JPH0248152B2 - INSATSUHAISENBANNOSEIZOHOHO - Google Patents
INSATSUHAISENBANNOSEIZOHOHOInfo
- Publication number
- JPH0248152B2 JPH0248152B2 JP2719984A JP2719984A JPH0248152B2 JP H0248152 B2 JPH0248152 B2 JP H0248152B2 JP 2719984 A JP2719984 A JP 2719984A JP 2719984 A JP2719984 A JP 2719984A JP H0248152 B2 JPH0248152 B2 JP H0248152B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- insulating substrate
- hole
- holes
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 29
- 239000003054 catalyst Substances 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000007788 roughening Methods 0.000 claims description 10
- 239000000839 emulsion Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
本発明は印刷配線板の製造方法に関するもので
ある。
従来、CC―４法等のような無電解めつきによ
り回路を形成して印刷配線板を製造する場合、絶
縁基板の表面に予めめつき触媒入りの接着剤層を
設ける。この場合、絶縁基板にスルーホールが形
成されるものにあつては、スルーホールを形成し
た後、無電解めつき処理をする前に、めつき触媒
をスルーホールに付着する処理を行なつている。
ところで、通常、接着剤層と無電解めつき処理
により形成されためつきの回路との接着力を向上
するために、スルーホールにめつき触媒を付着し
た後に、接着剤層を粗化している。接着剤層の粗
化は、絶縁基板を硼弗化水素酸溶液や無水クロム
酸硫酸系溶液等の粗化液に浸漬することにより行
なつているが、この浸漬処理によりスルーホール
に付着しためつき触媒がほとんど洗い流されてし
まう。従つて、後に無電解めつき処理を行なつて
もスルーホールの箇所に、めつきが析出するのに
時間が掛かり、析出しためつき膜は薄く剥離強度
が小さい。そのため、半田デイツプ等によりラン
ドに半田めつきをしたりさらに電子部品を接続す
る場合等に絶縁基板内のガスがスルーホールのめ
つき膜を剥離して放出されスルーホール内に充満
し、半田がスルーホール内部から押し出されて入
口の表面のみを被う状態（以下ブローホールとい
う）になる。このような状態になると、電子部品
の接続不良が発生し易くなり、また、接着力も低
下し易くなる欠点があつた。
本発明は、以上の欠点を改良し、スルーホール
内のめつき析出を容易にし製造時間を短縮しうる
とともにブローホールを防止して信頼性の高い印
刷配線板の製造方法の提供を目的とするものであ
る。
本発明は、上記の目的を達成するために、絶縁
基板にめつき触媒を含む接着剤層を設ける工程
と、スルーホールを設ける工程と、該スルーホー
ルにめつき触媒を付着する工程とを順次行ない無
電解めつきによつて前記絶縁基板に所定の回路及
びスルーホールを形成する印刷配線板の製造方法
において、スルーホールを設けた後、該スルーホ
ールの内周面に熱硬化性樹脂層を設ける工程を施
し、該工程後に該樹脂層にめつき触媒を付着し、
絶縁基板を粗化液に浸漬して粗化することを特徴
とする印刷配線板の製造方法を提供するものであ
る。
以下、本発明を実施例に基づいて説明する。
先ず、第１図に示す通り、紙―フエノール樹脂
基材や紙―エポキシ樹脂基材からなる絶縁基板１
にパラジウム等のめつき触媒入りの接着剤を塗布
して接着剤層２を形成する。次に、第２図に示す
通り、この接着剤層２が形成された絶縁基板１を
パンチして所定のスルーホール３を形成する。ス
ルーホール３形成後、絶縁基板１の表面を整面
し、高圧水洗をしてパンチによる基板カスを除去
する。この水洗後の絶縁基板１を特に熱硬化性樹
脂の乳濁液中に浸漬して、第３図に示す通り、ス
ルーホール３の内周面に厚さ２〜10μ程度の熱硬
化性の樹脂層４を設ける。熱硬化性樹脂として
は、エポキシ樹脂やウレタン樹脂、ポリエステル
樹脂等を用いるが、絶縁基板１がフエノール樹脂
系あるいはエポキシ樹脂系のものの場合には、エ
ポキシ樹脂が基板との密着性がよく好ましい。ま
た、硬化剤としては、アミン系のものが安定した
乳濁液が得られるので好ましい。絶縁基板１を、
乳濁液中に浸漬した後取り出して、絞りローラに
より表面の乳濁液を除去し、さらに高温雰囲気中
に通して乾燥スルーホール３の内周面に設けられ
た熱硬化性樹脂層４を半硬化の状態にする。樹脂
層４を半硬化した後、絶縁基板１をパラジウム等
のめつき触媒の溶液中に浸漬して、第４図に示す
通り、樹脂層４表面にめつき触媒５を付着する。
樹脂層４表面にめつき触媒５を付着した後、めつ
きレジストインクを所定のパターンに塗布・乾燥
して、第５図に示す通り、めつきレジスト層６を
設け、同時に樹脂層４を硬化する。めつきレジス
ト層６を設けた後、絶縁基板１を硼弗化水素酸溶
液や無水クロム酸硫酸系溶液からなる粗化液に浸
漬し、第６図に示す通り、接着剤層２を粗化す
る。接着剤層２を粗化した後、絶縁基板１を無電
解銅めつき溶液中に浸漬して、第７図に示す通
り、所定のパターンにめつきを析出し回路７を形
成する。回路７を形成後、通常の方法で絶縁基板
１を処理し製造する。
すなわち、上記実施例によれば、スルーホール
３にめつき触媒を付着する前に、スルーホール３
内周面に熱硬化性の樹脂層４を設けこの樹脂を加
熱して半硬化の状態にしているため、従来、絶縁
基板１の面に直接付着していためつき触媒５が半
硬化状態の樹脂層４に付着しその後に樹脂層４が
硬化され、めつき触媒５が強固に樹脂層４に付着
する。従つて、その後に、絶縁基板１を粗化液中
に浸漬してもめつき触媒５はほとんど除去される
ことがなく、無電解銅めつき処理においてスルー
ホール３内にめつきが有効に析出しめつき処理時
間が短縮される。
また、半田めつき処理等をした場合にも、スル
ーホール３内周面に樹脂層４が密着しているため
に、絶縁基板１内のガスがスルーホール３内周面
から放出されるのが防止でき、ブローホールの発
生を防止できる。
なお、スルーホール内周面に設けた樹脂層を硬
化状態にしてめつき触媒を付着してもよく、半硬
化状態よりは付着率は低いが、基板に直接付着す
る場合よりはブローホール等が改善される。
次に、本発明と従来例とについて、スルーホー
ル内のめつき付着性、ブローホール発生率、スル
ーホール信頼性を測定したところ表の通りの結果
が得られた。
The present invention relates to a method of manufacturing a printed wiring board. Conventionally, when manufacturing a printed wiring board by forming a circuit by electroless plating such as the CC-4 method, an adhesive layer containing a catalyst is preliminarily provided on the surface of an insulating substrate. In this case, if through holes are formed in the insulating substrate, after the through holes are formed and before electroless plating, a process is performed to attach a plating catalyst to the through holes. . By the way, in order to improve the adhesion between the adhesive layer and the plating circuit formed by electroless plating, the adhesive layer is usually roughened after a plating catalyst is attached to the through-holes. The adhesive layer is roughened by immersing the insulating substrate in a roughening solution such as a borohydrofluoric acid solution or an anhydrous chromic acid/sulfuric acid solution, but this immersion process prevents the adhesive layer from adhering to the through holes. Most of the catalyst is washed away. Therefore, even if an electroless plating process is performed later, it takes time for the plating to precipitate at the through holes, and the deposited plating film is thin and has low peel strength. Therefore, when applying solder to a land using a solder dip, etc., or when connecting an electronic component, the gas in the insulating substrate peels off the plating film of the through hole and is released, filling the through hole and causing the solder to evaporate. It is pushed out from inside the through hole and covers only the surface of the entrance (hereinafter referred to as a blow hole). In such a state, there are disadvantages in that connection failures of electronic components are likely to occur and adhesive strength is also likely to decrease. The present invention aims to improve the above-mentioned drawbacks and provide a method for manufacturing a printed wiring board that facilitates plating deposition in through-holes, shortens manufacturing time, prevents blowholes, and has high reliability. It is something. In order to achieve the above object, the present invention sequentially includes a step of providing an adhesive layer containing a plating catalyst on an insulating substrate, a step of providing a through hole, and a step of attaching a plating catalyst to the through hole. In the method for manufacturing a printed wiring board in which a predetermined circuit and through holes are formed on the insulating substrate by electroless plating, after the through holes are formed, a thermosetting resin layer is formed on the inner peripheral surface of the through holes. applying a plating catalyst to the resin layer after the step,
The present invention provides a method for manufacturing a printed wiring board, which is characterized by roughening an insulating substrate by immersing it in a roughening liquid. Hereinafter, the present invention will be explained based on examples. First, as shown in FIG. 1, an insulating substrate 1 made of a paper-phenol resin base material or a paper-epoxy resin base material is prepared.
An adhesive containing a plating catalyst such as palladium is applied to the adhesive layer 2 to form an adhesive layer 2. Next, as shown in FIG. 2, predetermined through holes 3 are formed by punching the insulating substrate 1 on which the adhesive layer 2 is formed. After the through-holes 3 are formed, the surface of the insulating substrate 1 is leveled and washed with high-pressure water to remove substrate debris caused by punching. The insulating substrate 1 after washing with water is immersed in a thermosetting resin emulsion, and as shown in FIG. Layer 4 is provided. As the thermosetting resin, epoxy resin, urethane resin, polyester resin, etc. are used, but when the insulating substrate 1 is made of phenol resin or epoxy resin, epoxy resin is preferred because of its good adhesion to the substrate. Furthermore, as the curing agent, amine-based curing agents are preferable because a stable emulsion can be obtained. Insulating substrate 1,
After being immersed in the emulsion, it is taken out, the emulsion on the surface is removed using a squeezing roller, and the thermosetting resin layer 4 provided on the inner circumferential surface of the drying through hole 3 is half-filled by passing it through a high temperature atmosphere. Bring to a hardened state. After semi-curing the resin layer 4, the insulating substrate 1 is immersed in a solution of a plating catalyst such as palladium, and the plating catalyst 5 is adhered to the surface of the resin layer 4, as shown in FIG.
After depositing the plating catalyst 5 on the surface of the resin layer 4, a plating resist ink is applied in a predetermined pattern and dried to form a plating resist layer 6 as shown in FIG. 5, and at the same time the resin layer 4 is cured. do. After forming the plating resist layer 6, the insulating substrate 1 is immersed in a roughening solution consisting of a borofluoric acid solution or an anhydrous chromic acid/sulfuric acid solution to roughen the adhesive layer 2, as shown in FIG. do. After roughening the adhesive layer 2, the insulating substrate 1 is immersed in an electroless copper plating solution to deposit plating in a predetermined pattern to form a circuit 7, as shown in FIG. After forming the circuit 7, the insulating substrate 1 is processed and manufactured using a conventional method. That is, according to the above embodiment, before the plating catalyst is attached to the through hole 3, the through hole 3 is
Since the thermosetting resin layer 4 is provided on the inner circumferential surface and the resin is heated to a semi-cured state, conventionally the glazing catalyst 5 directly attached to the surface of the insulating substrate 1 is made of semi-cured resin. After adhering to the layer 4, the resin layer 4 is cured, and the plating catalyst 5 is firmly attached to the resin layer 4. Therefore, even if the insulating substrate 1 is subsequently immersed in a roughening solution, the plating catalyst 5 is hardly removed, and plating is effectively deposited inside the through holes 3 in the electroless copper plating process. The processing time is shortened. Furthermore, even when soldering is performed, the resin layer 4 is in close contact with the inner circumferential surface of the through hole 3, so that the gas in the insulating substrate 1 is prevented from being released from the inner circumferential surface of the through hole 3. It is possible to prevent blowholes from occurring. Note that the plating catalyst may be attached to the resin layer provided on the inner circumferential surface of the through hole in a hardened state. Although the adhesion rate is lower than in a semi-cured state, blowholes etc. are more likely to occur than when directly attached to the substrate. Improved. Next, the plating adhesion in the through holes, blowhole occurrence rate, and through hole reliability were measured for the present invention and the conventional example, and the results shown in the table were obtained.
【表】【table】
【表】
スルーホール内のめつき付着性はスルーホール
内壁全面にめつきが析出するまでの時間、ブロー
ホール発生率は半田あげ条件を240℃、５秒とし、
また、スルーホール信頼性はMIL―107D（−65
℃、30分〜125℃、30分のサイクルによる熱衝撃
テスト）により抵抗値が10％増加するサイクル数
とする。
また、製造条件は、実施例１）が、
(a) 絶縁基板：めつき触媒入りのニトリルゴムフ
エノール樹脂系の基板にめつき触媒入りの接着
剤層を積層したもの（日立化成工業株式会社製
ACL―141）、
(b) 乳濁液：エポキシ樹脂からなる濃度１％の液
（カネボウ製エポルジヨンEA―１の固形分100
重量部に対し硬化剤EB―１を80重量部添加し
濃度１％に稀釈）、
(c) 半硬化条件：100℃の高温雰囲気中に10秒間
放置する、
(d) めつき触媒：日立化成工業株式会社HS―
101B、
(e) めつきレジスト処理：めつきレジストインク
（日立化成工業株式会社製HGM―02BK―１）
をスクリーン印刷し、温度200℃の雰囲気中に
５分間放置する、
(f) 粗化液：CrO330ｇ／、濃H2SO4300ml／
及びNaF30ｇ／、
からなる。また、
実施例２）は、実施例１）において乳濁液の濃
度を２％とし、
実施例３）は、実施例１）において絶縁基板を
めつき触媒の入つていない基板（日立化成工業株
式会社製LP―41）とし、
実施例４）は、実施例１）において粗化液を硼
弗化水素酸系とし、
従来例１）は、実施例１）においてスルーホー
ル内周面への樹脂層の形成処理を省略し、
従来例２）は、実施例３）においてスルーホー
ル内周面への樹脂層の形成処理を省略し、
従来例３）は、実施例４）においてスルーホー
ル内周面への樹脂層の形成処理を省略したもので
ある。
表から明らかな通り、本発明によれば従来例に
比べて、スルーホール内のめつき付着性は40％以
上短縮され、めつき析出速度が早くなり、ブロー
ホール発生率は27％以下に減少し、スルーホール
の信頼性は約1.1倍以上向上しており、各特性と
も改善されている。
なお、乳濁液の濃度は好ましくは0.3〜5wt％が
良く、0.3wt％未満では効果が低い、5wt％を越
えるとスルーホールの径によつては液がスルーホ
ールの表面を覆うことがある。
以上の通り、本発明によれば、スルーホール内
に予め樹脂層を設けこの樹脂層にめつき触媒を強
固に付着することによりスルーホール内周面にめ
つきを早く析出でき製造時間を短縮しうるととも
にブローホールの発生率が低く信頼性の高い印刷
配線板の製造方法が得られる。[Table] The adhesion of plating inside the through-hole is determined by the time required for plating to deposit on the entire inner wall of the through-hole, and the blowhole occurrence rate is determined by setting the soldering conditions at 240°C for 5 seconds.
In addition, through-hole reliability is MIL-107D (-65
℃, 30 minutes to 125℃, 30 minutes cycle thermal shock test) is the number of cycles at which the resistance value increases by 10%. The manufacturing conditions of Example 1) were as follows: (a) Insulating substrate: An adhesive layer containing a plating catalyst was laminated on a nitrile rubber phenol resin substrate containing a plating catalyst (manufactured by Hitachi Chemical Co., Ltd.).
ACL-141), (b) Emulsion: 1% concentration liquid consisting of epoxy resin (solid content 100% of Epolsion EA-1 manufactured by Kanebo)
Add 80 parts by weight of hardening agent EB-1 and dilute to 1% concentration), (c) Semi-curing conditions: Leave in a high temperature atmosphere of 100°C for 10 seconds, (d) Plating catalyst: Hitachi Chemical HS Industrial Co., Ltd.
101B, (e) Plating resist treatment: Plating resist ink (HGM-02BK-1 manufactured by Hitachi Chemical Co., Ltd.)
Screen print and leave in an atmosphere at a temperature of 200℃ for 5 minutes. (f) Roughening liquid: 30g/concentrated H 2 SO 4 / 300g/ CrO 3
and NaF30g/. In addition, in Example 2), the concentration of the emulsion was 2% in Example 1), and in Example 3), in Example 1), the insulating substrate was plated and a substrate containing no catalyst (Hitachi Chemical Co., Ltd. LP-41) made by Co., Ltd., and in Example 4), the roughening liquid was borohydrofluoric acid based in Example 1), and in Conventional Example 1), in Example 1), the roughening liquid was applied to the inner peripheral surface of the through hole. Conventional Example 2) omitted the process of forming a resin layer on the inner peripheral surface of the through hole in Example 3), and Conventional Example 3) omitted the process of forming the resin layer on the inner peripheral surface of the through hole in Example 4). The process of forming a resin layer on the peripheral surface is omitted. As is clear from the table, according to the present invention, compared to the conventional example, the plating adhesion inside the through hole is reduced by more than 40%, the plating precipitation rate is increased, and the blowhole occurrence rate is reduced to 27% or less. However, the reliability of the through-hole has improved by more than 1.1 times, and all characteristics have been improved. The concentration of the emulsion is preferably 0.3 to 5wt%; less than 0.3wt% is less effective; if it exceeds 5wt%, the liquid may cover the surface of the through-hole depending on the diameter of the through-hole. . As described above, according to the present invention, by providing a resin layer in advance in the through hole and firmly adhering the plating catalyst to this resin layer, plating can be quickly deposited on the inner peripheral surface of the through hole, reducing manufacturing time. A method for manufacturing a printed wiring board that is highly reliable and has a low blowhole occurrence rate can be obtained.
第１図〜第７図は本発明実施例の製造工程を示
し、第１図は接着剤層を設けた絶縁基板の断面
図、第２図はスルーホールを形成した絶縁基板の
断面図、第３図は樹脂層を設けた絶縁基板の断面
図、第４図はめつき触媒を付着した絶縁基板の断
面図、第５図はめつきレジスト層を設けた絶縁基
板の断面図、第６図は接着剤層を粗化した絶縁基
板の断面図、第７図は回路を形成した絶縁基板の
断面図を示す。
１…絶縁基板、２…接着剤層、３…スルーホー
ル、４…樹脂層、５…めつき触媒、６…めつきレ
ジスト層、７…回路。
1 to 7 show the manufacturing process of an embodiment of the present invention, in which FIG. 1 is a sectional view of an insulating substrate provided with an adhesive layer, FIG. Figure 3 is a cross-sectional view of an insulating substrate with a resin layer provided, Figure 4 is a cross-sectional view of an insulating substrate with a plating catalyst attached, Figure 5 is a cross-sectional view of an insulating substrate with a plating resist layer, and Figure 6 is a cross-sectional view of an insulating substrate with a plating resist layer attached. FIG. 7 shows a cross-sectional view of an insulating substrate with a roughened agent layer, and FIG. 7 shows a cross-sectional view of an insulating substrate with a circuit formed thereon. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Adhesive layer, 3... Through hole, 4... Resin layer, 5... Plating catalyst, 6... Plating resist layer, 7... Circuit.
Claims (1)
る工程と、スルーホールを設ける工程と、該スル
ーホールにめつき触媒を付着する工程とを順次行
ない、無電解めつきによつて前記絶縁基板に所定
の回路及びスルーホールを形成する印刷配線板の
製造方法において、スルーホールを設けた後、絶
縁基板を熱硬化性の乳濁液中に浸漬し、該スルー
ホールの内周面に熱硬化性樹脂層を設ける工程を
施し、該工程後に熱硬化性樹脂層にめつき触媒を
付着し、めつきレジスト層を設けた後、絶縁基板
を粗化液に浸漬して接着剤層を粗化することを特
徴とする印刷配線板の製造方法。1. A step of providing an adhesive layer containing a plating catalyst on an insulating substrate, a step of providing a through hole, and a step of attaching a plating catalyst to the through hole are sequentially performed, and the insulating substrate is bonded by electroless plating. In a method of manufacturing a printed wiring board in which a predetermined circuit and through holes are formed in a printed wiring board, after the through holes are formed, an insulating substrate is immersed in a thermosetting emulsion, and a thermosetting emulsion is applied to the inner peripheral surface of the through hole. After this step, a plating catalyst is attached to the thermosetting resin layer, a plating resist layer is provided, and the insulating substrate is immersed in a roughening liquid to roughen the adhesive layer. A method for manufacturing a printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2719984A JPH0248152B2 (en) | 1984-02-17 | 1984-02-17 | INSATSUHAISENBANNOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2719984A JPH0248152B2 (en) | 1984-02-17 | 1984-02-17 | INSATSUHAISENBANNOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60171787A JPS60171787A (en) | 1985-09-05 |
| JPH0248152B2 true JPH0248152B2 (en) | 1990-10-24 |
Family
ID=12214417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2719984A Expired - Lifetime JPH0248152B2 (en) | 1984-02-17 | 1984-02-17 | INSATSUHAISENBANNOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0248152B2 (en) |
-
1984
- 1984-02-17 JP JP2719984A patent/JPH0248152B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60171787A (en) | 1985-09-05 |
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