基板。4. 4. The printed wiring board according to claim 2, wherein the metal powder comprises at least one metal element selected from the group consisting of copper and nickel.
なることを特徴とする請求項１記載のプリント配線基板
。5. 2. The printed wiring board according to claim 1, wherein said filler is made of a material having electrical conductivity and solderability.
請求項５記載のプリント配線基板。6. 6. The printed wiring board according to claim 5, wherein said filler is made of a solder alloy.
ペーストからなることを特徴とする請求項５記載のプリ
ント配線基板。7. 6. The printed wiring board according to claim 5, wherein the filler is made of a metal powder-containing resin paste having solderability.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20504390A JPH0491489A (en) | 1990-08-03 | 1990-08-03 | Printed wiring board |
| US07/735,836 US5243142A (en) | 1990-08-03 | 1991-07-25 | Printed wiring board and process for producing the same |
| DE4125879A DE4125879C2 (en) | 1990-08-03 | 1991-08-05 | Printed circuit boards and processes for their manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20504390A JPH0491489A (en) | 1990-08-03 | 1990-08-03 | Printed wiring board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3858997A Division JPH09321402A (en) | 1997-02-07 | 1997-02-07 | Printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0491489A true JPH0491489A (en) | 1992-03-24 |
Family
ID=16500505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20504390A Pending JPH0491489A (en) | 1990-08-03 | 1990-08-03 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0491489A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243728A (en) * | 1991-12-27 | 1993-09-21 | Tokuyama Soda Co Ltd | Manufacture of circuit board |
| JPH05275819A (en) * | 1992-01-31 | 1993-10-22 | Tatsuta Electric Wire & Cable Co Ltd | Printed wiring board |
| EP0727926A2 (en) * | 1995-02-17 | 1996-08-21 | International Business Machines Corporation | Multilayer printed writing board and method of manufacturing such a board |
| JP2002084070A (en) * | 2000-09-08 | 2002-03-22 | Hitachi Aic Inc | Multilayer wiring board incorporating electronic part |
| KR20020025557A (en) * | 2000-09-29 | 2002-04-04 | 전세호 | PCB manufacturing method |
| US6555756B2 (en) | 2000-05-16 | 2003-04-29 | Hitachi Aic, Inc. | Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof |
-
1990
- 1990-08-03 JP JP20504390A patent/JPH0491489A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243728A (en) * | 1991-12-27 | 1993-09-21 | Tokuyama Soda Co Ltd | Manufacture of circuit board |
| JPH05275819A (en) * | 1992-01-31 | 1993-10-22 | Tatsuta Electric Wire & Cable Co Ltd | Printed wiring board |
| EP0727926A2 (en) * | 1995-02-17 | 1996-08-21 | International Business Machines Corporation | Multilayer printed writing board and method of manufacturing such a board |
| EP0727926A3 (en) * | 1995-02-17 | 1998-01-07 | International Business Machines Corporation | Multilayer printed writing board and method of manufacturing such a board |
| US5956843A (en) * | 1995-02-17 | 1999-09-28 | International Business Machines | Multilayer printed wiring board and method of making same |
| US6555756B2 (en) | 2000-05-16 | 2003-04-29 | Hitachi Aic, Inc. | Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof |
| JP2002084070A (en) * | 2000-09-08 | 2002-03-22 | Hitachi Aic Inc | Multilayer wiring board incorporating electronic part |
| KR20020025557A (en) * | 2000-09-29 | 2002-04-04 | 전세호 | PCB manufacturing method |
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