JPH0248153B2 - INSATSUHAISENBANNOSEIZOHOHO - Google Patents
INSATSUHAISENBANNOSEIZOHOHOInfo
- Publication number
- JPH0248153B2 JPH0248153B2 JP10337584A JP10337584A JPH0248153B2 JP H0248153 B2 JPH0248153 B2 JP H0248153B2 JP 10337584 A JP10337584 A JP 10337584A JP 10337584 A JP10337584 A JP 10337584A JP H0248153 B2 JPH0248153 B2 JP H0248153B2
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- plating
- insulating substrate
- holes
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 34
- 229920001187 thermosetting polymer Polymers 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 24
- 239000003054 catalyst Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000839 emulsion Substances 0.000 claims description 12
- 238000007788 roughening Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007772 electroless plating Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
（産業上の利用分野）
本発明は、アデイテイブ法による印刷配線板の
製造方法に関するものである。
（従来の技術）
従来、CC―４法等のようなアデイテイブ法に
より無電解めつきして回路を形成し印刷配線板を
製造する場合、絶縁基板の表面に予め、めつき触
媒入り接着剤層を設けている。この場合、絶縁基
板にスルーホール用の孔が設けられているものに
あつては、孔を設けた後、無電解めつき処理をす
る前に、めつき触媒を孔に付着する処理を行なつ
ている。
（発明が解決しようとする課題）
ところで、通常、接着剤層と無電解めつき処理
により形成されためつきの回路との接着力を向上
するために、孔にめつき触媒を付着した後に、接
着剤層を粗化している。接着剤層の粗化は、絶縁
基板を硼弗化水素酸溶液や無水クロム酸硫酸系溶
液等の粗化液に浸漬することにより行なつている
が、この浸漬処理により孔に付着しためつき触媒
がほとんど洗い流されてしまう。従つて、後に無
電解めつき処理を行なつても孔の箇所に、めつき
が析出するのに時間が掛かり、析出しためつき膜
は薄く剥離強度が小さいという欠点があつた。そ
のため、半田デイツプ等によりランドに半田めつ
きをしたりさらに電子部品を接続する場合等に絶
縁基板内のガスが孔壁のめつき膜を剥離して孔内
に充満し、半田が孔内部から押し出されて入口の
表面のみを被う状態（以下ブローホールという）
になる。このような状態になると、電子部品の接
続不良が発生し易くなり、また、接着力も低下し
易くなる欠点があつた。
（課題を解決するための手段）
本発明は、上記の目的を達成するために、スル
ーホール用の孔を有しめつき触媒入り接着剤が塗
布された絶縁基板に無電解めつき法により所定の
回路を形成しうる印刷配線板の製造方法におい
て、絶縁基板を熱硬化性樹脂中に浸漬して孔壁面
に熱硬化性樹脂を塗布する工程と、該工程後に５
ｍ／sec以下の風速の熱風により孔壁に付着した
熱硬化性樹脂を半硬化状態にする工程と、めつき
触媒を付着した後前記熱硬化性樹脂層を加熱する
工程と、熱硬化性樹脂を硬化後粗化液で接着剤層
を粗化する工程とを施すことを特徴とする印刷配
線板の製造方法を提供するものである。
（作用）
すなわち、本発明は、絶縁基板に設けられたス
ルーホール用の孔の壁面に予め熱硬化性樹脂層を
設け、これにめつき触媒を付着しており、壁面に
直接に付着した場合よりも付着力が強く、特に熱
硬化性樹脂層が未硬化の状態でめつき触媒を付着
した場合にその効果が著しい。従つて、その後
に、絶縁基板を粗化液に浸漬しても、熱硬化性樹
脂層に付着しためつき触媒はほとんど剥離しな
い。しかも、熱硬化性樹脂を半硬化あるいは硬化
させるのに、この樹脂が除去されない程度の風速
の熱風を用いているため、孔壁にはまんべん無く
熱硬化性樹脂が付着しており、それ故、めつき触
媒も孔壁に欠けること無く充分に付着する。そし
て絶縁基板に無電解めつき処理を施すことにより
孔壁にまんべん無く充分な厚さのめつきが短時間
に析出しめつき層が形成される。しかも、絶縁基
板内のガスが孔壁を通して放出されるのを熱硬化
性樹脂層により防止できるために、半田めつき処
理をした場合のブローホール等の欠点が防止され
るとともに孔壁面へのめつき析出速度を早めるこ
とができる。
（実施例）
以下、本発明を実施例に基づいて説明する。
先ず、第１図に示す通り、紙―フエノール樹脂
基材や紙―エポキシ樹脂基材からなる絶縁基板１
にパラジウム等のめつき触媒入りの接着剤を塗布
して接着剤層２を形成する。次に、第２図に示す
通り、この接着剤層２が形成された絶縁基板１を
パンチして所定のスルーホール用の孔３を形成す
る。孔３形成後、絶縁基板１の表面を整面し、高
圧水洗をしてパンチによる基板カスを除去する。
この水洗後の絶縁基板１を特に熱硬化性樹脂のエ
マルジヨン中に浸漬し、第３図に示す通り、孔３
の壁面に厚さ２〜10μ程度の熱硬化性の樹脂層４
を設ける。熱硬化性樹脂としては、エポキシ樹脂
やウレタン樹脂、ポリエステル樹脂等を用いる
が、絶縁基板１がフエノール樹脂系あるいはエポ
キシ樹脂系のものの場合には、エポキシ樹脂が基
板との密着性がよく好ましい。また、硬化剤とし
ては、アミン系のものが安定したエマルジヨンが
得られるので好ましく、その濃度としては0.3〜
5wt％の範囲のものが特に好ましい。すなわち、
0.3wt％未満の濃度では硬化剤としての効果が低
くなつて樹脂が硬化し難くなり、また5wt％より
多いと孔を塞ぐように樹脂が被覆されることがあ
り、除去作業が必要となり作業上好ましくない。
絶縁基板１をエマルジヨン中に浸漬した後、絞り
ローラやバフにより表面のエマルジヨンを除去す
る。表面のエマルジヨンを除去した後、扇風機等
により強制的に加熱された空気を５ｍ／sec以下
の熱風により孔壁に付着した熱硬化性樹脂を加熱
乾燥して半硬化状態にする。熱硬化性樹脂を半硬
化した後、絶縁基板１をめつき触媒溶液中に浸漬
し、第４図に示す通り、めつき触媒５を付着し、
取り出して熱硬化性樹脂４を加熱して硬化させ
る。熱硬化性樹脂４を硬化後、硼弗化水素酸溶液
や無水クロム酸硫酸系溶液からなる粗化液に絶縁
基板１を浸漬し、第５図に示す通り、接着剤層２
を粗化する。接着剤層２を粗化した後、接着剤層
２表面にめつきレジストインクを所定のパターン
に塗布・乾燥し、第６図に示す取り、めつきレジ
スト層６を設ける。めつきレジスト層６形成後、
絶縁基板１を無電解銅めつき溶液中に浸漬し所定
のパターンにめつきを析出して、第７図に示す通
り、回路７を形成する。回路７を形成後、通常の
方法で絶縁基板１を処理し、印刷配線板を製造す
る。
次に、本発明と従来例とについて、スルーホー
ル用の孔内のめつき付着性、スルーホール信頼性
及びブローホール発生率を測定したところ表の通
りの結果が得られた。
(Industrial Application Field) The present invention relates to a method for manufacturing a printed wiring board using an additive method. (Prior art) Conventionally, when manufacturing a printed wiring board by forming a circuit by electroless plating using an additive method such as the CC-4 method, an adhesive layer containing a plating catalyst is applied on the surface of an insulating substrate in advance. has been established. In this case, if the insulating substrate has holes for through holes, after the holes are formed and before electroless plating, a plating catalyst is applied to the holes. ing. (Problem to be Solved by the Invention) By the way, in order to improve the adhesion between the adhesive layer and the plating circuit formed by electroless plating, after the plating catalyst is attached to the holes, the adhesive is The layer is roughened. The adhesive layer is roughened by dipping the insulating substrate in a roughening solution such as a borofluoric acid solution or an anhydrous chromic acid/sulfuric acid solution. Most of the catalyst is washed away. Therefore, even if an electroless plating treatment is performed later, it takes time for the plating to precipitate at the holes, and the deposited plating film is thin and has a low peel strength. Therefore, when applying solder to a land using a solder dip or connecting electronic components, gas in the insulating substrate peels off the plating film on the hole wall and fills the hole, causing solder to flow from inside the hole. A condition where it is pushed out and only covers the entrance surface (hereinafter referred to as a blowhole)
become. In such a state, there are disadvantages in that connection failures of electronic components are likely to occur and adhesive strength is also likely to decrease. (Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides a method for applying a predetermined method by electroless plating to an insulating substrate having holes for through holes and coated with a plating catalyst-containing adhesive. A method for manufacturing a printed wiring board on which a circuit can be formed includes a step of immersing an insulating substrate in a thermosetting resin and applying the thermosetting resin to the hole wall surface, and a step of 5 after the step.
A step of semi-curing the thermosetting resin attached to the hole wall with hot air at a wind speed of m/sec or less, a step of heating the thermosetting resin layer after adhering the plating catalyst, and a step of heating the thermosetting resin layer after adhering the plating catalyst. The present invention provides a method for manufacturing a printed wiring board, which comprises the step of roughening the adhesive layer with a roughening liquid after curing the adhesive layer. (Function) That is, in the present invention, a thermosetting resin layer is provided in advance on the wall surface of a hole for a through hole provided in an insulating substrate, and a plating catalyst is attached to this layer. The adhesion force is stronger than that of the thermosetting resin layer, and the effect is particularly remarkable when the plating catalyst is attached to the thermosetting resin layer in an uncured state. Therefore, even if the insulating substrate is subsequently immersed in a roughening liquid, the hardening catalyst attached to the thermosetting resin layer is hardly peeled off. Moreover, because hot air is used to semi-cure or harden the thermosetting resin at a speed that does not remove the resin, the thermosetting resin adheres evenly to the hole walls. Therefore, the plating catalyst also adheres sufficiently to the pore walls without chipping. Then, by subjecting the insulating substrate to electroless plating treatment, plating of a sufficient thickness is deposited evenly on the hole wall in a short time to form a plating layer. Moreover, since the thermosetting resin layer can prevent the gas in the insulating substrate from being released through the hole walls, defects such as blowholes caused by solder plating can be prevented, and the holes can be tightened to the hole wall surface. It is possible to accelerate the deposition rate. (Examples) Hereinafter, the present invention will be described based on Examples. First, as shown in FIG. 1, an insulating substrate 1 made of a paper-phenol resin base material or a paper-epoxy resin base material is prepared.
An adhesive containing a plating catalyst such as palladium is applied to the adhesive layer 2 to form an adhesive layer 2. Next, as shown in FIG. 2, holes 3 for predetermined through holes are formed by punching the insulating substrate 1 on which the adhesive layer 2 is formed. After forming the holes 3, the surface of the insulating substrate 1 is leveled and washed with high-pressure water to remove substrate debris caused by punching.
The insulating substrate 1 after washing with water is immersed in an emulsion of a thermosetting resin, and as shown in FIG.
Thermosetting resin layer 4 with a thickness of about 2 to 10μ on the wall surface of
will be established. As the thermosetting resin, epoxy resin, urethane resin, polyester resin, etc. are used, but when the insulating substrate 1 is made of phenol resin or epoxy resin, epoxy resin is preferred because of its good adhesion to the substrate. Furthermore, as the curing agent, an amine type curing agent is preferable because a stable emulsion can be obtained, and its concentration is 0.3~
Particularly preferred is a range of 5 wt%. That is,
If the concentration is less than 0.3wt%, the effect as a curing agent will be low and the resin will be difficult to harden.If the concentration is more than 5wt%, the resin may be coated so as to close the pores, making removal work necessary and making it difficult to work. Undesirable.
After the insulating substrate 1 is immersed in the emulsion, the emulsion on the surface is removed using a squeezing roller or a buff. After removing the emulsion on the surface, air forcibly heated by an electric fan or the like is heated to dry the thermosetting resin adhering to the hole wall with hot air of 5 m/sec or less to a semi-cured state. After semi-curing the thermosetting resin, the insulating substrate 1 is immersed in a plating catalyst solution, and a plating catalyst 5 is attached as shown in FIG.
It is taken out and the thermosetting resin 4 is heated and hardened. After curing the thermosetting resin 4, the insulating substrate 1 is immersed in a roughening solution consisting of a borohydrofluoric acid solution or an anhydrous chromic acid/sulfuric acid solution to form the adhesive layer 2 as shown in FIG.
coarsen. After roughening the adhesive layer 2, a plating resist ink is applied to the surface of the adhesive layer 2 in a predetermined pattern and dried to form a plating resist layer 6 as shown in FIG. After forming the plating resist layer 6,
The insulating substrate 1 is immersed in an electroless copper plating solution to deposit plating in a predetermined pattern to form a circuit 7 as shown in FIG. After forming the circuit 7, the insulating substrate 1 is processed in a conventional manner to produce a printed wiring board. Next, the plating adhesion inside the through-hole, the through-hole reliability, and the blowhole occurrence rate were measured for the present invention and the conventional example, and the results shown in the table were obtained.
【表】
スルーホール用の孔内のめつき付着性は孔内壁
全面にめつきが析出するまでの時間、スルーホー
ル信頼性はMIL―107D（−65℃、30分〜125℃、
30分のサイクルによる熱衝撃テスト）により抵抗
値が10％増加するサイクル数、ブローホール発生
率は半田あげ条件を240℃、５秒とする。
なお、製造条件は、実施例１）が、
ａ） 絶縁基板：エポキシ樹脂積層板にめつき触
媒入り接着剤（日立化成工業社製HA―04）を
塗布硬化したもの。
ｂ） 熱硬化性樹脂層形成工程：エポキシ樹脂エ
マルジヨン（カネボウNSC社製エポルジヨン
EA―１の固形分100重量部に対し硬化剤EB―
１を80重量部添加したもの）の濃度１％の液中
に浸漬後、バフで接着剤表面のエマルジヨンを
取り除き、さらに、100℃程度に加熱された風
速３ｍ／secの熱風により孔壁に付着した熱硬
化性樹脂を加熱し半硬化状態にする。
ｃ） めつき触媒付着工程：めつき触媒（日立化
成工業社製HS―101B）を塗布し、150℃の温
度で30分間加熱する。
ｄ） 粗化工程：硼弗化水素酸系粗化液により接
着剤層表面を粗化し、洗浄して乾燥する。
ｅ） めつきレジスト工程：めつきレジストイン
ク（日立化成工業社製HGM―02BK―１）を
スクリーン印刷し、160℃の温度で30分間加熱
して硬化する。
ｆ） 無電解めつき工程：通常の無電解めつき処
理（CC―４めつき処理）により、厚さ30μの銅
層を形成する。
実施例２）は、実施例１）において熱硬化性樹
脂の樹脂分100重量部に対してニトリルブタジエ
ン系ゴム（日本ゼオン社製ハイヤー1522）を10重
量部添加し、
実施例３）は、実施例１）において粗化液を硼
弗化水素酸系とし、
実施例４）は、実施例１）においてｂ）の工程
で表面のエマルジヨン除去後に100℃程度に加熱
された風速4.5ｍ／secの熱風により加熱し、
実施例５）は、実施例１）においてｂ）の工程
でエマルジヨン除去後に100℃程度に加熱された
風速５ｍ／secの熱風により加熱し、
実施例６）は、実施例１）においてｂ）の工程
でエマルジヨン除去後に100℃程度に加熱された
風速5.5ｍ／secの熱風により加熱し、
従来例は、実施例１）においてｂ）の工程を省
略したものである。
表から明らかな通り、本発明によれば、従来例
に比べてスルーホール用の孔壁面のめつき付着性
は約80％以上短縮されてめつき析出速度が５倍以
上早くなり、スルーホールの信頼性は約1.6倍以
上となり、ブローホール発生率は約87％減少して
いる。また、本発明によれば、熱風の風速は、５
ｍ／secを越すとめつき付着性が急激に増加する
ことが明らかであり、５ｍ／sec以下が好ましい。
（発明の効果）
以上の通り、本発明によれば、スルーホール用
の孔壁面に熱硬化性樹脂層をまんべん無く設ける
ことにより孔壁面へのめつき析出が早くなり製造
時間を短縮できるとともにブローホールの発生率
が低く信頼性の高い印刷配線板の製造方法が得ら
れる。[Table] The adhesion of plating inside the hole for through holes is the time until plating is deposited on the entire inner wall of the hole, and the through hole reliability is MIL-107D (-65℃, 30 minutes to 125℃,
The number of cycles at which the resistance value increases by 10% (thermal shock test with a 30-minute cycle) and the blowhole occurrence rate are determined by soldering conditions of 240°C and 5 seconds. The manufacturing conditions of Example 1) were as follows: a) Insulating substrate: An epoxy resin laminate plate was coated with a plating catalyst-containing adhesive (HA-04 manufactured by Hitachi Chemical Co., Ltd.) and cured. b) Thermosetting resin layer forming step: Epoxy resin emulsion (Epolsion manufactured by Kanebo NSC)
Hardening agent EB- for 100 parts by weight of solid content of EA-1
After immersing the adhesive in a solution with a concentration of 1% (adding 80 parts by weight of 1), remove the emulsion on the surface of the adhesive with a buff, and then blow hot air heated to about 100°C at a wind speed of 3 m/sec to adhere it to the hole wall. The thermosetting resin is heated to a semi-cured state. c) Plating catalyst deposition step: Apply a plating catalyst (HS-101B manufactured by Hitachi Chemical Co., Ltd.) and heat at a temperature of 150°C for 30 minutes. d) Roughening step: The surface of the adhesive layer is roughened with a borohydrofluoric acid roughening solution, washed and dried. e) Plating resist process: Plating resist ink (HGM-02BK-1 manufactured by Hitachi Chemical Co., Ltd.) is screen printed and cured by heating at a temperature of 160°C for 30 minutes. f) Electroless plating process: A 30μ thick copper layer is formed by normal electroless plating process (CC-4 plating process). In Example 2), 10 parts by weight of nitrile butadiene rubber (Higher 1522 manufactured by Nippon Zeon Co., Ltd.) was added to 100 parts by weight of the thermosetting resin in Example 1), and in Example 3), In Example 1), the roughening liquid was a borohydrofluoric acid type, and in Example 4), after removing the emulsion on the surface in step b) in Example 1), the roughening liquid was heated to about 100°C at a wind speed of 4.5 m/sec. Example 5) was heated with hot air heated to about 100°C at a wind speed of 5 m/sec after removing the emulsion in step b) in Example 1); After removing the emulsion in step b), heating was performed using hot air heated to about 100° C. at a wind speed of 5.5 m/sec, and the conventional example was obtained by omitting step b) in Example 1). As is clear from the table, according to the present invention, compared to the conventional example, the plating adhesion of the hole wall surface for through holes is reduced by about 80% or more, and the plating deposition rate is increased by more than 5 times. The reliability has increased by about 1.6 times or more, and the blowhole occurrence rate has decreased by about 87%. Further, according to the present invention, the wind speed of the hot air is 5
It is clear that when the speed exceeds m/sec, the plating adhesion increases rapidly, and therefore 5 m/sec or less is preferable. (Effects of the Invention) As described above, according to the present invention, by uniformly providing a thermosetting resin layer on the hole wall surface of a through hole, plating precipitation on the hole wall surface is accelerated and manufacturing time can be shortened. At the same time, it is possible to obtain a method for manufacturing a printed wiring board that has a low blowhole occurrence rate and is highly reliable.
第１図〜第７図は本発明実施例の製造工程を示
し、第１図は接着剤層を設けた絶縁基板の断面
図、第２図は孔を形成した絶縁基板の断面図、第
３図は孔壁に熱硬化性樹脂層を設けた絶縁基板の
断面図、第４図は熱硬化性樹脂層にめつき触媒を
付着した絶縁基板の断面図、第５図は接着剤層を
粗化した絶縁基板の断面図、第６図はめつきレジ
スト層を設けた絶縁基板の断面図、第７図は回路
を設けた絶縁基板の断面図を示す。
１…絶縁基板、２…接着剤層、３…孔、４…熱
硬化性樹脂層、５…めつき触媒、６…めつきレジ
スト層、７…回路。
1 to 7 show the manufacturing process of an embodiment of the present invention, FIG. 1 is a cross-sectional view of an insulating substrate provided with an adhesive layer, FIG. 2 is a cross-sectional view of an insulating substrate with holes formed, and FIG. The figure is a cross-sectional view of an insulating substrate with a thermosetting resin layer provided on the hole wall, Figure 4 is a cross-sectional view of an insulating substrate with a plating catalyst attached to the thermosetting resin layer, and Figure 5 is a cross-sectional view of an insulating substrate with a thermosetting resin layer coated with a plating catalyst. FIG. 6 is a cross-sectional view of an insulating substrate provided with a plating resist layer, and FIG. 7 is a cross-sectional view of an insulating substrate provided with a circuit. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Adhesive layer, 3... Hole, 4... Thermosetting resin layer, 5... Plating catalyst, 6... Plating resist layer, 7... Circuit.
Claims (1)
着剤が塗布された絶縁基板に、無電解めつき法に
より所定の回路及びスルーホールを形成する印刷
配線板の製造方法において、絶縁基板を熱硬化性
のエマルジヨン中に浸漬して孔壁面に熱硬化性樹
脂を塗布する工程と、該工程後に表面のエマルジ
ヨンを除去し５ｍ／sec以下の風速の熱風により
孔壁面に付着した熱硬化性樹脂を加熱乾燥して半
硬化状態にする工程と、該工程後に前記熱硬化性
樹脂にめつき触媒を付着した後熱硬化性樹脂層を
加熱して硬化させる工程と、該熱硬化性樹脂層を
硬化後粗化液に絶縁基板を浸漬し、接着剤層を粗
化する工程とを施すことを特徴とする印刷配線板
の製造方法。1. In a method for manufacturing a printed wiring board in which a predetermined circuit and through holes are formed by electroless plating on an insulating substrate having holes for through holes and coated with a plating catalyst-containing adhesive, the insulating substrate is thermally cured. A process of applying a thermosetting resin to the hole wall surface by immersing it in a liquid emulsion, and after this step, removing the emulsion on the surface and heating the thermosetting resin attached to the hole wall surface with hot air at a wind speed of 5 m/sec or less. a step of drying to a semi-cured state; a step of attaching a plating catalyst to the thermosetting resin after this step and heating and curing the thermosetting resin layer; and a step of curing the thermosetting resin layer. 1. A method for manufacturing a printed wiring board, comprising the steps of immersing an insulating substrate in a roughening liquid and roughening an adhesive layer.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337584A JPH0248153B2 (en) | 1984-05-22 | 1984-05-22 | INSATSUHAISENBANNOSEIZOHOHO |
| US06/701,533 US4585502A (en) | 1984-04-27 | 1985-02-14 | Process for producing printed circuit board |
| DE19853505579 DE3505579A1 (en) | 1984-04-27 | 1985-02-18 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337584A JPH0248153B2 (en) | 1984-05-22 | 1984-05-22 | INSATSUHAISENBANNOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60246696A JPS60246696A (en) | 1985-12-06 |
| JPH0248153B2 true JPH0248153B2 (en) | 1990-10-24 |
Family
ID=14352350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10337584A Expired - Lifetime JPH0248153B2 (en) | 1984-04-27 | 1984-05-22 | INSATSUHAISENBANNOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0248153B2 (en) |
-
1984
- 1984-05-22 JP JP10337584A patent/JPH0248153B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60246696A (en) | 1985-12-06 |
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