JPH10190226A - Manufacture of multilayer board - Google Patents
Manufacture of multilayer boardInfo
- Publication number
- JPH10190226A JPH10190226A JP34931996A JP34931996A JPH10190226A JP H10190226 A JPH10190226 A JP H10190226A JP 34931996 A JP34931996 A JP 34931996A JP 34931996 A JP34931996 A JP 34931996A JP H10190226 A JPH10190226 A JP H10190226A
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- roughening
- board
- acid
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電気・電子機器等
に使用される、多層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer board used for electric and electronic equipment.
【0002】[0002]
【従来の技術】従来、電気機器等に使用される多層板
は、内層用基板表面に形成された銅回路に、接着強度を
高めるために酸化処理を行った後、内層用基板の少なく
とも一方にプリプレグを積み重ね、さらにそのプリプレ
グの最外層に金属箔を配して積層し、次いで、加熱加圧
成形して製造されている。上記酸化処理は、黒化処理と
一般に呼ばれる化学的酸化処理であり、銅回路の光沢面
に対して施して、銅回路の表面に微細な凹凸を形成する
と共に銅回路の表面を黒色化し、銅回路とプリプレグの
接着性を向上させる処理である。2. Description of the Related Art Conventionally, a multilayer board used for electric equipment or the like is manufactured by oxidizing a copper circuit formed on the surface of an inner layer substrate to increase the bonding strength, and then applying the oxidized treatment to at least one of the inner layer substrates. It is manufactured by stacking prepregs, further arranging and laminating a metal foil on the outermost layer of the prepregs, and then heating and pressing. The oxidation treatment is a chemical oxidation treatment generally called a blackening treatment, which is performed on the glossy surface of the copper circuit to form fine irregularities on the surface of the copper circuit and to blacken the surface of the copper circuit, thereby forming copper. This is a process for improving the adhesion between the circuit and the prepreg.
【0003】最近の多層板の高密度化に伴い、多層板を
加工するときに銅回路に施した酸化処理が酸により溶
け、ハローイングと呼ばれる変色現象が発生し問題とな
っている。このハローイングの発生の対策として、内層
用基板に形成された銅回路に、耐酸粗面化処理を行うこ
とが検討されている。この耐酸粗面化処理の方法として
は、酸化処理して銅回路の表面に形成した酸化第一銅及
び酸化第二銅のうち、還元されやすい酸化第二銅を還元
により溶出させて、表面を耐酸強度の優れた酸化第一銅
の粗面化層とする処理や、銅回路の光沢面に対して直
接、ギ酸、銅イオン及び銅イオンのキレート剤を含有す
る酸性水溶液で処理して銅回路の表面を粗面化する処理
等が行われている。[0003] With the recent increase in the density of multilayer boards, the oxidation treatment applied to the copper circuit when processing the multilayer board is melted by acid, causing a problem of discoloration called haloing. As a countermeasure against the occurrence of the haloing, it has been studied to perform an acid roughening treatment on the copper circuit formed on the inner layer substrate. As a method of the acid surface-roughening treatment, of the cuprous oxide and cupric oxide formed on the surface of the copper circuit by the oxidation treatment, cupric oxide, which is easily reduced, is eluted by reduction to reduce the surface. Treatment of copper oxide surface with a layer of roughened copper oxide with excellent acid resistance, or treatment of the copper circuit by treating the glossy surface of the copper circuit directly with an acidic aqueous solution containing formic acid, copper ions and a chelating agent of copper ions. And the like are performed to roughen the surface.
【0004】しかしこの耐酸粗面化処理の色調は、上記
酸化処理(黒化処理)と比較して薄く、茶色に近く、内
層用基板表面の位置の違いや、内層用基板間で大きな色
調の差が発生する場合があるという問題があった。However, the color tone of the acid-surface-roughening treatment is thinner and closer to brown as compared with the above-mentioned oxidation treatment (blackening treatment), and the difference in the position of the surface of the substrate for the inner layer and the large color tone between the substrates for the inner layer. There is a problem that a difference may occur.
【0005】そのため、この耐酸粗面化処理を行う前
に、処理が均一に行われるように、表面を塩酸及び塩化
第二銅を含む水溶液である粗面化前処理液で前処理をし
た後、水洗し、次いで耐酸粗面化処理をする方法が行わ
れている。なお、この粗面化前処理液は、塩酸を120
〜150グラム/リットル(以下g/Lと記す)含み、
塩化第二銅を10〜20g/L含むと、耐酸粗面化処理
後の色調が良好なため一般に用いられている。[0005] Therefore, before performing the acid-resistant surface-roughening treatment, the surface is pretreated with a surface-roughening pretreatment liquid that is an aqueous solution containing hydrochloric acid and cupric chloride so that the treatment is performed uniformly. Rinsing with water, and then performing an acid-resistant surface roughening treatment. Note that this pre-roughening solution was prepared by adding hydrochloric acid to 120
~ 150 grams / liter (hereinafter referred to as g / L),
When cupric chloride is contained in an amount of 10 to 20 g / L, the color tone after the acid-surface-roughening treatment is good, so that it is generally used.
【0006】なお、この前処理や耐酸粗面化処理の方法
としては、その工程の液を後の工程に持ち込まないため
に、処理液から内層用基板を取り出した後、その処理液
が入った槽の上の空気中で停止して内層用基板表面の液
をある程度落とし、次いで空気中を搬送した後、次工程
に運ぶ方法が一般に行われている。As a method of the pre-treatment or the acid surface-roughening treatment, the inner layer substrate is taken out of the processing liquid and then the processing liquid is contained in order to prevent the liquid in that step from being carried into the subsequent steps. In general, a method of stopping in the air above a tank to drop the liquid on the surface of the inner layer substrate to some extent, then transporting the liquid in the air, and then transporting the liquid to the next step is generally performed.
【0007】最近の多層板の高密度化に伴い、内層用基
板表面に形成された銅回路の幅が細くなる傾向にある。
この幅の細い銅回路を有する内層用基板を、上記塩酸及
び塩化第二銅を含む粗面化前処理液で前処理した後、空
気中を搬送し、次いで水洗した後、耐酸粗面化処理して
多層板を製造した場合、内層に形成された銅回路に流す
ことができる電流量が低下し、電気的信頼性が低下する
場合があるという問題があった。そのため、内層用基板
表面に形成された銅回路に流すことができる電流量が低
下しにくい多層板の製造方法がもとめられている。With the recent increase in the density of multilayer boards, the width of the copper circuit formed on the surface of the inner layer substrate tends to be reduced.
After pretreating the inner layer substrate having the thin copper circuit with the roughening pretreatment liquid containing hydrochloric acid and cupric chloride, the substrate is transported in the air, then washed with water, and then subjected to an acid-resistant surface roughening treatment. When a multilayer board is manufactured in such a manner, there is a problem that the amount of current that can flow through the copper circuit formed in the inner layer is reduced, and the electrical reliability may be reduced. Therefore, there is a demand for a method of manufacturing a multilayer board in which the amount of current that can be passed through a copper circuit formed on the surface of the inner layer substrate is unlikely to decrease.
【0008】[0008]
【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、銅回路を表面に有する内層用基板を、塩酸及び塩
化第二銅を含む粗面化前処理液で前処理した後、耐酸粗
面化処理を行い、次いでその内層用基板の少なくとも一
方にプリプレグ及び金属箔を積層した後、加熱加圧成形
して製造する多層板の製造方法であって、内層用基板表
面に形成された銅回路に流すことができる電流量が低下
しにくい多層板の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate for an inner layer having a copper circuit on its surface by using hydrochloric acid and secondary chloride. After pre-treatment with a surface roughening pretreatment liquid containing copper, an acid surface-roughening treatment is performed, and then a prepreg and a metal foil are laminated on at least one of the inner layer substrates, and then heated and pressed to form a multilayer. An object of the present invention is to provide a method for manufacturing a board, which is a method for manufacturing a multilayer board in which the amount of current that can be passed through a copper circuit formed on the surface of an inner layer substrate is less likely to decrease.
【0009】[0009]
【課題を解決するための手段】本発明の請求項1に係る
多層板の製造方法は、銅回路を表面に有する内層用基板
を、塩酸及び塩化第二銅を含む粗面化前処理液で前処理
した後、空気中を搬送し、次いで洗浄液に浸漬した後、
耐酸粗面化処理を行い、次いでその内層用基板の少なく
とも一方の面にプリプレグを積層し、さらにその積層物
の最外層に金属箔を積層した後、加熱加圧成形して製造
する多層板の製造方法であって、上記粗面化前処理液に
塩酸を120〜150グラム/リットル含み、塩化第二
銅を10〜20グラム/リットル含む多層板の製造方法
において、粗面化前処理液で前処理した後洗浄液に浸漬
する間に空気中を搬送する時間が、70秒以下であるこ
とを特徴とする。According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer board, comprising the steps of: preparing a substrate for an inner layer having a copper circuit on its surface with a roughening pretreatment liquid containing hydrochloric acid and cupric chloride; After pre-treatment, transported in the air, then immersed in the cleaning solution,
After performing acid-resistant surface-roughening treatment, and then laminating a prepreg on at least one surface of the inner layer substrate, further laminating a metal foil on the outermost layer of the laminate, and then heating and pressing to form a multilayer board. The method for producing a multilayer board, wherein the roughening pretreatment liquid contains hydrochloric acid at 120 to 150 g / L and cupric chloride at 10 to 20 g / L, It is characterized in that the time of transport in the air while immersing in the cleaning liquid after the pretreatment is 70 seconds or less.
【0010】本発明の請求項2に係る多層板の製造方法
は、請求項1記載の多層板の製造方法において、内層用
基板を搬送する部分の空気の温度が0〜40℃であるこ
とを特徴とする。According to a second aspect of the present invention, in the method for manufacturing a multilayer board according to the first aspect, the temperature of the air for transporting the inner layer substrate is 0 to 40 ° C. Features.
【0011】上記内層用基板を空気中を搬送する間に、
内層用基板表面に付着して持ち出された粗面化前処理液
が、重力や搬送の力により内層用基板表面を流れる。こ
のとき、粗面化前処理液が空気中の酸素を取り込んで特
に活性化し、粗面化前処理液がたくさん流れた部分の銅
回路が過度にエッチングされ、部分的に断面積が小さく
なって、銅回路に流すことができる電流量が低下する場
合があると考えられる。しかし、本発明によると、この
エッチングが余り進行せず、基板の表面に形成された銅
回路に流すことができる電流量が低下しにくいと考えら
れる。[0011] During the transfer of the inner layer substrate in the air,
The roughening pretreatment liquid attached to and taken out of the inner layer substrate surface flows on the inner layer substrate surface due to gravity or transport force. At this time, the roughening pretreatment liquid takes in oxygen in the air and is particularly activated, and the copper circuit in a portion where the roughening pretreatment liquid flows a lot is excessively etched, and the cross-sectional area partially decreases. It is considered that the amount of current that can flow through the copper circuit may decrease. However, according to the present invention, it is considered that this etching does not proceed so much, and the amount of current that can be passed through the copper circuit formed on the surface of the substrate does not easily decrease.
【0012】[0012]
【発明の実施の形態】本発明に係る多層板の製造方法
は、銅回路を表面に有する内層用基板を、塩酸及び塩化
第二銅を含む粗面化前処理液で前処理した後、空気中を
搬送し、次いで洗浄液に浸漬した後、耐酸粗面化処理を
行い、次いでその内層用基板の少なくとも一方にプリプ
レグを積層し、さらにその積層物の最外層に金属箔を積
層した後、加熱加圧成形して製造する。BEST MODE FOR CARRYING OUT THE INVENTION The method for manufacturing a multilayer board according to the present invention is characterized in that a substrate for an inner layer having a copper circuit on its surface is pretreated with a roughening pretreatment liquid containing hydrochloric acid and cupric chloride and then air-treated. After being immersed in a cleaning solution, the surface is subjected to an acid surface-roughening treatment, then a prepreg is laminated on at least one of the inner layer substrates, and a metal foil is further laminated on the outermost layer of the laminate, and then heated. It is manufactured by pressing.
【0013】本発明に用いる内層用基板としては、表面
に銅回路を有する板であれば特に限定するものではな
く、例えば、エポキシ樹脂系、フェノール樹脂系、ポリ
イミド樹脂系、不飽和ポリエステル樹脂系、ポリフェニ
レンエーテル樹脂系等の熱硬化性樹脂や、これらの熱硬
化性樹脂に無機充填材等を配合したもののシートの片面
又は両面に銅箔が張られている板や、ガラス等の無機質
繊維やポリエステル、ポリアミド、木綿等の有機質繊維
のクロス、ペーパー等の基材を、上記熱硬化性樹脂等で
接着し、片面又は両面に銅箔が張られている板等を用い
て、銅箔をエッチングして銅回路を表面に形成したも
の、及び、銅箔が張られていない上記板の表面に銅メッ
キを行い、銅回路を表面に形成したもの等が挙げられ
る。なお、この内層用基板は、内部にも銅回路を有して
いてもよく、その壁面に金属層を形成したスルホール
や、その内部に銀ペースト等の導電体を充填したスルホ
ールを有していてもよい。The substrate for the inner layer used in the present invention is not particularly limited as long as it has a copper circuit on its surface. For example, epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, Thermosetting resins such as polyphenylene ether resin, or a sheet in which a copper foil is stretched on one or both sides of a sheet obtained by blending an inorganic filler or the like with these thermosetting resins, or inorganic fibers or polyester such as glass A polyamide, a cloth of organic fibers such as cotton, a substrate such as paper, and the like are bonded with the above-mentioned thermosetting resin or the like, and the copper foil is etched using a plate or the like having a copper foil on one or both sides. And a copper circuit formed on the surface of the above-mentioned plate not covered with copper foil by copper plating. The substrate for the inner layer may have a copper circuit inside, and may have a through hole in which a metal layer is formed on the wall surface or a through hole in which a conductor such as silver paste is filled. Is also good.
【0014】粗面化前処理液は、塩酸を120〜150
g/L含み、塩化第二銅を10〜20g/L含む水溶液
であることが重要である。この範囲外の場合は、耐酸粗
面化処理が均一に行われにくくなり、内層用基板表面の
位置の違いや、内層用基板間で大きな色調の差が発生す
る場合がある。なお、粗面化前処理液には、過酸化水素
や銅の溶解促進剤等を含有してもよい。The roughening pretreatment liquid is prepared by adding hydrochloric acid to 120-150.
It is important that the aqueous solution contains g / L and 10 to 20 g / L of cupric chloride. If the thickness is outside this range, it is difficult to uniformly perform the surface roughening treatment, and a difference in the position of the surface of the inner layer substrate or a large difference in color tone between the inner layer substrates may occur. The roughening pretreatment liquid may contain a dissolution promoter for hydrogen peroxide or copper.
【0015】上記粗面化前処理液を用いて処理する温度
及び時間は、粗面化前処理液の濃度等に応じて適宜決め
られるが、温度が20〜40℃であると好ましい。ま
た、処理する方法としては、内層用基板を処理液に浸漬
する方法で行うと、内層用基板の面内等の処理のばらつ
きが小さくなり、耐酸粗面化処理後の色調が均一になり
好ましい。The temperature and the time of the treatment using the above-mentioned roughening pretreatment liquid are appropriately determined according to the concentration of the roughening pretreatment liquid and the like, and the temperature is preferably 20 to 40 ° C. In addition, as the method of treatment, when the method is performed by immersing the inner layer substrate in the treatment liquid, the variation in the treatment such as the in-plane treatment of the inner layer substrate is reduced, and the color tone after the acid roughening treatment becomes uniform, which is preferable. .
【0016】なお粗面化前処理液を用いて処理する前
に、必要に応じて内層用基板の銅回路の表面を機械的な
研磨を行い洗浄した後、処理を行ってもよい。Before the treatment using the pre-roughening solution, the surface of the copper circuit of the substrate for the inner layer may be mechanically polished and washed as necessary before the treatment.
【0017】次いで、粗面化前処理液から内層用基板を
取り出した後、空気中を搬送し、次いで洗浄液に浸漬す
る。この粗面化前処理液で前処理した後洗浄液に浸漬す
る間に空気中を搬送する時間が70秒以下であることが
重要である。70秒を越える場合は、内層用基板の表面
に形成された銅回路に流すことができる電流量が低下
し、電気的信頼性が低下する場合がある。Next, after taking out the inner layer substrate from the roughening pretreatment liquid, it is transported in the air and then immersed in the cleaning liquid. It is important that the time of transport in the air during immersion in the cleaning liquid after pre-treatment with this surface roughening pre-treatment liquid is 70 seconds or less. If the time exceeds 70 seconds, the amount of current that can flow through the copper circuit formed on the surface of the inner layer substrate decreases, and the electrical reliability may decrease.
【0018】これは、内層用基板表面に付着して持ち出
された粗面化前処理液が、流れ落ちたり搬送の力により
内層用基板表面を流れるとき、空気中の酸素を取り込ん
で特に活性化し、粗面化前処理液がたくさん流れた部分
の銅回路が過度にエッチングされる場合があり、部分的
に断面積が小さくなって、銅回路に流すことができる電
流量が低下すると考えられる。しかし、粗面化前処理液
で前処理した後洗浄液に浸漬する間に空気中を搬送する
時間が70秒以下であると、このエッチングが余り進行
せず、基板の表面に形成された銅回路に流すことができ
る電流量が低下しにくいと考えられる。This is because, when the roughening pretreatment liquid adhered to the surface of the inner layer substrate and taken out of the inner layer substrate flows down or flows on the inner layer substrate surface by the force of transportation, it takes in oxygen in the air and is particularly activated. The copper circuit in the portion where the roughening pretreatment liquid has flowed a lot may be excessively etched, and the cross-sectional area is partially reduced, so that the amount of current that can be passed through the copper circuit is considered to decrease. However, if the time for carrying in air during immersion in the cleaning liquid after pre-treatment with the roughening pre-treatment liquid is 70 seconds or less, this etching does not proceed so much, and the copper circuit formed on the surface of the substrate does not proceed. It is considered that the amount of current that can be supplied to the power supply hardly decreases.
【0019】なお、本発明の「空気中を搬送する時間」
とは、粗面化前処理液から内層用基板が出た瞬間から、
次の液に内層用基板が接触する瞬間までの全体の時間を
表し、例えば、粗面化前処理液が入った槽から内層用基
板を取り出した後、その槽の上の空気中で停止して基板
表面の液をある程度落とし、次いで空気に露出したまま
搬送した後、次工程の液に浸漬する方法の場合には、空
気中で停止する時間等も含むものである。It should be noted that the "time for transporting in the air" of the present invention.
Means, from the moment the inner layer substrate comes out of the roughening pretreatment liquid,
Represents the entire time until the moment when the inner layer substrate comes into contact with the next liquid, for example, after removing the inner layer substrate from the tank containing the roughening pretreatment liquid, stop in the air above that tank In the case of a method in which the liquid on the surface of the substrate is dropped to some extent and then conveyed while being exposed to the air, the substrate is dipped in the liquid in the next step.
【0020】なお、内層用基板を搬送する部分の空気
(雰囲気)の温度は、0〜40℃であると好ましい。4
0℃を越えると、内層用基板の表面に形成された銅回路
に流すことができる電流量が低下し、電気的信頼性が低
下する場合がある。また、0℃以下であると、用いる水
溶液等が凍る場合があり実用的でない。The temperature of the air (atmosphere) in the portion where the substrate for the inner layer is transferred is preferably 0 to 40 ° C. 4
If the temperature exceeds 0 ° C., the amount of current that can flow through the copper circuit formed on the surface of the inner layer substrate decreases, and the electrical reliability may decrease. If the temperature is lower than 0 ° C., the aqueous solution to be used may freeze, which is not practical.
【0021】洗浄液に浸漬する条件としては特に限定す
るものではなく、粗面化前処理液が洗浄できる程度に適
宜設定する。なお、洗浄液としては、特に限定するもの
ではないが、水であると経済的に好ましい。The conditions for immersion in the cleaning liquid are not particularly limited, and are appropriately set to such an extent that the pretreatment liquid for roughening can be cleaned. The washing liquid is not particularly limited, but water is economically preferable.
【0022】次いで、耐酸粗面化処理を行う。この酸化
処理の方法としては一般の方法が適用でき、例えば、亜
塩素酸ナトリウム、過硫酸カリウム等の酸化剤と、水酸
化ナトリウム等のアルカリを含む液で処理して銅回路の
表面を酸化銅とした後、例えばジメチルアミンボラン等
の有機性還元剤水溶液に浸漬する方法や、弱酸と銅のキ
レート剤を含有する溶液に浸漬する方法や、亜鉛粉末を
コーティングして硫酸に浸漬することにより活性水素を
発生させて処理する方法等で酸化銅を還元して耐酸処理
皮膜を形成する方法や、銅回路の光沢面を直接ギ酸、銅
イオン及び銅イオンのキレート剤を含有する酸性水溶液
で処理することにより耐酸処理皮膜を形成する方法が挙
げられる。Next, an acid roughening treatment is performed. As the method of this oxidation treatment, a general method can be applied.For example, the surface of a copper circuit is treated with a liquid containing an oxidizing agent such as sodium chlorite and potassium persulfate and an alkali such as sodium hydroxide to form a copper oxide. After that, for example, a method of dipping in an aqueous solution of an organic reducing agent such as dimethylamine borane, a method of dipping in a solution containing a chelating agent of a weak acid and copper, or a method of coating zinc powder and dipping in sulfuric acid A method of forming an acid-resistant treatment film by reducing copper oxide by a method of generating and treating hydrogen, or treating a glossy surface of a copper circuit directly with an acidic aqueous solution containing formic acid, copper ions and a chelating agent of copper ions. Thus, a method of forming an acid-resistant film can be given.
【0023】次いで水洗して耐酸粗面化処理の処理液を
洗浄する。なお、耐酸粗面化処理の前に、塩酸等の酸を
用いて洗浄し、水洗した後、耐酸粗面化処理をしてもよ
い。また、耐酸粗面化処理の後、シランカップリング剤
等の溶液に浸漬したり、耐酸粗面化処理等にて吸収した
水分を除去するために加熱乾燥を行っても良い。Next, the substrate is washed with water to wash the treatment liquid for the acid-resistant surface roughening treatment. Note that, before the acid-resistant surface-roughening treatment, the surface may be washed with an acid such as hydrochloric acid, washed with water, and then subjected to the acid-resistant surface-roughening treatment. After the acid surface-roughening treatment, the substrate may be immersed in a solution of a silane coupling agent or the like, or may be heated and dried to remove moisture absorbed by the acid surface-roughening treatment or the like.
【0024】上記の方法で耐酸粗面化処理を行った内層
用基板の、少なくとも一方の面にプリプレグを積層し、
さらにその積層物の最外層に金属箔を積層した後、加熱
加圧成形して多層板を製造する。加熱加圧成形の条件と
しては、用いたプリプレグの熱硬化性樹脂が硬化する条
件で適宜調整して加熱加圧を行う。[0024] A prepreg is laminated on at least one surface of the inner layer substrate subjected to the acid roughening treatment by the above method,
Furthermore, after laminating a metal foil on the outermost layer of the laminate, the laminate is manufactured by heating and pressing. The heating and pressurizing is performed under the condition that the thermosetting resin of the used prepreg is cured as appropriate.
【0025】本発明に用いるプリプレグは、基材に熱硬
化性樹脂を含浸し、必要に応じて乾燥したものであり、
このプリプレグに用いられる基材としては、ガラス等の
無機質繊維やポリエステル、ポリアミド、ポリアクリ
ル、ポリイミド等の有機質繊維や、木綿等の天然繊維の
クロス、ペーパー等を用いることができる。なお、ガラ
ス繊維等の無機質繊維が耐熱性、耐湿性に優れており好
ましい。The prepreg used in the present invention is obtained by impregnating a base material with a thermosetting resin and, if necessary, drying it.
As the base material used for the prepreg, inorganic fibers such as glass, organic fibers such as polyester, polyamide, polyacryl, and polyimide, and natural fiber cloth and paper such as cotton can be used. In addition, inorganic fibers such as glass fibers are preferable because they have excellent heat resistance and moisture resistance.
【0026】また、このプリプレグに用いられる熱硬化
性樹脂としては、エポキシ樹脂系、フェノール樹脂系、
ポリイミド樹脂系、不飽和ポリエステル樹脂系、ポリフ
ェニレンエーテル樹脂系等の単独、変性物、混合物のよ
うに、熱硬化性樹脂全般を用いることができ、必要に応
じてシリカ、炭酸カルシウム、水酸化アルミニウム、タ
ルク等の無機質粉末充填材や、ガラス繊維、パルプ繊
維、合成繊維、セラミック繊維等の繊維質充填材を含有
させることができる。なお、内層用基板に使用される樹
脂とプリプレグに使用される樹脂は、同じでもよく、異
なっていてもよい。As the thermosetting resin used for the prepreg, epoxy resin, phenol resin,
Polyimide resin type, unsaturated polyester resin type, polyphenylene ether resin type alone, modified products, like mixtures, thermosetting resins can be used in general, silica, calcium carbonate, aluminum hydroxide, if necessary, An inorganic powder filler such as talc, and a fibrous filler such as glass fiber, pulp fiber, synthetic fiber, and ceramic fiber can be contained. The resin used for the inner layer substrate and the resin used for the prepreg may be the same or different.
【0027】本発明に用いられる金属箔としては特に限
定するものではなく、銅、アルミニウム、真鍮、ニッケ
ル等の単独、合金、複合の金属箔を用いることができ、
金属箔の代わりに金属箔が積層成形された片面金属張積
層板、両面金属張積層板を用いることもできる。The metal foil used in the present invention is not particularly limited, and a single, alloy, or composite metal foil of copper, aluminum, brass, nickel, or the like can be used.
Instead of the metal foil, a single-sided metal-clad laminate or a double-sided metal-clad laminate obtained by laminating a metal foil can also be used.
【0028】[0028]
(実施例1)大きさ51×34cm、銅箔を除く厚み
0.2mmのガラス基材エポキシ樹脂両面銅張積層板
[松下電工株式会社製、商品名R−1766]の銅箔
(厚み35μm)をエッチングし、表面に幅0.15m
mの銅回路を形成した内層用基板を得た。次いでその内
層用基板を下記条件の粗面化前処理液で前処理した後、
粗面化前処理液で前処理した後洗浄液に浸漬する間に空
気中を搬送する時間が30秒となる条件で、30℃の空
気中を搬送し、次いで水に浸漬して洗浄した後、塩酸を
120g/L含有する塩酸水溶液を用いて30℃で90
秒処理し、次いで水洗した後、下記条件の耐酸粗面化処
理し、次いで水洗して、耐酸粗面化処理した内層用基板
を得た。(Example 1) Copper foil of a glass substrate epoxy resin double-sided copper-clad laminate [manufactured by Matsushita Electric Works Co., Ltd., trade name: R-1766] having a size of 51 × 34 cm and a thickness of 0.2 mm excluding the copper foil (thickness: 35 µm) Is etched and the surface is 0.15 m wide
Thus, a substrate for an inner layer having a copper circuit of m was obtained. Then, after pre-treating the inner layer substrate with a roughening pretreatment liquid under the following conditions,
After pre-treating with a roughening pre-treatment liquid, the sheet is conveyed in air at 30 ° C., and then immersed in water and washed, under the condition that the time for conveyance in air is 30 seconds during immersion in the cleaning liquid after immersion in the cleaning liquid. Using an aqueous hydrochloric acid solution containing 120 g / L of hydrochloric acid at 30 ° C., 90
After a second treatment and then washing with water, an acid-resistant surface-roughening treatment under the following conditions was carried out, followed by water washing to obtain an acid-resistant surface-roughened inner layer substrate.
【0029】前処理の方法は、塩酸130g/L、塩化
第二銅15g/L含有した水溶液よりなる34℃の粗面
化前処理液に、上記内層用基板を90秒浸漬して処理し
た。In the pretreatment method, the inner layer substrate was immersed for 90 seconds in a pretreatment solution for surface roughening at 34 ° C., which was composed of an aqueous solution containing 130 g / L of hydrochloric acid and 15 g / L of cupric chloride.
【0030】また、耐酸粗面化処理は、亜塩素酸ナトリ
ウムを100g/L、水酸化ナトリウムを43g/L、
リン酸ナトリウムを15g/L含有した水溶液よりなる
75℃の酸化処理液に5分浸漬し、水洗した後、120
℃で30分乾燥して銅回路表面に酸化銅を形成した。次
いで、エチレンジアミン四酢酸、希硫酸、ほう酸、カル
ボン酸を含有するpH3.7の処理液により酸化銅を還
元して処理した。The acid roughening treatment is carried out by adding 100 g / L of sodium chlorite, 43 g / L of sodium hydroxide,
After being immersed in an oxidation treatment solution at 75 ° C. consisting of an aqueous solution containing 15 g / L of sodium phosphate for 5 minutes, washed with water,
It dried at 30 degreeC for 30 minutes, and formed copper oxide on the copper circuit surface. Next, copper oxide was reduced and treated with a pH 3.7 treatment solution containing ethylenediaminetetraacetic acid, dilute sulfuric acid, boric acid, and carboxylic acid.
【0031】(実施例2)粗面化前処理液で前処理した
後洗浄液に浸漬する間に空気中を搬送する時間が60秒
であること以外は、実施例1と同様にして耐酸粗面化処
理した内層用基板を得た。(Example 2) An acid-resistant rough surface was prepared in the same manner as in Example 1 except that the time required for carrying in the air during the pretreatment with the pretreatment solution for roughening was 60 seconds during immersion in the cleaning solution. Thus, an inner layer substrate subjected to the chemical treatment was obtained.
【0032】(比較例1)粗面化前処理液で前処理した
後洗浄液に浸漬する間に空気中を搬送する時間が90秒
であること以外は、実施例1と同様にして耐酸粗面化処
理した内層用基板を得た。(Comparative Example 1) An acid-resistant rough surface was prepared in the same manner as in Example 1 except that the time required for carrying in the air during immersion in the cleaning solution after pretreatment with the roughening pretreatment solution was 90 seconds. Thus, an inner layer substrate subjected to the chemical treatment was obtained.
【0033】(比較例2)粗面化前処理液で前処理した
後洗浄液に浸漬する間に空気中を搬送する時間が120
秒であること以外は、実施例1と同様にして耐酸粗面化
処理した内層用基板を得た。(Comparative Example 2) After pretreatment with a roughening pretreatment liquid, the time for transporting in the air during immersion in the cleaning liquid is 120.
An inner layer substrate subjected to an acid-resistant surface-roughening treatment was obtained in the same manner as in Example 1 except that the time was seconds.
【0034】(評価、結果)実施例1,2及び比較例
1,2で得られた内層用基板の許容電流を測定した。そ
の方法は、銅回路に電流を流し、銅回路の温度が10℃
上昇する電流の値を求めた。(Evaluation and Results) The allowable currents of the inner layer substrates obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were measured. The method is to apply a current to a copper circuit and to raise the temperature of the copper circuit to 10 ° C.
The value of the rising current was determined.
【0035】その結果は表1に示したとおり、各実施例
は各比較例と比べて許容電流が高く、内層用基板表面に
形成された銅回路に流すことができる電流量が低下しに
くいことが確認された。The results are shown in Table 1. As shown in Table 1, each of the examples has a higher allowable current than each of the comparative examples, and the amount of current that can be passed through the copper circuit formed on the surface of the inner layer substrate is not easily reduced. Was confirmed.
【0036】[0036]
【表1】 [Table 1]
【0037】[0037]
【発明の効果】本発明に係る多層板の製造方法は、粗面
化前処理液で前処理した後洗浄液に浸漬する間に空気中
を搬送する時間が、70秒以下であるため、内層用基板
表面に形成された銅回路に流すことができる電流量が低
下しにくい多層板が得られる。According to the method for producing a multilayer board of the present invention, the time required for transporting in the air during pre-treatment with a roughening pre-treatment liquid and immersion in a cleaning liquid is 70 seconds or less. A multilayer board is obtained in which the amount of current that can be passed through the copper circuit formed on the substrate surface is unlikely to decrease.
Claims (2)
酸及び塩化第二銅を含む粗面化前処理液で前処理した
後、空気中を搬送し、次いで洗浄液に浸漬した後、耐酸
粗面化処理を行い、次いでその内層用基板の少なくとも
一方の面にプリプレグを積層し、さらにその積層物の最
外層に金属箔を積層した後、加熱加圧成形して製造する
多層板の製造方法であって、上記粗面化前処理液に塩酸
を120〜150グラム/リットル含み、塩化第二銅を
10〜20グラム/リットル含む多層板の製造方法にお
いて、粗面化前処理液で前処理した後洗浄液に浸漬する
間に空気中を搬送する時間が、70秒以下であることを
特徴とする多層板の製造方法。1. An inner layer substrate having a copper circuit on its surface is pretreated with a roughening pretreatment solution containing hydrochloric acid and cupric chloride, transported in the air, then immersed in a cleaning solution, and then acid-resistant. Performing a surface roughening process, then laminating a prepreg on at least one surface of the inner layer substrate, laminating a metal foil on the outermost layer of the laminate, and then heating and press molding to produce a multilayer board. The method for producing a multilayer board, wherein the roughening pretreatment liquid contains hydrochloric acid at 120 to 150 g / l and cupric chloride at 10 to 20 g / l, the pretreatment with the roughening pretreatment liquid A method for producing a multilayer board, wherein the time of transport in the air during immersion in a cleaning solution after the treatment is 70 seconds or less.
が0〜40℃であることを特徴とする請求項1記載の多
層板の製造方法。2. The method for producing a multilayer board according to claim 1, wherein the temperature of the air in the portion for transporting the inner layer substrate is 0 to 40 ° C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34931996A JPH10190226A (en) | 1996-12-27 | 1996-12-27 | Manufacture of multilayer board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34931996A JPH10190226A (en) | 1996-12-27 | 1996-12-27 | Manufacture of multilayer board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10190226A true JPH10190226A (en) | 1998-07-21 |
Family
ID=18402978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34931996A Pending JPH10190226A (en) | 1996-12-27 | 1996-12-27 | Manufacture of multilayer board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10190226A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290423A (en) * | 2004-03-31 | 2005-10-20 | Best Ginning Enterprise Co Ltd | Surface adhesion accelerator for copper and copper alloy, and its use method |
JP2009097034A (en) * | 2007-10-16 | 2009-05-07 | Hitachi Chem Co Ltd | Copper surface treatment method |
-
1996
- 1996-12-27 JP JP34931996A patent/JPH10190226A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290423A (en) * | 2004-03-31 | 2005-10-20 | Best Ginning Enterprise Co Ltd | Surface adhesion accelerator for copper and copper alloy, and its use method |
JP2009097034A (en) * | 2007-10-16 | 2009-05-07 | Hitachi Chem Co Ltd | Copper surface treatment method |
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