JP2519033B2 - Blackening method for copper clad laminates - Google Patents
Blackening method for copper clad laminatesInfo
- Publication number
- JP2519033B2 JP2519033B2 JP61086655A JP8665586A JP2519033B2 JP 2519033 B2 JP2519033 B2 JP 2519033B2 JP 61086655 A JP61086655 A JP 61086655A JP 8665586 A JP8665586 A JP 8665586A JP 2519033 B2 JP2519033 B2 JP 2519033B2
- Authority
- JP
- Japan
- Prior art keywords
- clad laminate
- blackening
- copper
- blackening treatment
- copper clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、黒化処理むらを発生させない多層板用銅張
積層板の黒化処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a blackening treatment method for a copper-clad laminate for a multilayer board that does not cause uneven blackening treatment.
（従来の技術） 近年電子機器の発達およびそれに伴う印刷配線板の高
密度化に対処して多層基板が用いられるようになってき
ている。この多層基板は、薄い内層用両面板に回路を形
成し、その上にプリプレグと銅箔を積層して加熱、加圧
することにより製造されている。(Prior Art) In recent years, multilayer boards have come to be used in response to the development of electronic devices and the accompanying increase in density of printed wiring boards. This multilayer board is manufactured by forming a circuit on a thin inner layer double-sided board, laminating a prepreg and a copper foil thereon, and heating and pressing.
しかしながら、内層板上の回路銅箔の表面はそのまま
の状態であると、加熱や吸湿により層間剥離が生じ易い
ため、通常様々な表面処理を施して剥離を防止する方法
がとられている。However, if the surface of the circuit copper foil on the inner layer plate is left as it is, delamination is likely to occur due to heating or moisture absorption. Therefore, various surface treatments are usually performed to prevent delamination.
このような方法として、銅箔表面の黒化処理や黄銅化
処理等の方法が行われている。これらの方法の内、引剥
し強度、耐熱性等の諸特性が優れていることから、酸化
剤を用いて表面に黒色酸化被膜を形成させる黒化処理が
最も一般的に用いられている。As such a method, a method such as blackening treatment or brassing treatment of the copper foil surface has been performed. Among these methods, the blackening treatment in which a black oxide film is formed on the surface by using an oxidizing agent is most commonly used because it has various properties such as peel strength and heat resistance.
（発明が解決しようとする問題点） しかしながらこの黒化処理方法においては、製造工程
中に形成された種々の処理膜、銅箔表面が酸化されるの
を防ぐために行われる塩酸洗浄および水洗い時に付着し
た水滴、内層板に形成された信号回路等に起因して処理
むらが生じ易いという問題があった。なお水滴の残留を
防ぐために、黒化処理の前に乾燥工程を設けることも考
えられるが、乾燥条件によってはパターニング時に寸法
変化が発生することがあり回路設計上好ましくない。(Problems to be solved by the invention) However, in this blackening treatment method, various treatment films formed during the manufacturing process, and adhesion during hydrochloric acid washing and water washing performed to prevent the copper foil surface from being oxidized There is a problem that uneven processing is likely to occur due to the water droplets, the signal circuit formed on the inner layer plate, and the like. A drying step may be provided before the blackening treatment in order to prevent water droplets from remaining. However, depending on the drying conditions, dimensional changes may occur during patterning, which is not preferable in terms of circuit design.
そして従来このような処理むらが発生した場合には、
黒化処理をやりなおしたり、前工程の研磨からやりなお
したりすることが行われていた。And when such processing unevenness occurs conventionally,
The blackening process has been redone, and the polishing in the previous step has been redone.
しかしながら黒化処理をくり返して行なう場合には、
効率が悪いうえに、最初に正常に黒化された部分は過剰
に黒化処理が行われることになってしまい、処理膜が切
れやすくなって引剥し強度、耐熱性が正常品よりも弱く
なってしまうという問題があった。However, if you repeat the blackening process,
In addition to being inefficient, the first normally blackened part will be excessively blackened, which makes the treated film easier to tear and the peel strength and heat resistance will be weaker than normal products. There was a problem that it would end up.
また前工程の研磨からやりなおす場合には、銅箔の処
理層を除去してしまうため、処理層の均一化は図れる
が、前述の場合より一層効率が悪く、さらに再研磨によ
り内層銅箔が薄くなるためスルーホール信頼性が低下し
好ましくない。Also, when the polishing process is repeated from the previous step, the treated layer of the copper foil is removed, so that the treated layer can be made uniform, but the efficiency is lower than in the above case, and the inner layer copper foil is thinned by re-polishing. Therefore, the reliability of the through hole is lowered, which is not preferable.
本発明は、このような従来の問題を解消すべくなされ
たもので、黒化処理むらがなく黒化膜の特性および処理
効率ともに良好な黒化処理方法を提供することを目的と
する。The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a blackening treatment method which is free from unevenness of blackening treatment and has good characteristics and processing efficiency of a blackening film.
［発明の構成］ （問題点を解決するための手段） 本発明者らは、表面に残る水洗水を速やかに除去する
方法に関して検討を重ねた結果、次のような方法を開発
した。すなわち本発明の黒化処方法は、多層板用銅張積
層板を、酸化剤および塩基性物質を含有する処理液に浸
漬して黒化処理を行う銅張積層板の黒化処理方法におい
て、前記銅張積層板を黒化処理液に浸漬するに先立っ
て、低沸点の有機溶剤による洗浄および乾燥を順に行う
ことを特徴としている。[Structure of the Invention] (Means for Solving Problems) The inventors of the present invention have made extensive studies on a method for quickly removing the washing water remaining on the surface, and have developed the following method. That is, the blackening treatment method of the present invention, the copper clad laminate for a multilayer board, in the blackening treatment method of the copper clad laminate to perform a blackening treatment by immersing in a treatment liquid containing an oxidizing agent and a basic substance, The copper-clad laminate is characterized by being sequentially washed and dried with an organic solvent having a low boiling point before being dipped in the blackening treatment solution.
本発明における黒化処理直前の有機溶剤としては、有
機極性溶剤、特にメタノール、エタノール等の低級アル
コール類あるいはアセトン、メチルエチルケトン等の低
級ケトン類等の比較的沸点の低い有機極性溶剤が適して
いる。As the organic solvent just before the blackening treatment in the present invention, an organic polar solvent, particularly an organic polar solvent having a relatively low boiling point such as lower alcohols such as methanol and ethanol or lower ketones such as acetone and methyl ethyl ketone is suitable.
（作用） このように構成された本発明の銅張積層板の黒化処理
方法においては、黒化処理に先立って銅張積層板を洗浄
する有機溶剤が低沸点であるため、低温でも乾燥除去し
やすく、銅張積層板表面の水滴を容易に除去しうる。特
に水に溶解する有機極性溶剤を使用した場合には、仮に
水洗等の工程後の乾燥が充分に行われない場合であって
も、次工程の黒化処理溶液に溶解するので処理ムラ等の
原因になるようなことはない。(Operation) In the blackening treatment method for a copper-clad laminate of the present invention thus configured, since the organic solvent for washing the copper-clad laminate prior to the blackening treatment has a low boiling point, it is dried and removed even at a low temperature. Water droplets on the surface of the copper clad laminate can be easily removed. In particular, when an organic polar solvent that dissolves in water is used, even if the drying after the steps such as washing is not sufficiently performed, it dissolves in the blackening treatment solution in the next step, so that the treatment unevenness may occur. There is nothing that causes it.
（実施例） 以下本発明の実施例について説明する。図は本発明の
一実施例に使用される製造装置の概略図であり、本発明
の黒化処理方法は、このような装置を用いて次のように
行なわれる。(Examples) Examples of the present invention will be described below. The figure is a schematic view of a manufacturing apparatus used in an embodiment of the present invention, and the blackening treatment method of the present invention is performed as follows using such an apparatus.
まず、黒化処理されるべき銅張積層板１は、オートラ
ック２より吊下げられたラック３内に縦に重ねて収容さ
れる。次いでオートラック２を作動させてラック３を下
降させ、銅張積層板１を塩酸槽４に浸漬させて酸洗いを
行なう。酸洗いされた銅張積層板１は、同様にしてオー
トラック２により移動され水洗槽５、６にて水洗され
る。さらに脱脂槽７、水洗槽８、９、ソフトエッチング
槽10、水洗槽11、12に順次浸漬された後、有機溶剤槽13
に浸漬される。ここで表面が洗浄された後、銅張積層板
１は熱風吹き出しノズル14の上方に停止され、熱風吹き
出しノズル14から吹き出される熱風（50〜80℃）によ
り、表面に残留する液滴が、乾燥除去される。このとき
生ずる溶剤蒸気および水蒸気は、オートラック２上方に
設けられたドラフト15により吸引除去される。なお熱風
吹き出し用ノズル14の内部には、加熱用ヒータ16および
送風用ファン17が備えられている。First, the copper-clad laminate 1 to be blackened is vertically stacked in a rack 3 suspended from an auto rack 2. Next, the auto rack 2 is operated to lower the rack 3, and the copper clad laminate 1 is dipped in the hydrochloric acid bath 4 for pickling. The pickled copper clad laminate 1 is similarly moved by the auto rack 2 and washed in the washing tanks 5 and 6. Further, after being successively immersed in the degreasing tank 7, the water washing tanks 8 and 9, the soft etching tank 10, and the water washing tanks 11 and 12, the organic solvent tank 13
Be immersed in. After the surface is washed here, the copper clad laminate 1 is stopped above the hot air blowing nozzle 14, and the hot air (50 to 80 ° C.) blown out from the hot air blowing nozzle 14 causes the droplets remaining on the surface to Removed by drying. The solvent vapor and water vapor generated at this time are sucked and removed by the draft 15 provided above the auto rack 2. A heater 16 for heating and a fan 17 for blowing air are provided inside the nozzle 14 for blowing hot air.
このようにして表面が充分に乾燥された銅張積層板１
は、次に液温90℃の下記の組成の黒化処理液を満たした
黒化処理層18に４分間浸漬されて黒化処理され、水洗槽
19、20により水洗いされた後乾燥装置21に送られる。The copper-clad laminate 1 whose surface is sufficiently dried in this way
Is then immersed in a blackening treatment layer 18 filled with a blackening treatment liquid having the following composition at a liquid temperature of 90 ° C. for 4 minutes for blackening treatment, and then a washing bath
After being washed with water 19 and 20, it is sent to the dryer 21.
亜塩素酸ナトリウム（NaClO2）25g/l 水酸化ナトリウム（NaOH）8g/l 過リン酸ナトリウム（Na3PO4）8g/l なお、この図において、作業開始時の銅張積層板１お
よびラック２の位置は点線で図示し、熱風乾燥時の位置
を実線で示している。Sodium chlorite (NaClO 2 ) 25g / l Sodium hydroxide (NaOH) 8g / l Sodium perphosphate (Na 3 PO 4 ) 8g / l In addition, in this figure, the copper clad laminate 1 and rack at the start of work The position of 2 is shown by a dotted line, and the position at the time of hot air drying is shown by a solid line.
第１表は以上のようにして実施した本発明の実施例お
よび比較例の処理条件を示しており、第２表はこの各条
件下で得られた処理膜の特性を示している。なお使用し
たパターンは信号回路である。Table 1 shows the treatment conditions of the examples and comparative examples of the present invention carried out as described above, and Table 2 shows the characteristics of the treated films obtained under these conditions. The pattern used is a signal circuit.
第１表および第２表から明らかなように、実施例１〜
４において、外観が優秀で処理むらのない優れた特性を
有する処理膜が得られた。 As is clear from Table 1 and Table 2, Examples 1 to
In No. 4, a treated film having an excellent appearance and excellent characteristics with no processing unevenness was obtained.
これに対して比較例１〜４の場合には、外観にむらを
生じたり、あるいは引剥し強度に劣化がみられた。On the other hand, in Comparative Examples 1 to 4, uneven appearance was observed or peel strength was deteriorated.
［発明の効果］ 以上説明したように、本発明によれば銅箔表面の水分
を黒化処理前に速やかに除去することが可能であるの
で、外観、処理むらのない優秀な特性を有する黒化処理
膜が得られる。さらに乾燥条件がおだやかであるため、
銅張積層板のパターニングの際に寸法変化をおこすこと
がなく、高信頼性のポリイミド多層板等への適用も可能
である。[Effects of the Invention] As described above, according to the present invention, it is possible to quickly remove water on the surface of a copper foil before blackening treatment, and therefore, it is possible to obtain a black film having excellent appearance and treatment unevenness. A chemical treatment film is obtained. Furthermore, since the drying conditions are mild,
It can be applied to a highly reliable polyimide multi-layer board without causing a dimensional change during patterning of the copper clad laminate.
また乾燥工程において、銅張積層板が適度に加温され
るので湯洗い工程を省略することができ、さらに、製造
工程中銅箔面に形成された処理膜（酸化防止膜等）を、
効果的に除去することができる。Further, in the drying process, the copper clad laminate is appropriately heated, so that the hot water washing process can be omitted, and further, the treatment film (antioxidation film etc.) formed on the copper foil surface during the manufacturing process,
It can be effectively removed.
図は本発明の一実施例の製造装置の概略図である。 １……銅張積層板 ２……オートラック ３……ラック ４……塩酸槽 ５、６、８、９、11、12……水洗槽 ７……脱脂槽 10……ソフトエッチング槽 13……有機溶剤槽 14……熱風吹き出しノズル 15……ドラフト 16……加熱用ヒータ The figure is a schematic view of a manufacturing apparatus according to an embodiment of the present invention. 1 ... Copper clad laminate 2 ... Auto rack 3 ... Rack 4 ... Hydrochloric acid tank 5, 6, 8, 9, 11, 12 ... Washing tank 7 ... Degreasing tank 10 ... Soft etching tank 13 ... Organic solvent tank 14 …… Hot air blowing nozzle 15 …… Draft 16 …… Heating heater
Claims (4)
性物質を含有する処理液に浸漬して黒化処理を行う銅張
積層板の黒化処理方法において、前記銅張積層板を黒化
処理液に浸漬するに先立って、低沸点の有機溶剤による
洗浄および乾燥を順に行うことを特徴とする銅張積層板
の黒化処理方法。1. A blackening treatment method for a copper-clad laminate, which comprises subjecting a copper-clad laminate for a multilayer board to a blackening treatment by immersing it in a treatment liquid containing an oxidizing agent and a basic substance. A method for blackening a copper-clad laminate, which comprises sequentially washing and drying with an organic solvent having a low boiling point prior to immersing the above in a blackening treatment solution.
範囲第１項記載の銅張積層板の黒化処理方法。2. The method for blackening a copper clad laminate according to claim 1, wherein the organic solvent is an organic polar solvent.
あるいは低級ケトン類である特許請求の範囲第２項記載
の銅張積層板の黒化処理方法。3. The method for blackening a copper clad laminate according to claim 2, wherein the low boiling organic polar solvent is a lower alcohol or a lower ketone.
れる特許請求の範囲第１項ないし第３項のいずれか１項
記載の銅張積層板の黒化処理方法。4. The blackening treatment method for a copper clad laminate according to claim 1, wherein the drying is performed by blowing hot air at 50 to 80 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086655A JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086655A JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62242531A JPS62242531A (en) | 1987-10-23 |
| JP2519033B2 true JP2519033B2 (en) | 1996-07-31 |
Family
ID=13893046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61086655A Expired - Lifetime JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519033B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208596A (en) * | 1990-11-30 | 1992-07-30 | Toppan Printing Co Ltd | Manufacture of multilayer printed circuit board |
| JP2966678B2 (en) * | 1993-01-14 | 1999-10-25 | 松下電工株式会社 | Method for producing composite of metal copper and resin |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5268971A (en) * | 1975-12-05 | 1977-06-08 | Hitachi Chemical Co Ltd | Method of pretreating adhesion of multiple layers of multiilayer printed circuit board |
| JPS58104745A (en) * | 1981-12-17 | 1983-06-22 | 日立電線株式会社 | Manufacture of copper plated laminated board |
| JPS59208897A (en) * | 1983-05-13 | 1984-11-27 | 日本電気株式会社 | Method of producing multilayer printed circuit board |
| DE3418359A1 (en) * | 1983-05-23 | 1984-11-29 | Shipley Co., Inc., Newton, Mass. | SOLUTION FOR FORMING BLACK OXIDE LAYERS AND METHOD FOR PRODUCING LAMINATES |
| JPS6092842A (en) * | 1983-10-27 | 1985-05-24 | 日立電線株式会社 | Manufacture of copper lined laminated board |
-
1986
- 1986-04-15 JP JP61086655A patent/JP2519033B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62242531A (en) | 1987-10-23 |
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