JPH0357638B2 - - Google Patents
Info
- Publication number
- JPH0357638B2 JPH0357638B2 JP61188185A JP18818586A JPH0357638B2 JP H0357638 B2 JPH0357638 B2 JP H0357638B2 JP 61188185 A JP61188185 A JP 61188185A JP 18818586 A JP18818586 A JP 18818586A JP H0357638 B2 JPH0357638 B2 JP H0357638B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- hole
- plating catalyst
- resin
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 49
- 239000003054 catalyst Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 238000007788 roughening Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- 239000000758 substrate Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- -1 acrylic ester Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical group OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
(産業上の利用分野)
本発明はフルアデイテイブ法等の無電解めつき
による印刷配線板の製造方法に関するものであ
る。
(従来の技術)
フルアデイテイブ法等の無電解めつきにより印
刷配線板を製造する場合、パラジウムやパラジウ
ム化合物等のめつき触媒を含有する絶縁基板を用
い、めつき触媒を含有する接着剤がその表面に塗
布された構成になつている。そしてスルーホール
用の孔を有する絶縁基板では、孔内壁のめつき析
出速度を向上し、充分な厚みのめつき層が形成さ
れるように、孔内壁面にめつき触媒を付着してい
る。
(発明が解決しようとする問題点)
しかし、通常、孔内壁面にめつき触媒を付着
後、粗化液中に浸漬して粗化処理しており、この
処理のためにめつき触媒の大部分が除去されてし
まう欠点があつた。
本発明の目的は、以上の欠点を改良し、孔内壁
面のめつき析出速度を向上し充分な厚さのめつき
を析出しうる印刷配線板の製造方法を提供するも
のである。
(問題点を解決するための手段)
本発明は、上記の目的を達成するために、スル
ーホール用の孔を有し、めつき触媒入り接着剤の
塗布された絶縁板の前記孔内にめつき触媒を付着
し、次いで、粗化処理し、無電解めつきして回路
を形成した印刷配線板の製造方法において、めつ
き触媒を付着後、アルカリ成分と反応して可溶性
となる樹脂を孔内壁に塗布する工程と、該工程後
に接着剤層を粗化する工程と、該工程後に前記樹
脂をアルカリ性水溶液により除去する工程とを行
なうことを特徴とする印刷配線板の製造方法を提
供するものである。
(作用)
本発明によれば、めつき触媒を付着後、粗化前
にこのめつき触媒を樹脂により被覆している。こ
の樹脂としてはアルカリ成分と反応してアルカリ
可溶性となる、カルボン酸を2個以上有し不飽和
基を所有する物質を用いる。すなわち酸としては
特にマレイン酸やフタル酸、メチルナジツク酸、
ピロメリツト酸などの2ケ以上のカルボキシル基
を有する酸および無水物等が用いられ、これらの
カルボン酸と反応するモノマーとしてエチレン、
スチレン、酢酸ビニル、アクリル酸エステル等を
用い、共重合体とする。そしてこの共重合体であ
る樹脂はカルボキシル基基が苛性ソーダや苛性カ
リ等と反応してアルカリ塩となり、アルカリ液に
易溶となる。そして粗化液としては、H2SO4、
NaF、Cr2O5系やHBF4、Na2Cr2O7系等の酸を用
いるが、これ等の酸によつては樹脂は溶解しな
い。従つて、めつき触媒はそのまま孔内壁面に保
持される。粗化処理後、アルカリ液で洗浄するこ
とにより、樹脂が溶けてめつき触媒が露出する。
それ故、その後無電解めつき処理をすると孔内壁
面にめつき触媒が残つているために、充分な厚さ
のめつきが、速く析出する。
なお、パンチングにより孔を明ける場合には孔
内壁にクラツクが生じ、このクラツクに樹脂が入
り込み、アルカリ液に容易に溶けず、めつき析出
不良を生じる恐れがあるが、このような場合には
樹脂中にめつき触媒を混入させてもよい。
(実施例)
以下、本発明を図示の実施例に基づいて説明す
る。
絶縁基板1としては、厚さ1.5mmの紙エポキシ
樹脂積層板(日立化成工業社製ACC−E−144)
を用い、これに第1図に示す通りめつき触媒入り
の接着剤(日立化成工業社製HA−21)を塗布し
て接着剤層2を形成し、パンチングによりスルー
ホール用の孔3を形成する。
次に洗浄して、第2図に示す通り、孔3内壁面
にめつき触媒4(日立化成工業社製HS−201B)
を付着する。
めつき触媒4を付着後、濃度10%の硫酸で後処
理し、その後、無水マレイン酸とスチレンの等モ
ル比共重合体の5%トルエン溶液に浸漬して乾燥
し、表面部分をパフ研摩して、第3図に示す通
り、孔3内壁面のみに樹脂層5を形成した。
樹脂層5を形成後、第4図に示す通り、接着剤
層2の表面に、めつきレジストインク(日立化成
工業社製HNR−01BK)を厚さ20μmにスクリー
ン印刷し、温度160℃の雰囲気中に30分間放置し
て硬化させ、めつきレジスト層6を形成する。
めつきレジスト層6を形成後、絶縁基板1を、
NaF(20g/)、H2SO4(400ml/)、Cr2O5(40
g/)からなる温度40℃の粗化液中に7分間浸
漬し、第5図に示す通り、接着剤層2を粗化す
る。
接着剤層2を粗化後、温度70℃の苛性ソーダ液
(1g/)中に10分間浸漬し、第6図に示す通
り、孔3内の樹脂層5を除去する。
樹脂層5を除去後、無電解銅めつき処理をし、
第7図に示す通り、厚さ25μmの銅めつき層7を
形成する。
銅めつき層7を形成後、半田レジスト処理や文
字印刷処理を行ない印刷配線板を製造する。
すなわち、上記実施例1においては、孔3内壁
面にめつき触媒4を付着後、このめつき触媒4を
樹脂層5で被覆し、粗化後に、この樹脂層5を剥
離し、めつき触媒4を露出して無電解銅めつき処
理しているために、孔3内壁面に付着しためつき
触媒4は粗化処理により除去されることなく、め
つき析出速度を向上でき、充分な厚さのめつきを
析出できる。
なお、本発明実施例1について、孔内テークタ
イム、孔内めつきのボイド数、ブローホール発生
数を調べたところ表に示す通りの結果が得られ
た。
各実施例及び従来例の製造条件は次の通りとす
る。
実施例 2
実施例1において、樹脂層形成の際、酢酸ビニ
ル、無水マレイン酸共重合体の5%溶液を用い
る。
実施例 3
実施例1において、共重合体溶液中にパラジウ
ムめつき触媒(日立化成工業社製CAT−10)を
固形分に対して0.5重量%となるように添加分散
させたものを用いる。
実施例 4
実施例3においてめつき触媒のない絶縁基板
(日立化成工業社製LE−4)を用いる。
従来例
実施例1において樹脂層5形成処理を省略した
ものとする。
また、孔内テークタイムは孔内壁全面が銅色と
なる迄のめつき時間とし、孔内めつきボイド数は
1ケの孔内壁面を50倍の顕微鏡でみて銅箔に生ず
るボイド数とし、ブローホール発生数は温度260
℃で5秒間の半田処理を行い、ブローホールが発
生した孔の全体の孔数に対する比とした。
(Industrial Application Field) The present invention relates to a method for manufacturing a printed wiring board by electroless plating such as a full additive method. (Prior art) When manufacturing printed wiring boards by electroless plating such as the full additive method, an insulating substrate containing a plating catalyst such as palladium or a palladium compound is used, and an adhesive containing the plating catalyst is applied to the surface of the insulating substrate. It has a composition that is coated on the surface. In an insulating substrate having holes for through holes, a plating catalyst is attached to the inner wall surface of the hole in order to improve the plating deposition rate on the inner wall of the hole and form a sufficiently thick plating layer. (Problem to be solved by the invention) However, normally, after the plating catalyst is adhered to the inner wall surface of the hole, it is immersed in a roughening solution for roughening treatment. There was a drawback that parts were removed. An object of the present invention is to provide a method for manufacturing a printed wiring board that can improve the above-mentioned drawbacks, improve the plating deposition rate on the inner wall surface of the hole, and deposit a sufficient thickness of plating. (Means for Solving the Problems) In order to achieve the above object, the present invention has a hole for a through hole, and a hole is inserted into the hole of an insulating plate coated with a plating catalyst-containing adhesive. In the manufacturing method of a printed wiring board in which a plating catalyst is attached, then roughening treatment is performed, and a circuit is formed by electroless plating. Provided is a method for manufacturing a printed wiring board, comprising the steps of applying the resin to an inner wall, roughening the adhesive layer after the step, and removing the resin with an alkaline aqueous solution after the step. It is. (Function) According to the present invention, after the plating catalyst is deposited, the plating catalyst is coated with a resin before roughening. As this resin, a substance having two or more carboxylic acids and an unsaturated group, which becomes alkali-soluble by reacting with an alkali component, is used. In other words, acids include maleic acid, phthalic acid, methylnadic acid,
Acids and anhydrides having two or more carboxyl groups such as pyromellitic acid are used, and monomers that react with these carboxylic acids include ethylene,
It is made into a copolymer using styrene, vinyl acetate, acrylic ester, etc. The carboxyl group of this copolymer resin reacts with caustic soda, caustic potash, etc. to become an alkali salt, and becomes easily soluble in an alkaline solution. As the roughening liquid, H 2 SO 4 ,
Acids such as NaF, Cr 2 O 5 , HBF 4 , and Na 2 Cr 2 O 7 are used, but the resin does not dissolve in these acids. Therefore, the plated catalyst is retained as it is on the inner wall surface of the hole. After the roughening treatment, washing with alkaline solution dissolves the resin and exposes the plating catalyst.
Therefore, when electroless plating is performed thereafter, plating catalyst of sufficient thickness is deposited quickly because the plating catalyst remains on the inner wall surface of the hole. Note that when holes are made by punching, cracks may occur on the inner wall of the hole, and resin may enter these cracks and not dissolve easily in alkaline liquid, resulting in poor plating precipitation. A plating catalyst may be mixed therein. (Examples) The present invention will be described below based on illustrated examples. As the insulating substrate 1, a paper epoxy resin laminate (ACC-E-144 manufactured by Hitachi Chemical Co., Ltd.) with a thickness of 1.5 mm is used.
As shown in Figure 1, an adhesive containing a plating catalyst (HA-21 manufactured by Hitachi Chemical Co., Ltd.) is applied to this to form an adhesive layer 2, and holes 3 for through holes are formed by punching. do. Next, the catalyst 4 (HS-201B manufactured by Hitachi Chemical Co., Ltd.) was washed and plated on the inner wall surface of the hole 3 as shown in Figure 2.
Attach. After depositing the plating catalyst 4, it was post-treated with 10% sulfuric acid, then immersed in a 5% toluene solution of an equimolar copolymer of maleic anhydride and styrene, dried, and the surface area was puff-polished. Then, as shown in FIG. 3, a resin layer 5 was formed only on the inner wall surface of the hole 3. After forming the resin layer 5, as shown in Fig. 4, plating resist ink (HNR-01BK manufactured by Hitachi Chemical Co., Ltd.) was screen printed on the surface of the adhesive layer 2 to a thickness of 20 μm, and placed in an atmosphere at a temperature of 160°C. The plated resist layer 6 is formed by leaving it in the solution for 30 minutes to harden it. After forming the plating resist layer 6, the insulating substrate 1 is
NaF (20g/), H 2 SO 4 (400ml/), Cr 2 O 5 (40
The adhesive layer 2 is roughened by immersing it in a roughening solution of 40° C. (g/) for 7 minutes, as shown in FIG. After roughening the adhesive layer 2, it is immersed in a caustic soda solution (1 g/) at a temperature of 70° C. for 10 minutes to remove the resin layer 5 in the holes 3, as shown in FIG. After removing the resin layer 5, electroless copper plating treatment is performed,
As shown in FIG. 7, a copper plating layer 7 having a thickness of 25 μm is formed. After forming the copper plating layer 7, solder resist processing and character printing processing are performed to manufacture a printed wiring board. That is, in the above Example 1, after the plating catalyst 4 is attached to the inner wall surface of the hole 3, the plating catalyst 4 is covered with the resin layer 5, and after roughening, the resin layer 5 is peeled off, and the plating catalyst 4 is coated with the resin layer 5. Since the plating catalyst 4 attached to the inner wall surface of the hole 3 is not removed by the roughening treatment, the plating deposition rate can be improved, and a sufficient thickness can be achieved. Sanometsuki can be precipitated. Regarding Example 1 of the present invention, the in-hole take time, the number of voids in the in-hole plating, and the number of blowholes were investigated, and the results shown in the table were obtained. The manufacturing conditions for each example and conventional example are as follows. Example 2 In Example 1, a 5% solution of vinyl acetate and maleic anhydride copolymer is used when forming the resin layer. Example 3 In Example 1, a copolymer solution in which a palladium plating catalyst (CAT-10 manufactured by Hitachi Chemical Co., Ltd.) was added and dispersed in an amount of 0.5% by weight based on the solid content was used. Example 4 In Example 3, an insulating substrate (LE-4 manufactured by Hitachi Chemical Co., Ltd.) without a plating catalyst is used. Conventional Example It is assumed that the resin layer 5 forming process in Example 1 is omitted. In addition, the take time in the hole is the plating time until the entire inner wall of the hole becomes copper-colored, and the number of plating voids in the hole is the number of voids that occur in the copper foil when the inner wall surface of one hole is viewed with a microscope at 50 times magnification. The number of blowholes occurs at a temperature of 260
Soldering was performed at ℃ for 5 seconds, and the ratio of the number of holes in which blowholes were generated to the total number of holes was calculated.
【表】
表から明らかな通り、本発明実施例によれば、
従来例に比べて、孔内テークタイムは4倍以上早
く、孔内めつきボイド数は1/10以下となり、ブロ
ーホール発生数は2/13以下となる。
なお、樹脂層5中にめつき触媒を混入した場合
には、混入しない場合に比べて孔内テークタイム
は2/3となり、めつき析出速度がさらに向上する。
(発明の効果)
以上の通り、本発明によれば、粗化前にめつき
触媒に樹脂層で覆い、粗化後にこの樹脂層を除去
することによりめつき析出速度を著しく向上で
き、ボイドの少ないめつきの実質的な厚みの充分
に厚い印刷配線板の製造方法が得られる。[Table] As is clear from the table, according to the examples of the present invention,
Compared to the conventional example, the take time in the hole is more than 4 times faster, the number of plating voids in the hole is less than 1/10, and the number of blowholes is less than 2/13. In addition, when a plating catalyst is mixed into the resin layer 5, the take time in the hole is reduced to 2/3 compared to the case where it is not mixed, and the plating deposition rate is further improved. (Effects of the Invention) As described above, according to the present invention, by covering the plating catalyst with a resin layer before roughening and removing this resin layer after roughening, the plating deposition rate can be significantly improved, and voids can be eliminated. A method for manufacturing a sufficiently thick printed wiring board with substantial thickness and little plating is obtained.
第1〜第7図は本発明の製造工程の図を示し、
第1図は絶縁基板の断面図、第2図はめつき触媒
を付着した絶縁基板の断面図、第3図は樹脂層を
形成した絶縁基板の断面図、第4図はめつきレジ
スト層形成後の絶縁基板の断面図、第5図は粗化
処理後の絶縁基板の断面図、第6図は樹脂層を除
去した絶縁基板の断面図、第7図は銅めつき層形
成後の絶縁基板の断面図を示す。
1……絶縁基板、2……接着剤層、3……孔、
4……めつき触媒、5……樹脂層、6……めつき
レジスト層、7……銅めつき層。
1 to 7 show diagrams of the manufacturing process of the present invention,
Figure 1 is a cross-sectional view of the insulating substrate, Figure 2 is a cross-sectional view of the insulating substrate to which a plating catalyst has been attached, Figure 3 is a cross-sectional view of the insulating substrate on which a resin layer has been formed, and Figure 4 is after the formation of the plating resist layer. 5 is a cross-sectional view of the insulating substrate after roughening treatment, FIG. 6 is a cross-sectional view of the insulating substrate with the resin layer removed, and FIG. 7 is a cross-sectional view of the insulating substrate after the copper plating layer is formed. A cross-sectional view is shown. 1... Insulating substrate, 2... Adhesive layer, 3... Hole,
4...Plating catalyst, 5...Resin layer, 6...Plating resist layer, 7...Copper plating layer.
Claims (1)
接着剤の塗布された絶縁板の前記孔内にめつき触
媒を付着し、次いで粗化処理し、無電解めつきし
て回路を形成した印刷配線板の製造方法におい
て、めつき触媒を付着後、アルカリ成分と反応し
て可溶性となる樹脂を孔内壁に塗布する工程と、
該工程後に接着剤層を粗化する工程と、該工程後
に前記樹脂をアルカリ性水溶液により除去する工
程とを行なうことを特徴とする印刷配線板の製造
方法。1 A plating catalyst was adhered to the holes of an insulating plate having holes for through holes and coated with an adhesive containing a plating catalyst, and then subjected to roughening treatment and electroless plating to form a circuit. In the method for manufacturing a printed wiring board, after depositing a plating catalyst, applying a resin that becomes soluble by reacting with an alkali component to the inner wall of the hole;
A method for producing a printed wiring board, which comprises performing a step of roughening the adhesive layer after the step, and a step of removing the resin with an alkaline aqueous solution after the step.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18818586A JPS6344797A (en) | 1986-08-11 | 1986-08-11 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18818586A JPS6344797A (en) | 1986-08-11 | 1986-08-11 | Manufacture of printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6344797A JPS6344797A (en) | 1988-02-25 |
JPH0357638B2 true JPH0357638B2 (en) | 1991-09-02 |
Family
ID=16219253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18818586A Granted JPS6344797A (en) | 1986-08-11 | 1986-08-11 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6344797A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58145759A (en) * | 1981-10-29 | 1983-08-30 | Mitsubishi Chem Ind Ltd | Anthraquinone dye, liquid crystal composition containing same and display material therefrom |
JPS5884858A (en) * | 1981-11-16 | 1983-05-21 | Mitsubishi Chem Ind Ltd | Azo-based multicolor dyestuff and liquid crystal composition and display containing the same |
JPS58138768A (en) * | 1982-02-10 | 1983-08-17 | Hitachi Ltd | Liquid crystal composition and display material |
JPH0643584B2 (en) * | 1983-03-23 | 1994-06-08 | 三菱化成株式会社 | Liquid crystal composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS569032A (en) * | 1979-07-03 | 1981-01-29 | Natl House Ind Co Ltd | Production of brace |
JPS6037794A (en) * | 1983-08-10 | 1985-02-27 | 日本電気株式会社 | Method of producing printed circuit board |
-
1986
- 1986-08-11 JP JP18818586A patent/JPS6344797A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS569032A (en) * | 1979-07-03 | 1981-01-29 | Natl House Ind Co Ltd | Production of brace |
JPS6037794A (en) * | 1983-08-10 | 1985-02-27 | 日本電気株式会社 | Method of producing printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS6344797A (en) | 1988-02-25 |
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