JPS60235074A - Contact piece of ic inspection apparatus - Google Patents

Abstract

PURPOSE:To enhance the durability of an IC inspection apparatus, by chamfering the contact terminal of a contact piece to a terminal and applying hard conductive plating to the outer surface thereof. CONSTITUTION:In an IC inspection apparatus 1, contact pieces 3 comprising a spring material are supported by a pair of left and right support frames 2 so as to be opposed in a downwardly directed state. The leading ends of the contact pieces 3 are removed at the corner parts thereof by inverse-electrolysis and protruded circular arc shaped chamfering is performed to the outsides thereof and hard nickel-type plating is applied to each outer surface. Therefore, the durability of the apparatus can be enhanced without impairing the terminal of IC.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an inspection device for inspecting the characteristics of an IC1, that is, an integrated circuit element. Regarding improvement.

[Conventional technology]

Conventionally, an IC inspection device inserts an IC between a pair of opposing left and right contacts that protrude diagonally downward, and brings the contacts into contact with terminals that protrude in a U-shape from the left and right sides of a rectangular body of the IC. The characteristics are tested by sending test signals. That is, the IC is fed from above between the left and right contacts, inspected in a short time cycle of about 2 seconds while being held between both contacts, and immediately dropped downward. Therefore, it is necessary that the contact and the terminal come into contact with each other with as little contact resistance as possible, while the contact is required to have excellent spring characteristics and wear resistance.

In order to achieve this purpose, it is preferable to plate the contact with nickel-boron, which is hard and has excellent conductivity. and constitutes a hard acute angle (second
(see figure), which causes scratches on the terminals of ICs that have been immersed in immersion plating.

[Purpose of the invention]

The present invention aims to solve the above-mentioned problems, and is directed to an IC testing device that conducts a current conduction test by holding IC terminals protruding in a U-shape from the left and right sides of a substantially rectangular parallelepiped body between left and right contacts. , is characterized in that the contact end of the contact element with respect to the terminal is chamfered into a circular arc shape with a small radius, and the outer surface thereof is coated with hard conductive plating.

〔Example〕

The present invention will be explained below with reference to illustrated embodiments. 1 in the figure is an IC testing device according to the invention. In the IC testing device N1, contacts 3.3 made of a spring material are supported by a pair of left and right support frames 2.2 and are supported diagonally downward and facing each other. 4 is the main body of the inspection device connected to the contactor 3.3 through the electric wire 5, and is a central processing unit that determines whether the IC is acceptable or not.

Reference numeral 6 indicates an IC to be inspected, and a main body 6a having a substantially rectangular parallelepiped shape.
It has a large number of terminals 6b protruding from the left and right side surfaces in a U-shape. Note that hang plating is usually applied to the terminals of the IC.

Figures 2 and 3 show the contactor 3 and the terminal 6b in the inspection state.
Indicates contact status with. That is, the contactor 3 is about 0.2~
It is made of beryllium copper with a thickness of 0.3 mm, and the edge portion is in diagonal contact with the outer surface of the terminal 6b. Here, the tip 6mA of the conventional contactor 3 shown in FIG. 2 is cut at a substantially right angle and is not subjected to any treatment such as chamfering.

The tip A of the contactor 3 according to the present invention shown in FIG. 3 has an outward radius of approximately 0.
A 1fi arc-shaped chamfer is applied. That is, the contactor 3 manufactured in the same manner as in the prior art is press-molded or reverse electrolyzed to remove the corner portion, and a convex arcuate chamfer is formed on the outside. Next, the outer surface is plated with nickel-boron, which is hard and has good conductive properties, to a thickness of about 10 microns, increasing the hardness from Vickers 320 before plating to Vickers 500, and then plating it with an inert gas. The base material is heated to about 500° C. in an atmosphere to age harden it to obtain the desired spring characteristics.

Therefore, as shown in Figure 4, the contact resistance is lower than the conventional average of 2.
The resistance decreased from 4 milliohms (mΩ) to 16 mΩ. Also,
After the start of use, the number of uses until it becomes unusable due to reduced friction, that is, until the end of its life, is from 350,000 to 150 times.
10,000 times, confirming improved durability. This has enabled 24-hour automatic operation.

〔Effect of the invention〕

As described above, the contacts of the IC testing device of the present invention are configured to
The contact end for the terminal is chamfered into a small radius arc, and the outer surface is coated with hard conductive plating, so even though the contact surface is hard plated, the corner angle Since there are no sharp angles on the parts, it does not damage the IC terminals, and reduces wear and tear on the contacts.
The durability of the device can be significantly increased. Also, IC
By increasing the contact area between the contactor and the contactor, a contact area that can stably conduct the desired current is obtained, reducing power loss due to contact resistance and making it possible to perform inspections accurately. have an effect.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention; FIG. 1 is a system diagram showing an inspection device, and FIGS. 2 and 3 show contacts of the inspection device; the former shows a conventional example; The latter represents the invention. FIG. 4 is a graph showing the contact resistance, and FIG. 5 is a process diagram showing the processing steps. 1... IC inspection device, 3... Contact, 6... IC16b as the object to be inspected...
Terminal, patent originator Yamato Kogyo Co., Ltd.

Claims (1)

[Scope of Claims] +1) In an IC testing device that conducts a current conduction test by holding an IC terminal protruding in a U-shape from the left and right side surfaces of a substantially rectangular parallelepiped body between left and right contacts, the contact end of the contact with respect to the terminal is provided. A contact for an IC testing device, which is chamfered into a small radius arc shape and is coated with hard conductive plating on its outer surface. (2) A contact for an IC testing device according to claim 1, wherein the hard conductive plating is nickel-boron based.