JPS60235431A - 半導体組立装置 - Google Patents

半導体組立装置

Info

Publication number
JPS60235431A
JPS60235431A JP59090876A JP9087684A JPS60235431A JP S60235431 A JPS60235431 A JP S60235431A JP 59090876 A JP59090876 A JP 59090876A JP 9087684 A JP9087684 A JP 9087684A JP S60235431 A JPS60235431 A JP S60235431A
Authority
JP
Japan
Prior art keywords
wire
bonding
die
head
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59090876A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228256B2 (enrdf_load_stackoverflow
Inventor
Kuniaki Hamada
浜田　邦昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Marine Instr Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59090876A priority Critical patent/JPS60235431A/ja
Publication of JPS60235431A publication Critical patent/JPS60235431A/ja
Publication of JPH0228256B2 publication Critical patent/JPH0228256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59090876A 1984-05-09 1984-05-09 半導体組立装置 Granted JPS60235431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Publications (2)

Publication Number Publication Date
JPS60235431A true JPS60235431A (ja) 1985-11-22
JPH0228256B2 JPH0228256B2 (enrdf_load_stackoverflow) 1990-06-22

Family

ID=14010682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59090876A Granted JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Country Status (1)

Country Link
JP (1) JPS60235431A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152964A (en) * 1978-05-24 1979-12-01 Hitachi Ltd Automatic assembling machine for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152964A (en) * 1978-05-24 1979-12-01 Hitachi Ltd Automatic assembling machine for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Also Published As

Publication number Publication date
JPH0228256B2 (enrdf_load_stackoverflow) 1990-06-22

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