JPS5816626B2 - Method for manufacturing multilayer printed wiring board - Google Patents

Method for manufacturing multilayer printed wiring board

Info

Publication number
JPS5816626B2
JPS5816626B2 JP52131328A JP13132877A JPS5816626B2 JP S5816626 B2 JPS5816626 B2 JP S5816626B2 JP 52131328 A JP52131328 A JP 52131328A JP 13132877 A JP13132877 A JP 13132877A JP S5816626 B2 JPS5816626 B2 JP S5816626B2
Authority
JP
Japan
Prior art keywords
clad laminate
copper
metal foil
printed wiring
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52131328A
Other languages
Japanese (ja)
Other versions
JPS5463373A (en
Inventor
国富哲夫
中村真一
板垣富栄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP52131328A priority Critical patent/JPS5816626B2/en
Publication of JPS5463373A publication Critical patent/JPS5463373A/en
Publication of JPS5816626B2 publication Critical patent/JPS5816626B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【発明の詳細な説明】 この発明は多層プリント配線板の製造方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a multilayer printed wiring board.

多層プリント配線板は、従来からつぎのようにして製造
していた。
Multilayer printed wiring boards have conventionally been manufactured in the following manner.

すなわち、通常の銅張積層板の銅箔を加工してプリント
配線を形成することにより内層用銅張積層板をつくり、
これの銅箔を過硫酸アンモニウム、塩化第2銅、酢酸銅
等の薬剤で処理して接着性および耐薬品性を向上させる
In other words, a copper-clad laminate for the inner layer is made by processing the copper foil of a normal copper-clad laminate and forming printed wiring.
This copper foil is treated with chemicals such as ammonium persulfate, cupric chloride, and copper acetate to improve adhesion and chemical resistance.

ついでこれを水洗して薬剤を除去したのち、加熱乾燥し
て水分を乾燥させ、この内層用銅張積層板に、熱硬化性
樹脂含浸基材(プリプレグ)を介して外層用銅張積層板
を積層接着することにより製造していた。
Next, this was washed with water to remove the chemicals, and then heated and dried to dry the moisture, and the copper-clad laminate for the outer layer was applied to this copper-clad laminate for the inner layer via a thermosetting resin-impregnated base material (prepreg). It was manufactured by laminating and bonding.

ところが、この方法は、水分除去用の加熱乾燥により、
処理した銅箔表面が酸化して錆等を生じ変色するため、
多層プリント配線板に接着強度のばらつき、耐薬品性の
劣化および色むらが生ずるという欠点があった。
However, this method uses heating and drying to remove moisture.
Because the treated copper foil surface oxidizes and causes rust etc. and discoloration,
The multilayer printed wiring board has drawbacks such as variations in adhesive strength, deterioration in chemical resistance, and color unevenness.

また、多層プリント配線板は、表面を粗化して接着性等
を向上した銅箔(両面粗化銅箔)を積層板に貼着しプリ
ント配線を形成した内層用銅張積層板を用いても製造さ
れていた。
In addition, multilayer printed wiring boards can also be produced by using copper-clad laminates for inner layers, in which printed wiring is formed by pasting copper foil whose surface has been roughened to improve adhesion (double-sided roughened copper foil) to the laminate. It was manufactured.

この方法によれば、前述の方法の薬剤処理工程を省略す
ることができる。
According to this method, the chemical treatment step of the above-mentioned method can be omitted.

しかし、粗化銅箔面の錆による接着強度のばらつき、錆
面の耐薬品性の劣化および色むらの発生を防ぐために粗
化銅箔を酸のような薬剤で処理して錆を除去し、ついで
水洗して酸を除いたのち加熱乾燥していた。
However, in order to prevent variations in adhesive strength due to rust on the roughened copper foil surface, deterioration of the chemical resistance of the rusted surface, and occurrence of color unevenness, the roughened copper foil is treated with a chemical such as acid to remove rust. It was then washed with water to remove the acid and then heated and dried.

ところが、この方法でも水洗後の乾燥工程で加熱される
ため、2次的に錆が生じていた。
However, even with this method, rust was generated secondary to heating in the drying process after washing with water.

これを回避するため、水洗後速かに内層用銅張積層板を
有機溶剤中に浸漬し、水分を有機溶剤と置換することに
より除去したのち加熱乾燥をするという方法が提案され
た。
In order to avoid this, a method has been proposed in which the copper-clad laminate for the inner layer is immediately immersed in an organic solvent after washing with water, the moisture is removed by replacing it with the organic solvent, and then the laminate is heated and dried.

しかしながら、この方法によっても十分ではなく、ある
程度の発錆は避けられなかった。
However, even this method was not sufficient and some degree of rusting was unavoidable.

したがって、この発明の目的は、接着強度のばらつき、
耐薬品性の劣化および色むらの生じない多層プリント配
線板の製造方法を提供することである。
Therefore, the purpose of this invention is to reduce the variation in adhesive strength.
An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that does not cause deterioration in chemical resistance or color unevenness.

この発明の特徴は、内層用金属箔張積層板の金属箔を薬
剤により化学処理して接着性および耐薬品性を向上させ
、ついで水洗して薬剤を除去したのち、樹脂を含む溶剤
で処理して水分を溶剤で置換することにより除去すると
ともに、金属箔上に樹脂の薄膜を形成させ、ついで金属
箔を乾燥し、この内層用金属箔張積層板に熱硬化性樹脂
含浸基材を介して外層用金属箔張積層板を積層接着する
ことにある。
The feature of this invention is that the metal foil of the metal foil-clad laminate for the inner layer is chemically treated with a chemical to improve its adhesion and chemical resistance, then washed with water to remove the chemical, and then treated with a solvent containing resin. At the same time, a thin film of resin is formed on the metal foil, the metal foil is dried, and the inner layer metal foil-clad laminate is coated with a thermosetting resin-impregnated base material. The purpose is to laminate and bond metal foil-clad laminates for the outer layer.

すなわち、この発明では、金属箔上に樹脂の薄膜を形成
するため、乾燥工程において空気と金属箔が遮断されて
いて酸化が起きない。
That is, in this invention, since a thin resin film is formed on the metal foil, air and the metal foil are blocked during the drying process, so that oxidation does not occur.

そのため、金属箔の酸化による発錆によって生ずる多層
プリント配線板の接着強度のばらつき、耐薬品性の劣化
および色むらの発生が阻止される。
Therefore, variations in adhesive strength, deterioration in chemical resistance, and color unevenness of the multilayer printed wiring board caused by rusting due to oxidation of the metal foil are prevented.

つぎにこの発明の詳細な説明する。Next, this invention will be explained in detail.

この発明では、通常の金属箔、例えば銅箔を用いた内層
用銅張積層板を過硫酸アンモニウム等の薬剤により化学
処理するか、または粗化金属箔、例えば粗化銅箔を用い
た内層用銅張積層板を酸等の薬剤により化学処理したの
ち、直ちに充分水洗してそれらの薬剤を除去し、内層用
銅張積属板の銅箔を溶剤で処理して水分を除去する。
In this invention, a copper-clad laminate for the inner layer using a normal metal foil, for example, copper foil, is chemically treated with a chemical such as ammonium persulfate, or After the clad laminate is chemically treated with chemicals such as acids, it is immediately thoroughly washed with water to remove those chemicals, and the copper foil of the copper clad laminate for the inner layer is treated with a solvent to remove moisture.

この水分除去用溶剤処理は、例えば内層用銅張積層板を
有機溶剤に浸漬し積層板表面に付着している水分を有機
溶剤と置換させることにより行なうことができる。
This solvent treatment for removing water can be carried out, for example, by immersing the copper-clad laminate for the inner layer in an organic solvent to replace the water adhering to the surface of the laminate with the organic solvent.

そして、溶剤で処理して水分を除去した内層用銅張積層
板の銅箔を、樹脂を溶解した溶剤で処理することにより
銅箔表面に樹脂薄膜を形成させる。
Then, the copper foil of the inner layer copper-clad laminate, which has been treated with a solvent to remove moisture, is treated with a solvent in which resin is dissolved to form a resin thin film on the surface of the copper foil.

この樹脂薄膜形成処理は、例えば水分を除去した内層用
銅張積層板を樹脂を溶解した有機溶剤中に浸漬すること
により行なうことができる。
This resin thin film forming treatment can be carried out, for example, by immersing the copper-clad laminate for the inner layer from which water has been removed into an organic solvent in which a resin is dissolved.

また、水分除去用溶剤処理と樹脂薄膜形成処理を同時に
行なうようにしてもよい。
Further, the water removal solvent treatment and the resin thin film forming treatment may be performed simultaneously.

すなわち、水分除去用の溶剤中に樹脂を溶解させ、それ
を用いて内層用銅張積層板を処理することにより、水分
除去と樹脂薄膜形成を同時に行なうようにしてもよし)
In other words, by dissolving the resin in a solvent for moisture removal and treating the copper-clad laminate for the inner layer with it, moisture removal and resin thin film formation may be performed at the same time.)
.

つぎに、樹脂薄膜が形成された内層用銅張積層板を乾燥
、例えば加熱乾燥させる。
Next, the copper-clad laminate for inner layer on which the resin thin film is formed is dried, for example, by heating.

この場合、銅箔は樹脂薄膜で被覆され、空気と遮断され
ているため、酸化されることがない。
In this case, the copper foil is covered with a thin resin film and is isolated from the air, so it is not oxidized.

そのため、発錆による弊害の発生を回避できる。Therefore, the occurrence of harmful effects due to rusting can be avoided.

樹脂薄膜形成に用いる樹脂としては、薄膜形成能をもつ
樹脂であればどのような樹脂を用いてもよいが、熱硬化
性樹脂を用いるこさが好ましい。
As the resin used for forming the resin thin film, any resin may be used as long as it has the ability to form a thin film, but it is preferable to use a thermosetting resin.

このような樹脂を用いると、銅箔表面に熱硬化性樹脂薄
膜が形成され、それが加熱乾燥工程で硬化する。
When such a resin is used, a thermosetting resin thin film is formed on the surface of the copper foil, and this is cured in a heat drying process.

その結果、樹脂薄膜の粘着性が失なわれるため、その後
の作業が容易になる。
As a result, the adhesiveness of the resin thin film is lost, making subsequent work easier.

また、銅箔表面が直接手指に触れるこさもないので指紋
に由来する発錆もなく、傷が付きにくいという効果があ
る。
In addition, since the surface of the copper foil does not come in direct contact with fingers, there is no rust caused by fingerprints, and it is less susceptible to scratches.

つぎに、このンようにして樹脂薄膜が形成された内層用
銅張積層板にプリプレグを介して外層用金属箔張積層板
、例えば銅張積層板を通常の方法で積層接着することに
より多層プリント配線板が得られる。
Next, a metal foil-clad laminate for the outer layer, such as a copper-clad laminate, is laminated and bonded in a conventional manner to the copper-clad laminate for the inner layer on which the resin thin film has been formed via the prepreg, thereby performing multilayer printing. A wiring board is obtained.

このようにして得られる多層プリン1配線板は、接着強
i度のばらつき、耐薬品性の劣化および色むらが生じな
い。
The thus obtained multilayer Print 1 wiring board does not suffer from variations in adhesive strength, deterioration in chemical resistance, and color unevenness.

つぎに実施例について説明する。Next, examples will be described.

実施例 1ニ プリント配線を形成した両面粗化銅箔(厚さ)70μm
)張積層板(内層用銅張積層板)を希塩酸(水:塩酸=
10:1)に30秒間浸漬して錆を除き、流水洗を3回
したのち水切りした。
Example 1 Double-sided roughened copper foil (thickness) 70 μm with double-print wiring formed
) clad laminate (copper clad laminate for inner layer) in dilute hydrochloric acid (water:hydrochloric acid=
10:1) for 30 seconds to remove rust, rinsed with running water three times, and then drained.

つぎにメチルエチルケトン中に10秒間浸漬し、再度メ
チルエチルケトン中に10秒間浸漬した。
Next, it was immersed in methyl ethyl ketone for 10 seconds, and again in methyl ethyl ketone for 10 seconds.

つぎ;にこれを下記の配合の樹脂薄膜形成処理液中に1
0秒間浸漬したのち120℃で60分間乾燥した。
Next, this was added to a resin thin film forming treatment solution with the following composition.
After being immersed for 0 seconds, it was dried at 120° C. for 60 minutes.

樹脂薄膜形成処理液配合 メチルエチルケトン =100重量部; エ
ポキシ樹脂(商品名:エピコート827、シェル社製)
= 10重量部 硬化剤(商品名:に61B1 セールチルニー社製): 1重量部 このようにして処理された内層用銅張積層板には発錆、
色むらが見られなかった。
Methyl ethyl ketone mixed with resin thin film forming treatment liquid = 100 parts by weight; Epoxy resin (trade name: Epicoat 827, manufactured by Shell Co., Ltd.)
= 10 parts by weight Curing agent (product name: NI61B1 manufactured by Sale Chilney): 1 part by weight The copper-clad laminate for the inner layer treated in this way does not cause rust,
No uneven color was observed.

つぎに、この積層板に、プリプレグを介して外層用銅張
積層板を通常の方法で積層成形して多層プリント配線板
を得た。
Next, a copper-clad laminate for an outer layer was laminated and molded on this laminate in a conventional manner via a prepreg to obtain a multilayer printed wiring board.

従来例 1: 実施例1の内層用鋼張積層板を実施例1と同様の希塩酸
で処理し、ついで流水洗を行なったのち、直ちに加熱乾
燥した。
Conventional Example 1: The steel clad laminate for the inner layer of Example 1 was treated with dilute hydrochloric acid in the same manner as in Example 1, then washed with running water, and immediately heated and dried.

このようにして処理した内層用銅張積層板を用い、実施
例1と同様にして多層プリント配線板を得た。
Using the thus treated copper-clad laminate for inner layers, a multilayer printed wiring board was obtained in the same manner as in Example 1.

従来例 2: 実施例1の内層用銅張積層板を実施例1と同様の希塩酸
で処理し、ついで流水洗を3回したのち水切りした。
Conventional Example 2: The copper-clad laminate for the inner layer of Example 1 was treated with dilute hydrochloric acid in the same manner as in Example 1, then washed with running water three times, and then drained.

つぎにメチルエチルケトン中に10秒間浸漬し、再度メ
チルエチルケトン中に10秒間浸漬したのち、直ちに加
熱乾燥した。
Next, it was immersed in methyl ethyl ketone for 10 seconds, immersed again in methyl ethyl ketone for 10 seconds, and then immediately heated and dried.

このようにして処理した内層用銅張積層板を用い、実施
例1と同様にして多層プリント配線板を得た。
Using the thus treated copper-clad laminate for inner layers, a multilayer printed wiring board was obtained in the same manner as in Example 1.

実施例 2ニ プリント配線を形成した通常の銅張積層板の銅箔を通常
の方法に従って酢酸銅処理することにより内層用銅張積
層板をつくり、これを水洗したのち直ちにメチルエチル
ケトン中に10秒間浸漬し、再度メチルエチルケトン中
に10秒間浸漬した。
Example 2 A copper clad laminate for the inner layer was prepared by treating the copper foil of a normal copper clad laminate with double-print wiring in accordance with a normal method with copper acetate, and after washing it with water, it was immediately immersed in methyl ethyl ketone for 10 seconds. Then, it was immersed again in methyl ethyl ketone for 10 seconds.

つぎにこれを実施例1と同様の樹脂薄膜形成処理液中に
10秒間浸漬したのち120℃で60分間乾燥した。
Next, this was immersed for 10 seconds in the same resin thin film forming treatment solution as in Example 1, and then dried at 120° C. for 60 minutes.

このようにして処理された内層用銅張積層板には発錆、
色むらが見られなかった。
Copper-clad laminates for inner layers treated in this way will cause rust and
No uneven color was observed.

つぎに、この積層板にプリプレグを介して外層用銅張積
層板を通常の方法で積層成形して多層プリント配線板を
得た。
Next, a copper-clad laminate for an outer layer was laminated and molded on this laminate with a prepreg interposed therebetween in a conventional manner to obtain a multilayer printed wiring board.

従来例 3ニ プリント配線を形成した通常の銅張積層板の銅箔を通常
の方法に従って酢酸銅処理することにより内層用銅張積
層板をつくり、これを水洗したのち直ちに加熱乾燥した
Conventional Example 3 A copper clad laminate for an inner layer was prepared by treating the copper foil of a normal copper clad laminate with double-printed wiring according to a conventional method with copper acetate, and after washing with water, it was immediately heated and dried.

このようにして処理した内層用銅張積層板を用い、実施
例1と同様にして多層プリント配線板を得た。
Using the thus treated copper-clad laminate for inner layers, a multilayer printed wiring board was obtained in the same manner as in Example 1.

以上の実施例および従来例で得られた多層プリント配線
板の性能試験の結果を次表に示した。
The results of the performance tests of the multilayer printed wiring boards obtained in the above examples and conventional examples are shown in the following table.

Claims (1)

【特許請求の範囲】 1 内層用金属箔張積層板の金属箔を薬剤により化学処
理して接着性および耐薬品性を向上させ、ついで水洗し
て薬剤を除去したのち、樹脂を含む溶剤で処理して水分
を溶剤で置換することにより除去するとともに、金属箔
上に樹脂の薄膜を形成させ、ついで金属箔を乾燥し、こ
の内層用金属箔張積層板に熱硬化性樹脂含浸基材を介し
て外層用金属箔張積層板を積層接着する多層プリント配
線板の製造方法。 2 前記樹脂が熱硬化性樹脂であり、前記乾燥が加熱乾
燥であってその加熱乾燥により前記金属箔上の熱硬化性
樹脂の薄膜を硬化させるようにしている特許請求の範囲
第1項記載の多層プリント配線板の製造方法。
[Claims] 1. The metal foil of the metal foil-clad laminate for the inner layer is chemically treated with a chemical to improve its adhesion and chemical resistance, then washed with water to remove the chemical, and then treated with a solvent containing resin. At the same time, a thin film of resin is formed on the metal foil, the metal foil is dried, and the inner layer metal foil-clad laminate is coated with a thermosetting resin-impregnated base material. A method for producing a multilayer printed wiring board in which a metal foil-clad laminate for the outer layer is laminated and bonded. 2. The method according to claim 1, wherein the resin is a thermosetting resin, and the drying is heat drying, and the heat drying hardens the thin film of the thermosetting resin on the metal foil. A method for manufacturing a multilayer printed wiring board.
JP52131328A 1977-10-31 1977-10-31 Method for manufacturing multilayer printed wiring board Expired JPS5816626B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52131328A JPS5816626B2 (en) 1977-10-31 1977-10-31 Method for manufacturing multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52131328A JPS5816626B2 (en) 1977-10-31 1977-10-31 Method for manufacturing multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPS5463373A JPS5463373A (en) 1979-05-22
JPS5816626B2 true JPS5816626B2 (en) 1983-04-01

Family

ID=15055371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52131328A Expired JPS5816626B2 (en) 1977-10-31 1977-10-31 Method for manufacturing multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS5816626B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5760897A (en) * 1980-09-30 1982-04-13 Shin Kobe Electric Machinery Method of producing multilayer printed circuit board
JPH03165596A (en) * 1989-11-25 1991-07-17 Matsushita Electric Works Ltd Multilayer laminated board
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140856A (en) * 1974-04-30 1975-11-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140856A (en) * 1974-04-30 1975-11-12

Also Published As

Publication number Publication date
JPS5463373A (en) 1979-05-22

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