JP2002008804A - Electrical property testing device for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric property testing device for a semiconductor device capable of effectively preventing unfavorable appearance due to particles and improper electrical property (shoot, etc.), in the next test process. SOLUTION: A PKG 1 is guided by up and down PKG pressers 3, 4 and is brought into contact with a measuring terminal 5 by a lead presser 9 to conduct a test. This measuring terminal 5 employs a rotary roller (disc-like roller) to prevent contact resistance and rubbing of an external lead 2 and the measuring terminal 5 by its rotation and prevent the destruction of a soldered and plated film applied on a surface of the external lead 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electrical characteristic test (hereinafter, test) apparatus for a semiconductor device (hereinafter, IC).

[0002]

2. Description of the Related Art In general, an IC test method is performed by bringing an external lead (hereinafter referred to as a lead) of an IC into contact with a measuring terminal having excellent conductivity. In particular, in a test method called a socket method, pressure is applied at the time of measurement in order to prevent the occurrence of a defective test due to poor contact.

[0003] That is, a constant pressure is applied to the upper surface of the lead tip by a lead pusher, and electrical contact is made to the lower surface of the lead by a measurement terminal.

FIG. 7 is a block diagram of a main part of such a conventional IC test apparatus.

In FIG. 1, reference numeral 101 denotes a package (P
KG), 102 is an external lead, 103 is a measuring terminal, 10
4 is a view showing a state in which the package (PKG) 101 is pushed downward by the measured pressure, and d indicates a pushing amount by the lead holding.

As described above, the package (PKG) 101 is pushed downward by the measured pressure.
The measurement terminal 103 contacts the lower surface of the tip of the external lead 102.

[0007]

As described above, the measured pressure in the socket system is indispensable for preventing a contact failure.

However, according to such a measuring method, the measuring terminal is rubbed, and the solder plating applied to the surface of the external lead 102 is broken, and solder dust is generated. This is due to the fact that the roughness of the processing surface (shear, break) by press in the manufacturing process of the measurement terminal 103 increases the frictional resistance, in addition to the structure in which the measurement terminal 103 draws an arc and retains the spring property. .

[0009] The fact that the measurement area is small, ie, only the lower surface of the tip of the external lead 102, can be said to be one of the factors that increase the need for measurement pressure.

The present invention eliminates the above-mentioned problems, and provides an electrical characteristic test for a semiconductor device capable of effectively preventing an appearance defect due to solder dust and an electrical characteristic defect (such as a chute) in the next test step. It is intended to provide a device.

[0011]

According to the present invention, in order to achieve the above object, [1] a measuring terminal portion at the time of an electrical characteristic test does not rub the tip of the external lead by pressing the external lead. It is characterized by comprising mechanical means for making contact.

[2] In the apparatus for testing electrical characteristics of a semiconductor device according to the above [1], the mechanical means is a measuring terminal portion which is a rotating roller.

[3] The apparatus for testing electrical characteristics of a semiconductor device according to the above [1], wherein the mechanical means is a measuring terminal portion which comes into contact with a root portion of a package of the external lead.

[4] In the apparatus for testing electrical characteristics of a semiconductor device according to the above [3], the mechanical means has two measurement terminals arranged vertically and sandwiches a root portion of a package of the external lead. It is characterized by doing so.

[5] The apparatus for testing electrical characteristics of a semiconductor device according to the above [1], wherein the mechanical means comprises a measuring terminal having a molten metal bath in which a tip of the external lead is immersed. Features.

[0016]

Embodiments of the present invention will be described below in detail.

FIG. 1 is a sectional view of a main part of a device for testing electrical characteristics of a semiconductor device according to a first embodiment of the present invention, and FIG. 2 is a perspective view of a main part of the device for testing electrical characteristics.

In these figures, 1 is a resin-sealed package (PKG), 2 is an external lead, 3 is an upper package holder, 4 is a lower package holder, 5 is a measurement terminal,
Reference numeral 6 denotes a lower part of the measuring terminal 5 and a spring 7 from the lower part.
, 8 is a holder for the pantograph 6, and 9 is a lead holder.

As shown in these figures, the PKG 1 is guided by upper and lower PKG presses 3 and 4 and is brought into contact with the measuring terminal 5 by a lead press 9 to perform a test. The measurement terminal 5 uses a rotating roller (a disk-shaped roller) to prevent the contact resistance and rubbing between the external lead 2 and the measurement terminal 5 by rotating, and to prevent the solder plating film applied to the surface of the external lead 2 from rotating. Prevent destruction.

With this configuration, it is possible to effectively prevent the appearance defect due to the solder dust and the electric characteristic defect (such as a chute) in the next test step, which are problems in the prior art.

Next, a second embodiment of the present invention will be described.

FIG. 3 is a cross-sectional view of a main part of a device for testing electrical characteristics of a semiconductor device according to a second embodiment of the present invention, and FIG. 4 is a perspective view of a main part of the device for testing electrical characteristics.

In these figures, 11 is a resin-sealed PKG, 12 is an external lead, 13 is an upper package holder, 14 is a lower package holder, 15 is a lower first measuring terminal, and 16 is an upper second terminal. Is a measuring terminal, and 17 is a lead holder.

PKG 11 includes upper and lower PKG pressers 13 and 14.
In order to prevent the external lead 12 of the PKG 11 guided from being deformed,
The first measuring terminal 1 is inserted between the KG holders 13 and 14 and the lead holder 17 so as to sandwich the external lead 12 from above and below.
5 and the second measurement terminal 16 are arranged and a test is performed. That is, the first and second measurement terminals 15 and 16 are connected to the external leads 12.
In contact with the base portion 12A of the PKG 11 having high strength. The base portion 12A of the PKG 11 having high strength of the external lead 12 is connected to the first measuring terminal 15 and the second
Of the external lead 12 caused by the lead holder 17 can be corrected. Here, the distal ends of the first measuring terminal 15 and the second measuring terminal 16 have a folded portion.

The first and second ends of the external lead 12 are
Contact with the measurement terminals 15 and 16 of the
Nos. 5 and 16 do not rub the solder coating on the surface of the external lead 12 and can suppress the generation of solder dust.

Further, the first and second measurement terminals 15 and 16
The frictional resistance can be reduced by polishing the surface of the substrate without polishing the surface to be processed, so that a further effect can be obtained.

In the above embodiment, the first measuring terminal 15 and the second measuring terminal 16 are sandwiched from above and below.
It may be configured with only one of the measurement terminals.

Next, a third embodiment of the present invention will be described.

FIG. 5 is a sectional view of an essential part of an apparatus for testing electrical characteristics of a semiconductor device according to a third embodiment of the present invention, and FIG. 6 is a perspective view of an essential part of the apparatus for testing electrical characteristics of the semiconductor device.

In these figures, 21 is a resin-sealed PKG, 22 is an external lead, 23 is an upper PKG holder,
24 is a lower PKG holder, 25 is a molten solder tank, 26 is a molten solder supply pipe, and 27 is a lead holder.

In this embodiment, a rigid metal is not used as a measuring terminal, but a molten metal (for example, solder) 25 is used instead.
The electrical connection is obtained by immersing the external leads 22 in the molten metal 25. When the measuring terminal 22 is made of a molten metal, there is no contact resistance, the breakage of the solder plating applied to the external lead 22 can be prevented, and no solder dust is generated. Further, at this time, since the molten solder tank 25 is used for the measurement terminal portion, there is also an effect that the scratches and defects of the solder plating received in the lead processing step can be compensated for by the molten solder attached at the time of measurement.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0033]

As described above, according to the present invention, the following effects can be obtained.

(A) The measurement terminal uses a rotating roller (disk-shaped roller) to prevent the contact resistance and rubbing between the external lead and the measurement terminal by rotating, and a solder plating film applied to the surface of the external lead. Can be prevented from being destroyed.

Therefore, it is possible to effectively prevent poor appearance due to solder dust and poor electrical characteristics (such as chute) in the next test step.

(B) Since the tip of the external lead makes contact with the measurement terminal, the measurement terminal does not rub the solder coating on the surface of the external lead, and the generation of solder dust can be suppressed.

(C) The electrical connection is obtained by immersing the external leads in the molten metal. By making the measuring terminal a molten metal, there is no contact resistance, and it is possible to prevent the destruction of the solder plating applied to the external leads,
There is no generation of solder waste.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an apparatus for testing electrical characteristics of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a main part of an apparatus for testing electrical characteristics of a semiconductor device according to a first embodiment of the present invention.

FIG. 3 is a sectional view of a main part of a device for testing electrical characteristics of a semiconductor device according to a second embodiment of the present invention;

FIG. 4 is a perspective view of a main part of an apparatus for testing electrical characteristics of a semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a main part of an apparatus for testing electrical characteristics of a semiconductor device according to a third embodiment of the present invention.

FIG. 6 is a perspective view of a main part of an apparatus for testing electrical characteristics of a semiconductor device according to a third embodiment of the present invention.

FIG. 7 is a perspective view of a main part of a conventional electrical characteristic testing apparatus for a semiconductor device.

[Explanation of symbols]

1,11,21 Package sealed with resin (PK
G) 2,12,22 External lead 3,13,23 Upper package holder 4,14,24 Lower package holder 5 Measurement terminal 6 Pantograph 7 Spring 8 Pantograph holder 9,17,27 Lead holder 12A PKG of external lead Root portion 15 Lower first measuring terminal 16 Upper second measuring terminal 25 Molten solder tank 26 Molten solder supply pipe

Claims (5)

[Claims] 1. An electrical characteristic of a semiconductor device, comprising: mechanical means for causing a measurement terminal portion to contact a tip end of the external lead without being rubbed by pressing of the external lead during an electrical characteristic test. Testing equipment. 2. An apparatus for testing electrical characteristics of a semiconductor device according to claim 1, wherein said mechanical means is a measuring terminal portion which is a rotating roller. 3. The semiconductor device electrical characteristic testing apparatus according to claim 1, wherein said mechanical means is a measuring terminal portion which contacts a root portion of a package of said external lead. Electrical characteristics test equipment. 4. An electrical characteristic testing apparatus for a semiconductor device according to claim 3, wherein said mechanical means is arranged such that two of said measuring terminals are arranged vertically and sandwich a root portion of said external lead package. An apparatus for testing electrical characteristics of a semiconductor device, comprising: 5. An apparatus for testing electrical characteristics of a semiconductor device according to claim 1, wherein said mechanical means includes a measuring terminal having a molten metal bath in which a tip of said external lead is immersed. For testing electrical characteristics of semiconductor devices.