JPH0357638B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to a method for manufacturing a printed wiring board by electroless plating such as a full additive method. (Prior art) When manufacturing printed wiring boards by electroless plating such as the full additive method, an insulating substrate containing a plating catalyst such as palladium or a palladium compound is used, and an adhesive containing the plating catalyst is applied to the surface of the insulating substrate. It has a composition that is coated on the surface. In an insulating substrate having holes for through holes, a plating catalyst is attached to the inner wall surface of the hole in order to improve the plating deposition rate on the inner wall of the hole and form a sufficiently thick plating layer. (Problem to be solved by the invention) However, normally, after the plating catalyst is adhered to the inner wall surface of the hole, it is immersed in a roughening solution for roughening treatment. There was a drawback that parts were removed. An object of the present invention is to provide a method for manufacturing a printed wiring board that can improve the above-mentioned drawbacks, improve the plating deposition rate on the inner wall surface of the hole, and deposit a sufficient thickness of plating. (Means for Solving the Problems) In order to achieve the above object, the present invention has a hole for a through hole, and a hole is inserted into the hole of an insulating plate coated with a plating catalyst-containing adhesive. In the manufacturing method of a printed wiring board in which a plating catalyst is attached, then roughening treatment is performed, and a circuit is formed by electroless plating. Provided is a method for manufacturing a printed wiring board, comprising the steps of applying the resin to an inner wall, roughening the adhesive layer after the step, and removing the resin with an alkaline aqueous solution after the step. It is. (Function) According to the present invention, after the plating catalyst is deposited, the plating catalyst is coated with a resin before roughening. As this resin, a substance having two or more carboxylic acids and an unsaturated group, which becomes alkali-soluble by reacting with an alkali component, is used. In other words, acids include maleic acid, phthalic acid, methylnadic acid,
Acids and anhydrides having two or more carboxyl groups such as pyromellitic acid are used, and monomers that react with these carboxylic acids include ethylene,
It is made into a copolymer using styrene, vinyl acetate, acrylic ester, etc. The carboxyl group of this copolymer resin reacts with caustic soda, caustic potash, etc. to become an alkali salt, and becomes easily soluble in an alkaline solution. As the roughening liquid, H ₂ SO ₄ ,
Acids such as NaF, Cr ₂ O ₅ , HBF ₄ , and Na ₂ Cr ₂ O ₇ are used, but the resin does not dissolve in these acids. Therefore, the plated catalyst is retained as it is on the inner wall surface of the hole. After the roughening treatment, washing with alkaline solution dissolves the resin and exposes the plating catalyst.
Therefore, when electroless plating is performed thereafter, plating catalyst of sufficient thickness is deposited quickly because the plating catalyst remains on the inner wall surface of the hole. Note that when holes are made by punching, cracks may occur on the inner wall of the hole, and resin may enter these cracks and not dissolve easily in alkaline liquid, resulting in poor plating precipitation. A plating catalyst may be mixed therein. (Examples) The present invention will be described below based on illustrated examples. As the insulating substrate 1, a paper epoxy resin laminate (ACC-E-144 manufactured by Hitachi Chemical Co., Ltd.) with a thickness of 1.5 mm is used.
As shown in Figure 1, an adhesive containing a plating catalyst (HA-21 manufactured by Hitachi Chemical Co., Ltd.) is applied to this to form an adhesive layer 2, and holes 3 for through holes are formed by punching. do. Next, the catalyst 4 (HS-201B manufactured by Hitachi Chemical Co., Ltd.) was washed and plated on the inner wall surface of the hole 3 as shown in Figure 2.
Attach. After depositing the plating catalyst 4, it was post-treated with 10% sulfuric acid, then immersed in a 5% toluene solution of an equimolar copolymer of maleic anhydride and styrene, dried, and the surface area was puff-polished. Then, as shown in FIG. 3, a resin layer 5 was formed only on the inner wall surface of the hole 3. After forming the resin layer 5, as shown in Fig. 4, plating resist ink (HNR-01BK manufactured by Hitachi Chemical Co., Ltd.) was screen printed on the surface of the adhesive layer 2 to a thickness of 20 μm, and placed in an atmosphere at a temperature of 160°C. The plated resist layer 6 is formed by leaving it in the solution for 30 minutes to harden it. After forming the plating resist layer 6, the insulating substrate 1 is
NaF (20g/), H ₂ SO ₄ (400ml/), Cr ₂ O ₅ (40
The adhesive layer 2 is roughened by immersing it in a roughening solution of 40° C. (g/) for 7 minutes, as shown in FIG. After roughening the adhesive layer 2, it is immersed in a caustic soda solution (1 g/) at a temperature of 70° C. for 10 minutes to remove the resin layer 5 in the holes 3, as shown in FIG. After removing the resin layer 5, electroless copper plating treatment is performed,
As shown in FIG. 7, a copper plating layer 7 having a thickness of 25 μm is formed. After forming the copper plating layer 7, solder resist processing and character printing processing are performed to manufacture a printed wiring board. That is, in the above Example 1, after the plating catalyst 4 is attached to the inner wall surface of the hole 3, the plating catalyst 4 is covered with the resin layer 5, and after roughening, the resin layer 5 is peeled off, and the plating catalyst 4 is coated with the resin layer 5. Since the plating catalyst 4 attached to the inner wall surface of the hole 3 is not removed by the roughening treatment, the plating deposition rate can be improved, and a sufficient thickness can be achieved. Sanometsuki can be precipitated. Regarding Example 1 of the present invention, the in-hole take time, the number of voids in the in-hole plating, and the number of blowholes were investigated, and the results shown in the table were obtained. The manufacturing conditions for each example and conventional example are as follows. Example 2 In Example 1, a 5% solution of vinyl acetate and maleic anhydride copolymer is used when forming the resin layer. Example 3 In Example 1, a copolymer solution in which a palladium plating catalyst (CAT-10 manufactured by Hitachi Chemical Co., Ltd.) was added and dispersed in an amount of 0.5% by weight based on the solid content was used. Example 4 In Example 3, an insulating substrate (LE-4 manufactured by Hitachi Chemical Co., Ltd.) without a plating catalyst is used. Conventional Example It is assumed that the resin layer 5 forming process in Example 1 is omitted. In addition, the take time in the hole is the plating time until the entire inner wall of the hole becomes copper-colored, and the number of plating voids in the hole is the number of voids that occur in the copper foil when the inner wall surface of one hole is viewed with a microscope at 50 times magnification. The number of blowholes occurs at a temperature of 260
Soldering was performed at ℃ for 5 seconds, and the ratio of the number of holes in which blowholes were generated to the total number of holes was calculated.

[Table] As is clear from the table, according to the examples of the present invention,
Compared to the conventional example, the take time in the hole is more than 4 times faster, the number of plating voids in the hole is less than 1/10, and the number of blowholes is less than 2/13. In addition, when a plating catalyst is mixed into the resin layer 5, the take time in the hole is reduced to 2/3 compared to the case where it is not mixed, and the plating deposition rate is further improved. (Effects of the Invention) As described above, according to the present invention, by covering the plating catalyst with a resin layer before roughening and removing this resin layer after roughening, the plating deposition rate can be significantly improved, and voids can be eliminated. A method for manufacturing a sufficiently thick printed wiring board with substantial thickness and little plating is obtained.

[Brief explanation of drawings]

1 to 7 show diagrams of the manufacturing process of the present invention,
Figure 1 is a cross-sectional view of the insulating substrate, Figure 2 is a cross-sectional view of the insulating substrate to which a plating catalyst has been attached, Figure 3 is a cross-sectional view of the insulating substrate on which a resin layer has been formed, and Figure 4 is after the formation of the plating resist layer. 5 is a cross-sectional view of the insulating substrate after roughening treatment, FIG. 6 is a cross-sectional view of the insulating substrate with the resin layer removed, and FIG. 7 is a cross-sectional view of the insulating substrate after the copper plating layer is formed. A cross-sectional view is shown. 1... Insulating substrate, 2... Adhesive layer, 3... Hole,
4...Plating catalyst, 5...Resin layer, 6...Plating resist layer, 7...Copper plating layer.

Claims (1)

[Claims] 1 A plating catalyst was adhered to the holes of an insulating plate having holes for through holes and coated with an adhesive containing a plating catalyst, and then subjected to roughening treatment and electroless plating to form a circuit. In the method for manufacturing a printed wiring board, after depositing a plating catalyst, applying a resin that becomes soluble by reacting with an alkali component to the inner wall of the hole;
A method for producing a printed wiring board, which comprises performing a step of roughening the adhesive layer after the step, and a step of removing the resin with an alkaline aqueous solution after the step.