JPH0228256B2 - - Google Patents

Info

Publication number
JPH0228256B2
JPH0228256B2 JP59090876A JP9087684A JPH0228256B2 JP H0228256 B2 JPH0228256 B2 JP H0228256B2 JP 59090876 A JP59090876 A JP 59090876A JP 9087684 A JP9087684 A JP 9087684A JP H0228256 B2 JPH0228256 B2 JP H0228256B2
Authority
JP
Japan
Prior art keywords
die
bonding
wire
bonding stage
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59090876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60235431A (ja
Inventor
Kuniaki Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59090876A priority Critical patent/JPS60235431A/ja
Publication of JPS60235431A publication Critical patent/JPS60235431A/ja
Publication of JPH0228256B2 publication Critical patent/JPH0228256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP59090876A 1984-05-09 1984-05-09 半導体組立装置 Granted JPS60235431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Publications (2)

Publication Number Publication Date
JPS60235431A JPS60235431A (ja) 1985-11-22
JPH0228256B2 true JPH0228256B2 (enrdf_load_stackoverflow) 1990-06-22

Family

ID=14010682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59090876A Granted JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Country Status (1)

Country Link
JP (1) JPS60235431A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152964A (en) * 1978-05-24 1979-12-01 Hitachi Ltd Automatic assembling machine for semiconductor device

Also Published As

Publication number Publication date
JPS60235431A (ja) 1985-11-22

Similar Documents

Publication Publication Date Title
US6196445B1 (en) Method for positioning the bond head in a wire bonding machine
US5062565A (en) Method for combining die attach and wirebond in the assembly of a semiconductor package
EP0297244A2 (en) Single lead automatic clamping and bonding system
JP2000012568A (ja) ダイボンダ
JPH03136340A (ja) ワイヤボンデイング方法及び装置
US4683644A (en) Automated assembly system for semiconductor device
JPH09232342A (ja) ダイボンディング装置
JPH0228256B2 (enrdf_load_stackoverflow)
US5350106A (en) Semiconductor wire bonding method
JP3272312B2 (ja) 位置認識手段の移動装置
US5295298A (en) Method of forming leads of semiconductor device to shape
JP2746989B2 (ja) チップの位置決め方法およびその装置、インナリードボンディング装置およびインナリードボンディング方法
JPS62150831A (ja) ワイヤボンダ
JPS6063936A (ja) リ−ドフレ−ムの処理方法
JPH01241138A (ja) 半導体装置のワイヤボンディング方法
JPH0223025B2 (enrdf_load_stackoverflow)
JPS6063937A (ja) 電子部品の組立装置
JPS60262433A (ja) ボンデイング装置
JPH06244245A (ja) 半導体素子接合装置
JPH077043A (ja) インナ−リ−ドボンディング装置
JPS58161333A (ja) 半導体製造装置
JPH088276B2 (ja) ワイヤボンディング方法
JPS6328043A (ja) ワイヤ−ボンデイング装置
JPS62154762A (ja) 半導体製造方法
JPH04330743A (ja) 半導体装置の製造装置及び半導体装置の製造方法