WO2021036137A1

WO2021036137A1 - Contact, contact structure, electronic device and charging device

Info

Publication number: WO2021036137A1
Application number: PCT/CN2019/129053
Authority: WO
Inventors: 杨飞; 宋彪; 王越; 董广立; 刘玉友; 曾森
Original assignee: 问问智能信息科技有限公司
Priority date: 2019-08-23
Filing date: 2019-12-27
Publication date: 2021-03-04

Abstract

Embodiments of the present invention provide a contact, a contact structure, an electronic device and a charging device. The contact comprises a magnetic member and a conducting layer. The conducting layer is provided outside the magnetic member. The magnetic member is provided on a circuit board. The conducting layer is electrically connected to the circuit board. Hence, when the contact of this embodiment is used for charging, the contact on the electronic device and the contact on the charging device are adsorbed and positioned under the absorption of the magnetic member, no abrasion is not generated in the process of connecting or separating the contact on the electronic device to or frame the contact on the charging device, and the adsorption capacity may not be reduced in the process of long-term use, thereby improving the stability and reliability of connection of the contact on the electronic device and the contact on the charging device. Moreover, since the conducting layer is formed outside the magnetic member, the space occupied and difficulty of installation are effectively reduced, which facilitates miniaturization of the electronic device and the charging device.

Description

Contact, contact structure, electronic equipment and charging equipment

This application requires a Chinese patent application filed on August 23, 2019, with an application number of 201910782607.2, and an invention title of "contacts, contact structures, electronic equipment, and charging equipment". The application filed on September 4, 2019 The Chinese patent application with the number of 201910831565.7 and the invention name of "Charging Device and Electronic Equipment", the Chinese patent application with the application number of 201910831583.5 and the invention name of "Contacts and Electronic Equipment" filed on September 4, 2019, in 2019 The Chinese patent application filed on August 27, with the application number 201910795448.X, and the invention titled "A charging contact structure and its preparation method", filed on August 27, 2019, with the application number 201910798942.1, invention title It is the priority of the Chinese patent application of "a contact structure and its preparation method", the entire content of which is incorporated into this application by reference.

Technical field

The present invention relates to electronic power technology, and more specifically, to a contact, a contact structure, an electronic device, and a charging device.

Background technique

With the development of science and technology and the progress of society, electronic devices are becoming more and more common in daily life. When the power of electronic devices is insufficient, they need to be charged by charging devices.

The existing electronic equipment is equipped with a charging interface, and the charging device is equipped with a charging plug. Both the charging interface and the charging head are equipped with clamping parts. The charging plug can be inserted into the charging interface and held in the charging interface by the clamping part , So that the electronic device and the charging device are electrically connected.

However, in the process of plugging and unplugging the charging interface and the charging plug, the clamping part will be worn out. When the clamping part is worn to a large extent, the charging interface and the charging plug cannot achieve a stable connection, which is prone to problems such as loosening and power failure. , The use reliability is low.

Summary of the invention

In view of this, embodiments of the present invention provide a contact, a contact structure, an electronic device, and a charging device to improve the reliability of the charging process.

In a first aspect, an embodiment of the present invention provides a contact, the contact includes a magnetic element and a conductive layer, the conductive layer is on the outer side of the magnetic element, the magnetic element is disposed on a circuit board, and the conductive layer The layer is electrically connected to the circuit board.

Optionally, the magnetic member includes a first base and a contact, the base and the contact are both cylindrical, the contact is connected to the base, and the axis of the base and the contact extend in the same direction, The diameter of the base is larger than the diameter of the contact, and the bottom surface of the base is connected to the circuit board.

Optionally, the base and the contact are both cylindrical.

Optionally, the base and the contact are coaxial.

Optionally, the base and the contact are an integrally formed structure.

Optionally, the conductive layer is a conductive material plating layer, and the conductive layer is formed on the outer surface of the magnetic member.

Optionally, the conductive layer is a conductive anticorrosive plating layer.

Optionally, the conductive layer includes an anti-corrosion metal layer, an acid copper layer or an acid nickel layer, a metal barrier layer, and an artificial sweat-resistant electrolytic metal layer, and the conductive anticorrosion layer, an acid copper layer or an acid nickel layer, and a metal barrier layer And the anti-artificial sweat electrolytic metal layer is sequentially formed on the outer surface of the magnetic member.

Optionally, the corrosion-resistant metal layer is a coke copper plating layer or a neutral nickel plating layer.

Optionally, the thickness of the anti-corrosion metal layer ranges from 8 μm to 10 μm.

Optionally, the thickness of the acid copper layer ranges from 18 μm to 20 μm.

Optionally, the outermost layer of the conductive layer is a plating layer that has been sealed.

Optionally, the conductive layer is a metal shell, a containing cavity is formed in the metal shell, and the magnetic member is arranged in the containing cavity.

Optionally, the metal shell includes a barrel-shaped main body and a second base, the receiving cavity is formed in the barrel-shaped main body, the bottom of the barrel-shaped main body is formed with an opening, and the second base is formed in the barrel-shaped main body. At the edge of the opening.

Optionally, the second base is ring-shaped and coaxial with the barrel-shaped main body, the outer diameter of the second base is larger than the outer diameter of the barrel-shaped main body, and the bottom surface of the second base is connected to the circuit The board is welded and fixed so that the metal shell is electrically connected to the circuit board.

Optionally, the magnetic member is closely attached to the inner wall of the barrel-shaped body.

Optionally, the metal shell is a copper alloy shell.

Optionally, a conductive anticorrosive coating is formed on the outer surface of the metal shell.

Optionally, the conductive anticorrosive coating is a gold coating.

Optionally, a first plating layer is formed on the surface of the magnetic member, and a second plating layer is formed on the surface of the metal casing.

Optionally, the first plating layer is a coke copper layer and a nickel layer in order from the inside to the outside.

Optionally, the thickness of the coke copper layer ranges from 18 μm to 20 μm, and the thickness of the nickel layer ranges from 5 μm to 8 μm.

Optionally, the second plating layer is an acid copper layer or an acid nickel layer, a metal barrier layer, and an artificial sweat-resistant electrolytic metal layer in order from the inside to the outside.

Optionally, the thickness of the acid copper layer ranges from 3 μm to 5 μm.

Optionally, the outermost layer of the first plating layer and the outermost layer of the second plating layer are plating layers that have been sealed.

Optionally, the anti-artificial sweat electrolytic metal layer is a rhodium plating layer, a ruthenium plating layer, or a rhodium ruthenium alloy plating layer.

Optionally, the thickness of the anti-artificial sweat electrolytic metal layer ranges from 0.75 μm to 1 μm.

Optionally, the metal barrier layer is a palladium plating layer, a platinum plating layer, a palladium cobalt alloy plating layer, a palladium platinum alloy plating layer, a palladium silver alloy plating layer, a palladium gold alloy plating layer, or a palladium indium alloy plating layer.

Optionally, the thickness of the metal barrier layer ranges from 0.6 μm to 1 μm.

Optionally, an anti-oxidation metal layer is further provided between the acid copper layer and the metal barrier layer.

Optionally, the anti-oxidation metal layer is a silver plating layer, a tin-silver alloy plating layer, or a copper-tin-zinc alloy plating layer.

Optionally, the thickness of the anti-oxidation metal layer ranges from 2 μm to 4.5 μm.

Optionally, a conductive metal layer is further provided between the metal barrier layer and the anti-artificial sweat electrolysis metal layer.

Optionally, the conductive metal layer is a silver plating layer, a tin-silver alloy plating layer, a copper-tin-zinc alloy plating layer, or a gold plating layer.

Optionally, the thickness of the conductive metal layer ranges from 0.5 μm to 0.75 μm.

Optionally, an easy-to-weld metal layer is formed outside the artificial sweat-resistant electrolytic metal layer.

Optionally, the solderable metal plating layer is a gold plating layer, a tin plating layer, a copper-tin-zinc alloy plating layer, or a tin-silver alloy plating layer.

Optionally, the thickness of the easy-to-weld metal layer ranges from 0.125 μm to 0.25 μm.

Optionally, the magnetic member is a neodymium iron boron magnet or a samarium cobalt magnet.

In a second aspect, an embodiment of the present invention provides a contact structure, and the contact structure includes:

frame;

A contact piece connected to the frame; and

Contacts as described above;

Wherein, the contact is connected to the frame through an elastic member, and the elastic member is used to apply an elastic force to the contact to position the contact relative to the frame, and to make the contact and the contact The element has a set distance in the first direction, and the elastic element stretches along the first direction under the action of an external force so that the contact can contact the contact element and form an electrical connection.

Optionally, a cavity is formed in the frame, the contact member is located in the cavity, and the elastic member closes the gap between the contact and the frame to seal the cavity.

Optionally, a first clamping portion is formed on the contact, the first clamping portion extends along the circumferential direction of the contact, the elastic member is plate-shaped, and a connection is formed on the elastic member Hole and a second clamping portion, the second clamping portion is provided at the edge of the connecting hole and extending along the circumference of the connecting hole, the first clamping portion and the second clamping portion Card connection.

Optionally, the first clamping portion is a tenon, and the second clamping portion is a clamping slot.

Optionally, a third clamping portion is formed on the outer edge of the elastic member, a fourth clamping portion is formed on the frame, and the third clamping portion and the fourth clamping portion are connected in a clamping manner.

Optionally, the third clamping portion is a tenon, and the fourth clamping portion is a clamping slot.

Optionally, a groove is further formed on the elastic member, and the groove extends along the circumferential direction of the connecting member to surround the connecting hole, and there is a setting between the groove and the connecting hole. distance.

Optionally, the elastic piece is a silicone piece.

Optionally, the elastic member is an elastic piece on the circuit board.

In a third aspect, an embodiment of the present invention provides an electronic device, and the electronic device includes:

The main body of the electronic equipment; and

The contact according to the first aspect of the embodiment of the present invention or the contact structure according to the second embodiment of the present invention.

In a fourth aspect, an embodiment of the present invention provides a charging device, and the charging device includes:

The main body of the charging device; and

In an embodiment of the present invention, the contact includes a magnetic element and a conductive layer, the conductive layer is on the outer side of the magnetic element, the magnetic element is disposed on a circuit board, and the conductive layer is electrically connected to the circuit board. connection. Therefore, when using the contact charging of this embodiment, the contact on the electronic device can be adsorbed and positioned with the contact on the charging device under the suction effect of the magnetic member, so as to realize the electrical connection between the electronic device and the charging device. In addition, there will be no wear during the process of connecting or separating the contacts on the electronic device with the contacts on the charging device, and the adsorption force will not decrease during long-term use, which improves the contact and charging on the electronic device. The stability and reliability of the connection of the contacts on the equipment. At the same time, since the conductive layer is formed on the outer side of the magnetic member, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of electronic equipment and charging equipment.

Description of the drawings

Through the following description of the embodiments of the present invention with reference to the accompanying drawings, the above and other objectives, features and advantages of the present invention will be more apparent. In the accompanying drawings:

1 is a schematic cross-sectional view of the contact structure of the first embodiment of the present invention;

2 is a schematic diagram of the contact structure of the first embodiment of the present invention;

3-6 are schematic diagrams of the contact plating layer of the first embodiment of the present invention;

FIG. 7 is a schematic diagram of an electrolysis test of artificial sweat according to an embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of the contact of the second embodiment of the present invention;

9 is a schematic diagram of the metal shell plating layer in the contact of the second embodiment of the present invention;

FIG. 10 is a schematic diagram of the plating layer of the magnetic element in the contact of the second embodiment of the present invention;

11 is a schematic cross-sectional view of the contact structure of the second embodiment of the present invention;

12 is a schematic cross-sectional view of the contact structure of the third embodiment of the present invention;

13 is a schematic diagram of the switching of the contacts of the fourth embodiment of the present invention;

14 is a schematic diagram of the contact structure of the fourth embodiment of the present invention;

15 is a schematic diagram of an electronic device and a charging device in a use state according to a fourth embodiment of the present invention;

16 is a schematic diagram of a partial structure of an electronic device according to a fifth embodiment of the present invention;

Fig. 17 is a partial structural diagram of the contact structure of the fifth embodiment of the present invention.

Specific implementation

The present invention will be described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the present invention, some specific details are described in detail. Those skilled in the art can fully understand the present invention without the description of these details. In order to avoid obscuring the essence of the present invention, the well-known methods, processes, procedures, components and circuits are not described in detail.

In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes, and the drawings are not necessarily drawn to scale.

Unless clearly required by the context, similar words such as "including" and "including" in the specification should be interpreted as inclusive rather than exclusive or exhaustive meanings; that is to say, "including but not limited to".

In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

Unless otherwise clearly stipulated and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless specifically defined otherwise. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present utility model can be understood according to specific circumstances.

In addition, it should be noted that, unless otherwise specified, any range described in the present invention includes an end value and any value between the end values, and any sub-range formed by the end value or any value between the end values.

In the description of this specification, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples and the features of the different embodiments or examples described in this specification without contradicting each other.

In order to solve the problem of low reliability of existing charging methods, embodiments of the present invention provide a contact and a contact structure, which include a magnetic element and a conductive layer. Wherein, the conductive layer is on the outer layer of the magnetic member, the magnetic member is arranged on the circuit board of the charging device or the electronic device, and the conductive layer is electrically connected to the circuit board.

Optionally, the conductive layer may be a plating layer formed on the surface of the magnetic member, or may be a metal shell covering the magnetic member. In this implementation manner, since the neodymium iron boron magnet or the samarium cobalt magnet has a relatively large magnetic flux, the magnet has a relatively large attractive force after magnetization. Therefore, the magnetic part of this embodiment may be a neodymium iron boron magnet or a samarium cobalt magnet, but This embodiment does not limit this.

When using contact charging, the magnetic part can be set on the circuit board of the electronic device and the charging device. Since the conductive layer is electrically connected to the circuit board of the electronic device and the charging device, when the electronic device needs to be charged, the The contacts are in contact with the contacts on the charging equipment, and the magnetic parts can make the contacts on the electronic equipment and the contacts on the charging equipment adsorb and position. Therefore, when the contacts on the electronic equipment and the charging equipment When the contacts are in contact, the electronic device and the charging device can be electrically connected, so that the charging device can charge the electronic device. Since the contacts on the electronic device and the contacts on the charging device are relatively positioned by adsorption, there will be no wear and tear during the process of connecting or separating the contacts on the electronic device and the contacts on the charging device. The adsorption force will not decrease during long-term use, which improves the stability of the connection between the contacts on the electronic equipment and the contacts on the charging equipment, avoids the problems of loosening and power failure, and improves the reliability of the use of the contacts. At the same time, since the conductive layer is formed on the outer side of the magnetic member, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of electronic equipment and charging equipment.

The following uses specific embodiments to describe the contacts, the contact structure, and the electronic equipment and charging equipment using the contacts of the embodiments of the present invention. It should be understood that the following are only some of the embodiments, and others that meet the above-mentioned structure and can realize the above-mentioned functions The contacts and the contact structure are both within the protection scope of the embodiments of the present invention.

Example one

FIG. 1 is a schematic cross-sectional view of the contact structure of the first embodiment of the present invention. Fig. 2 is a schematic diagram of the contact structure of the second embodiment of the present invention. As shown in FIG. 1, the contact structure 1 is the contact 11 and the circuit board 12. The contact 11 includes a magnetic member 111 and a conductive layer 112. Wherein, the conductive layer 112 is on the outer layer of the magnetic member 111, the magnetic member 111 is disposed on the circuit board 12 of the charging device or the electronic device, and the conductive layer 112 is electrically connected to the circuit board 12.

In this embodiment, the magnetic member 111 is a cylinder. It should be understood that the shape of the magnetic member is not specifically limited in this embodiment, and other shapes such as cubes can be applied in this embodiment.

In an optional implementation manner, the conductive layer 112 is a conductive material plating layer, which is formed on the outer surface of the magnetic member 111. Optionally, the conductive layer 112 is a conductive anticorrosive coating. Preferably, the conductive layer 112 is a gold coating to improve the conductivity and corrosion resistance of the conductive layer. It should be understood that the conductive layer 112 may also be a nickel plating layer, a copper plating layer, or a nickel copper alloy plating layer, etc., which is not limited in this embodiment.

In this embodiment, the electrical connection between the charging device and the electronic device is achieved through the circuit board 12 of the contact 1, and the contact 1 on the electronic device and the contact 1 on the charging device are relatively positioned by the adsorption of the magnetic member. The contact 1 on the device and the contact 1 on the charging device will not be worn during the process of connecting or separating, and the adsorption force will not decrease during long-term use, which improves the contact 1 on the electronic device and the charging device The stability of the connection of the contact 1 on the upper side avoids the problems of loosening and power failure, and improves the reliability of the use of the contact 1. At the same time, since the conductive layer 12 is formed on the outer surface of the magnetic member 11, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of electronic equipment and charging equipment.

3-6 are schematic diagrams of the contact plating layer of the third embodiment of the present invention.

In another alternative implementation manner, as shown in FIG. 3, the contact 11 includes a magnetic member 31 and a conductive layer 32. In this embodiment, preferably, the conductive layer 32 includes an anti-corrosion metal layer 321, an acid copper layer or an acid nickel layer 322, a metal barrier layer 323, and an anti-artificial sweat electrolysis metal layer 324. Wherein, an anti-corrosion metal layer 321, an acid copper layer or an acid nickel layer 322, a metal barrier layer 323, and an anti-artificial sweat electrolytic metal layer 324 are sequentially formed on the outer surface of the magnetic member. In this embodiment, optionally, the magnetic member 31 may be cylindrical as shown in FIG. 1, or may have a shape as shown in FIG. 2, or other shapes, which is not limited in this embodiment.

In this embodiment, the corrosion-resistant metal layer 321 is plated on the surface of the magnetic member 31 to avoid corrosion of the magnetic member 31 by the acid copper layer or the acid nickel layer 322. Electroplating the acid copper layer or the acid nickel layer 322 on the corrosion-resistant metal layer 321, on the one hand, is to fill the small pores on the surface of the magnetic part 31 to make the surface smooth and flat, reduce the surface roughness of the magnetic part 31, and improve other metals. The adhesion of the coating; on the other hand, the gloss of the overall coating can be controlled, and the surface gloss of the contact 3 meets the required requirements. The metal barrier layer 323 is electroplated on the acid copper layer or the acid nickel layer 322. On the one hand, it is to effectively prevent the copper in the acid copper layer 322 and the corrosion-resistant metal layer 321 covering the surface of the magnetic member 31 from being released and diffusing into other plating layers. Affect the performance of other coatings; on the other hand, it is to improve the salt spray and artificial sweat resistance of the overall coating static test. The anti-artificial sweat electrolysis metal layer 324 is electroplated on the metal barrier layer 323, which is to enhance the performance of the salt spray resistance test, the artificial sweat resistance static test and the artificial sweat electrolysis test during charging of the overall coating of the magnetic member 31. In this implementation manner, the electroplating process can be implemented using a conventional electroplating process.

In an optional implementation manner, the thickness of the acid copper layer 322 ranges from 10 μm to 100 μm, 100 μm (for example, 10 μm, 18 μm, 18.5 μm, 19 μm, 19.5 μm, 20 μm, or 100 μm, etc.); in a further embodiment The thickness of the acid copper layer 322 is 18 μm-20 μm (for example, 18 μm, 18.5 μm, 19 μm, 19.5 μm, or 20 μm, etc.).

In an optional implementation manner, the anti-artificial sweat electrolytic metal layer 324 is a rhodium (Rh) plating layer, a ruthenium (Ru) plating layer, or a rhodium ruthenium (RhRu) alloy plating layer. Preferably, in order to make the coating on the outside of the magnetic member 31 have good resistance to artificial sweat electrolysis test performance, the anti-artificial sweat electrolysis metal layer 324 is a RhRu alloy coating. In an optional implementation, the thickness of the anti-artificial sweat electrolytic metal layer 324 ranges from 0.75 μm to 100 μm (for example, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, 1 μm, 10 μm, or 100 μm, etc.); in a further step In the implementation manner, the thickness of the anti-artificial sweat electrolytic metal layer 324 ranges from 0.75 μm to 1 μm (for example, 0.75 μm, 0.8 μm, 0.85 μm, 0. μm9, or 1 μm, etc.).

In an optional implementation manner, the corrosion-resistant metal layer 321 is a coke copper plating layer or a neutral nickel layer. In a further implementation manner, the corrosion-resistant metal layer 321 is a coke copper plating layer. Since the magnetic parts 31 are easily corroded when they are in contact with strong alkaline substances, and the coke copper electroplating solution is neutral, electroplating the coke copper coating on the surface of the magnetic parts 31 can effectively block the acid copper electroplating solution and the magnetic parts 31 on the one hand. In order to ensure that the magnetic part 31 is not corroded, on the other hand, since the scorched copper coating has good adhesion with the magnetic part 31, the electroplated scorched copper coating can improve the adhesion of subsequent other metal coatings.

In a further implementation manner, the thickness of the corrosion-resistant metal layer 321 ranges from 8 μm to 100 μm (for example, 8 μm, 8.5 μm, 9 μm, 9.5 μm, 10 μm, 50 μm, or 100 μm, etc.); in a further implementation manner, the corrosion-resistant metal layer The thickness of the layer 321 ranges from 8 μm to 10 μm (for example, 8 μm, 8.5 μm, 9 μm, 9.5 or 10 μm, etc.).

In a further implementation, in order to effectively prevent the copper layer on the surface of the magnetic member 31 from being released and diffused into other metal coatings, thereby affecting the performance of other metal coatings; the metal barrier layer 323 may be a palladium (Pd) layer or platinum (Pt). Plating layer, palladium cobalt (PdCo) alloy plating layer, palladium platinum (PdPt) alloy plating layer, palladium silver (PdAg) alloy plating layer, palladium gold (PdAu) alloy plating layer, or palladium indium (PdIn) alloy plating layer. In a further implementation manner, in order to improve the heat resistance of the coating on the surface of the magnetic member 31 and to prevent the coating on the surface of the magnetic member 31 from bursting, the metal barrier layer may be a Pd coating.

In a further implementation, the thickness of the metal barrier layer 323 ranges from 0.4 μm to 100 μm (for example, 0.4 μm, 0.6 μm, 0.63 μm, 0.65 μm, 0.7 μm, 0.8 μm, 1 μm, 10 μm, 50 μm, or 100 μm, etc.); In a further implementation, the thickness of the metal barrier layer 323 ranges from 0.6 μm to 0.75 μm (for example, 0.6 μm, 0.63 μm, 0.65 μm, 0.7 μm, or 0.75 μm, etc.).

In a further implementation, the outermost layer of the conductive layer 32 is sealed. Among them, the sealing treatment refers to the use of a sealing agent to seal the micropores on the surface of the outermost plating layer. The sealing treatment of the plating layer can not only protect the outermost plating layer from oxidation, improve the welding effect of the plating layer during SMT (Surface Mount Technology), but also prevent air from oxidizing the magnetic parts 31 through the microholes, thereby preventing SMT At this time, the plating layer on the surface of the magnetic member 31 bursts. It should be understood that, in this implementation, the outermost layer of the conductive layer 32 refers to a metal layer that is resistant to artificial sweat electrolysis.

The coating of traditional magnetic parts is prone to burst due to high temperature, so that the traditional magnet base material cannot be SMT. In addition, the traditional electroplated magnetic parts SMT are subjected to a charging artificial sweat electrolysis test, and all the coatings will be electrolyzed within 1 minute, which will cause the charging contact structure to fail to be charged. This implementation method not only improves the flatness and smoothness of the surface of the magnetic part, but also realizes magnetism by covering the surface of the magnetic part with an anti-corrosion metal layer, an acid copper layer or an acid nickel layer, a metal barrier layer, and an anti-artificial sweat electrolytic metal layer. After SMT, the parts have the performance of salt spray resistance test, artificial sweat resistance static test, and artificial sweat resistance electrolysis test, so that the contacts cannot be subjected to SMT or cannot be charged after SMT.

In an optional implementation manner, as shown in FIG. 4, in order to protect the copper in the acid copper layer 322 and/or the scorched copper plating layer (when the corrosion-resistant metal layer 321 is the scorched copper plating layer), the copper in the entire plating process is not After being oxidized, the conductive layer 32 further includes an anti-oxidation metal layer 325, wherein the anti-oxidation metal layer 325 is formed between the acid copper layer 322 and the metal barrier layer 323.

In an optional implementation manner, the oxidation-resistant metal coating 325 may be a silver (Ag) coating, a tin-silver (SnAg) alloy coating, or a copper-tin-zinc (CuSnZn) alloy coating. In a further implementation manner, the anti-oxidation metal layer 325 is a CuSnZn plating layer to improve the anti-oxidation effect of the anti-oxidation metal layer 325.

In a further implementation, the thickness of the anti-oxidation metal layer 325 ranges from 1 μm to 100 μm (for example, 1 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 10 μm, 50 μm, or 100 μm, etc.); In an implementation manner, the thickness of the oxidation-resistant metal layer 325 ranges from 2 μm to 4.5 μm (for example, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, etc.).

In an optional implementation manner, as shown in FIG. 5, in order to improve the conductivity of the overall plating layer, the conductive layer 32 further includes a conductive metal layer 326. Wherein, the conductive metal layer 326 is formed between the metal barrier layer 323 and the anti-artificial sweat electrolysis metal layer 324.

In an optional implementation manner, the conductive metal layer 326 may be a silver (Ag) plating layer, a tin-silver (SnAg) alloy plating layer, a copper tin zinc (CuSnZn) alloy plating layer, or a gold (Au) plating layer. In a further implementation, the conductive metal layer 326 is an Au plating layer. Among them, the Au coating has the characteristics of low impedance and good conductivity, and the Au coating can improve the salt spray test and artificial sweat static test performance of the overall coating.

In a further implementation, the thickness of the conductive metal layer 326 ranges from 0.3 μm to 100 μm (for example, 0.3 μm, 0.5 μm, 0.55 μm, 0.6 μm, 0.65 μm, 0.7 μm, 0.75 μm, 10 μm, or 100 μm, etc.). In a further implementation manner, the thickness of the conductive metal layer 326 ranges from 0.5 μm to 0.75 μm (for example, 0.5 μm, 0.55 μm, μm 0.6, 0.65 μm, 0.7 μm, or 0.75 μm, etc.).

In an optional implementation manner, as shown in FIG. 6, in order to improve the welding performance between the outer plating layer of the magnetic component 31 and the solder during SMT, the conductive layer 32 further includes an easy-to-weld metal layer 327. Among them, the easy-to-weld metal layer 327 is formed on the outer side of the artificial sweat resistant metal layer 324.

In an optional implementation manner, the solderable metal plating layer 327 may be a gold (Au) plating layer, a tin (Sn) plating layer, a copper tin zinc (CuSnZn) alloy plating layer, or a tin silver (SnAg) alloy plating layer. In a further implementation manner, the easily weldable metal layer 327 is an Au plating layer to improve the conductivity, weldability, salt spray test resistance and artificial sweat static test performance of the plating layer. Since the solder can easily infiltrate the Au plating layer during SMT, the use of the Au plating layer for the easily solderable metal layer 327 can improve the soldering performance of the overall plating layer, so as to quickly achieve soldering.

In a further implementation manner, the thickness of the easily solderable metal plating layer 327 ranges from 0.125 μm to 100 μm (for example, 0.125 μm, 0.15 μm, 0.18 μm, 0.20 μm, 0.25 μm, 10 μm, or 100 μm, etc.); in a further embodiment The thickness of the easily solderable metal plating layer 327 ranges from 0.125 μm to 0.25 μm (for example, 0.125 μm, 0.15 μm, 0.18 μm, 0.20 μm, 10 μm, 0.25 μm, etc.).

At the same time, this embodiment also provides a method for preparing the contact 11 of the first embodiment, which includes: selecting a magnetic member 31 of a specific specification; electroplating on the surface of the magnetic member 31 to form a conductive layer 32; and performing a method on the surface of the conductive layer 32. The sealing process is performed to obtain a plated magnetic piece 31; the plated magnetic piece 31 is subjected to a magnetization treatment to obtain a contact 11.

In a further implementation, the manufacturing method of the contact 11 further includes: SMT the plated magnetic part 31 into the circuit board, and then perform magnetization treatment on the plated magnetic part 31 to obtain a contact structure.

In this implementation method, the plated magnetic component 31SMT is applied to the circuit board and then magnetized; this not only solves the problem of attracting other components in the traditional SMT with magnetic magnet, but also solves the high temperature demagnetization of the magnetic magnet in SMT It is convenient to contact the SMT to the circuit board to form a contact structure.

Embodiment 1-1

In an alternative implementation manner, the contact structure 1 shown in FIG. 2 is described by taking the magnetic member as a cylindrical shape as an example. As shown in the contact 11 in FIG. 6, the contact structure includes: a magnetic member 31 (E.g. neodymium iron boron magnet), the surface of the magnetic part 31 is covered with a plating layer 32; the plating layer 32 consists of coke copper plating, acid copper layer, CuSnZn plating, Pd plating, first Au plating, RhRu alloy plating, and second plating from the inside to the outside. Au plating. The thickness of the scorched copper coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of the CuSnZn coating is 2μm-4.5μm, and the thickness of the Pd coating is 0.6μm-0.75μm. The thickness range is 0.5 μm-0.75 μm, the thickness range of the RhRu alloy plating layer is 0.75 μm-1 μm, and the thickness range of the second Au plating layer is 0.125 μm-0.25 μm. The second Au plating layer is the plating layer after the sealing treatment.

A method for preparing a contact structure includes the following steps:

Step 1: Preparation of the plated magnetic part 31. In this embodiment, the magnetic part 31 is a neodymium iron boron magnet:

1) Paste the neodymium iron boron embryo onto the cutting board with glue, and then cut it with a cutting machine to obtain a square strip of neodymium iron boron. Optionally, the glue may be 502 glue or other glues that can realize pasting.

2) Add the rectangular NdFeB and water that are stuck on the cutting board into the cooking bucket. The water is heated to boiling and then cook; when the glue on the rectangular NdFeB is boiled, the rectangular The NdFeB is taken out and dried with a dryer; the quality of the bar-shaped NdFeB is tested.

3) The rectangular NdFeB that has passed the test is rounded by a spheroning machine to obtain a cylindrical NdFeB; the quality of the specifications of the cylindrical NdFeB is tested.

4) Align one end of the multiple cylindrical NdFeB that passed the test, and then glue the aligned end to the cutting board. Use glue between the multiple cylindrical NdFeB to fix the cylindrical NdFeB The length direction of the quasi-cylindrical neodymium iron boron is cut by a cutting machine to obtain a quasi-cylindrical neodymium iron boron; the quality inspection is performed on the cylindrical neodymium iron boron; among them, the quasi-cylindrical neodymium iron boron refers to a cylindrical neodymium iron boron with a specific length. Optionally, the glue may be 502 glue or other glues that can realize pasting.

5) Add the quasi-cylindrical neodymium iron boron and water that have passed the test into the cooking barrel, and the water is heated to boiling for cooking; when the glue on the quasi-cylindrical neodymium iron boron is boiled, the quasi-cylindrical neodymium iron The boron is taken out and dried in a dryer. Perform quality inspection on the dried quasi-cylindrical NdFeB.

6) Use ∮5mm abrasive grain lead angle for the quasi-cylindrical neodymium iron boron that passed the test; pickling the quasi-cylindrical neodymium iron boron after the lead angle, and then ultrasonic cleaning; obtain the neodymium iron boron of specific specifications; The specifications of NdFeB are NdFeB with clean surface and specific dimensions. Optionally, the aqueous solution for pickling is nitric acid, the volume concentration is 5%, and the pickling time can be 30S.

7) Electroplating on specific specifications of neodymium iron boron, successively plating scorched copper coating, acid copper coating, CuSnZn coating, Pd coating, first Au coating, RhRu alloy coating and second Au coating; then on the second Au coating Use the sealing agent to carry out the sealing treatment, and obtain the neodymium iron boron with plating layer.

8) Detect the thickness, appearance and size of the coating, and then vacuum package the neodymium iron boron with the coating that passed the test. Among them, the coating appearance inspection standard is: the coating surface must not have chipping, scorching, cracking, peeling, wrinkling, knife marks and other undesirable phenomena, the coating must be uniform, and the surface must be smooth and smooth. The overall size of the coated NdFeB should be controlled within the tolerance range of +/-0.05mm.

Step 2: Carrying out tape-carrying packaging on the plated magnetic parts, and then performing magnetizing treatment to obtain a contact structure.

The carrier tape packaging in this embodiment means that the electroplated products are placed in the holes of the carrier tape according to the placement requirements, and the product is covered with a transparent top film. The edge of the top film is glued to the carrier tape, and the carrier tape is attached at the same time. Roll onto the carrier tape, and after the packaging is completed, use the film to roll several times to fix the carrier tape on the carrier tape to prevent the carrier tape from loosening and falling off.

The implementation method of the electroplating process in this embodiment: Put the quasi-cylindrical neodymium iron boron and the plating steel balls into the electroplating bath together, and conduct electroplating with current. Co-plating steel balls is mainly to prevent the phenomenon of lamination of small-sized quasi-cylindrical NdFeB, and the problem of uneven plating when the current is small. Each coating has a corresponding electroplating bath. After each coating is plated, the thickness of the coating needs to be measured. After the thickness of the coating reaches the required requirements, it is placed in the next electroplating bath, and electroplating is carried out in sequence.

In this embodiment, the surface of the magnetic part is provided with a corrosion-resistant metal layer, an acid copper layer or an acid nickel layer, a metal barrier layer, and an anti-artificial sweat electrolytic metal layer, etc., so that the surface of the contact has good flatness and smoothness, It can also protect the contacts through salt spray test, artificial sweat static test and charging artificial sweat electrolysis test.

Embodiment 1-2

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mount, the surface of the magnetic part is covered with a plating layer, and the plating layer from the inside to the outside is a scorched copper plating layer and an acid copper layer. Layer, CuSnZn coating, Pd coating, first Au coating, RhRu alloy coating, and second Au coating. Wherein, the second Au plating layer is the plating layer after the sealing treatment (the magnetic part plating layer as shown in FIG. 6).

The preparation method of the contact structure of this embodiment is similar to that of Embodiment 1-1, except that step 2 is different.

In this embodiment, step 2: Put the plated neodymium iron boron SMT on the circuit board, and then magnetize the plated neodymium iron boron to obtain the contact structure.

Embodiment 1-3

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mounting, and the surface of the magnetic part is covered with a plating layer. The plating layer from the inside to the outside is a pyro-copper plating layer and an acid copper layer. , Pd coating, and RhRu alloy coating (magnetic part coating as shown in Figure 3). The thickness of the scorched copper coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of the Pd coating is 0.6μm-0.75μm, the thickness of the RhRu alloy coating is 0.75μm-1μm, and the thickness of the RhRu alloy coating is Plating after sealing.

The preparation method of the contact structure of this embodiment is similar to that of Embodiment 1-1, except that the difference is step 1 in step 7) and step 2.

In this embodiment, step 1:7) electroplating on a specific specification of neodymium iron boron, followed by scorched copper plating layer, acid copper layer, Pd plating layer, and RhRu alloy plating layer; then use a sealing agent on the RhRu alloy plating layer The sealing process is carried out to obtain the neodymium iron boron with plating layer.

Step 2: Put the plated NdFeB SMT into the circuit board, and then perform magnetization treatment on the plated NdFeB to obtain the contact structure.

Embodiment 1-4

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mounting, and the surface of the magnetic part is covered with a plating layer; the plating layer is a neutral nickel layer and an acid copper layer from the inside to the outside. Layer, Pd coating, RhRu alloy coating (magnetic part coating as shown in Figure 3). The thickness range of the neutral nickel coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of the Pd coating is 0.6μm-0.75μm, the thickness of the RhRu alloy coating is 0.75μm-1μm, and the thickness of the RhRu alloy coating is It is the plating layer after sealing. The RhRu alloy coating is a coating that undergoes sealing treatment.

In this embodiment, step 1:7) electroplating on a specific specification of neodymium iron boron, followed by a neutral nickel layer, an acid copper layer, a Pd plating layer, and a RhRu alloy plating layer; and then sealing holes on the RhRu alloy plating layer The sealing agent is processed to obtain the neodymium iron boron with plating layer.

Embodiment 1-5

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mounting, and the surface of the magnetic part is covered with a plating layer; the plating layer from the inside to the outside is a pyro-copper plating layer and an acid copper layer. , CuSnZn coating, Pd coating, RhRu alloy coating (magnetic part coating as shown in Figure 4). The thickness of the scorched copper coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of CuSnZn coating is 2μm-4.5μm, the thickness of Pd coating is 0.6μm-0.75μm, and the thickness of RhRu alloy coating The range is 0.75μm-1μm, and the RhRu alloy coating is the coating after sealing.

In this embodiment, step 1:7) electroplating on a specific specification of neodymium iron boron, followed by scorched copper coating, acid copper layer, CuSnZn coating, Pd coating, and RhRu alloy coating; then use on the RhRu alloy coating The sealing agent is used for sealing treatment to obtain neodymium iron boron with plating layer.

Embodiment 1-6

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mount, and the surface of the magnetic part is covered with a plating layer; the plating layer is scorched copper plating layer (that is, anti-corrosion) from the inside to the outside. Corrosion metal layer), acid copper layer, Pd plating layer (ie metal barrier layer), first Au plating layer (ie conductive metal layer), RhRu alloy plating layer (ie anti-artificial sweat electrolytic metal layer). The thickness of the scorched copper coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of the Pd coating is 0.6μm-0.75μm, the thickness of the first Au coating is 0.5μm-0.75μm, RhRu alloy The thickness of the plating layer ranges from 0.75 μm to 1 μm, and the RhRu alloy plating layer is the plating layer after the sealing treatment.

In this embodiment, step 1:7) electroplating is performed on the neodymium iron boron of specific specifications, and then the scorched copper plating layer, the acid copper layer, the Pd plating layer, the first Au plating layer, and the RhRu alloy plating layer are sequentially plated; and then the RhRu alloy plating layer The hole sealing agent is used for sealing treatment to obtain the neodymium iron boron with plating layer.

Embodiment 1-7

In the contact structure 1 shown in FIG. 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mounting, and the surface of the magnetic part is covered with a plating layer. In this embodiment, a samarium cobalt magnet is used as the magnetic member. The coating on the surface of the samarium cobalt magnet is from the inside to the outside in order of coke copper coating (also known as anti-corrosion metal layer), acid copper layer, Pd coating (also known as metal barrier layer), RhRu alloy coating (also known as anti-artificial sweat electrolytic metal layer) ), the second Au plating layer (that is, the easy-to-weld metal layer). The thickness of the scorched copper coating is 8μm-10μm, the thickness of the acid copper layer is 18μm-20μm, the thickness of the Pd coating is 0.6μm-0.75μm, the thickness of the RhRu alloy coating is 0.75μm-1μm, the second Au coating The thickness range is 0.125μm-0.25μm, and the second Au plating layer is the plating layer after sealing.

In this implementation, step 1:7) electroplating on the samarium cobalt of specific specifications, and then plating the scorched copper plating layer, acid copper layer, Pd plating layer, RhRu alloy plating layer, and the second Au plating layer; and then sealing on the Au plating layer. The porogen is subjected to sealing treatment to obtain samarium cobalt with a plating layer.

Step 2: Put the plated samarium cobalt SMT into the circuit board, and then magnetize the plated samarium cobalt to obtain a contact structure.

Embodiment 1-8

The contact structure 1 shown in Figure 2, the magnetic part in the contact 11 is connected to the circuit board 12 by surface mounting, and the surface of the magnetic part is covered with a plating layer; the plating layer from the inside to the outside is a pyro-copper plating layer and an acid copper layer. , CuSnZn coating, Pd coating, first Au coating, RhRu alloy coating, and second Au coating (magnetic part coating as shown in Figure 6). The thickness of the scorched copper coating is 8μm-100μm, the thickness of the acid copper layer is 10μm-100μm, the thickness of the CuSnZn coating is 1μm-100μm, the thickness of the Pd coating is 0.4μm-100μm, and the thickness of the first Au coating is 0.3μm-100μm. The thickness of the RhRu alloy plating layer is 0.75 μm-100 μm, the thickness of the second Au plating layer is 0.125 μm-100 μm, and the second Au plating layer is the plating layer after the sealing treatment.

In this embodiment, step 1:7) electroplating is performed on the neodymium iron boron of specific specifications, and then the scorched copper plating layer, acid copper layer, CuSnZn plating layer, Pd plating layer, first Au plating layer, RhRu alloy plating layer, and the second Au plating layer; then on the second Au plating layer, a hole sealing agent is used for hole sealing treatment to obtain a neodymium iron boron plating layer.

Fig. 7 is a schematic diagram of an artificial sweat electrolysis test according to an embodiment of the present invention. In an optional implementation manner, the electronic device is an earphone and the charging device is a charging box as an example. It should be understood that this embodiment does not limit this.

1. Artificial sweat electrolysis test:

1) The pad end of the contact structure 71 suitable for earphones and the pin end of the contact structure 72 suitable for the charging box are respectively welded with wires; among them, the contact structure with SMT solder cannot cover the test contact surface, keep it Test the cleanliness of the contact surface.

2) Magnetize the magnetic parts of the two contact structures separately, so that the pad end of the contact structure 71 and the pin end of the contact structure 72 are attracted together (that is, the contact state of the pad end and the pin end during normal charging is consistent) , Get a set of charging contact structure 7.

3) Put the two sets of charging contact structures 7 after the above treatment in the same container filled with artificial sweat (PH4.7), and the charging contact structures 7 can be completely immersed in the artificial sweat; they are used as electrolytic cells respectively. The positive electrode and the negative electrode, the distance between the positive and negative electrodes is 1-3cm, a 55Ω resistor is connected in series between the two sets of charging contact structures 7 and connected to the power supply to form a loop.

4) Adjust the current to 90mA (DC voltage is about 5V) and stabilize the current, turn on the circuit, keep it energized, disconnect the circuit every minute after energizing, take out the pad near the positive terminal from the artificial sweat, and wipe it After cleaning, observe the damage of the coating under a microscope. If the coating is silver, continue the test; if the coating appears black and expose the underlying magnet, stop the test. As shown in Figure 7.

The standard for passing the artificial sweat electrolysis test: the damage time of the coating is required to be ≥2min.

2. Salt spray test:

Place the charging contact structure in a salt spray machine test box, and spray NaCl solution with a salt spray concentration of 5% for 48 hours at a temperature of 35±2°C and a humidity of >85%, with a PH value of 6.5-7.2, and a spray pressure of 1 ±0.3kg/cm2; after the test, place it at room temperature for 2 hours, and then check the appearance and function;

The standard for passing the salt spray test is: the appearance and function are the same as before the salt spray test, and there is no change. Generally, the appearance should not have rust, corrosion and discoloration.

3. Artificial sweat static test:

Soak the charging contact structure in sweat (acidic ph4.7), wrap the sample with a dust-free cloth after soaking, and place it at 60°C and 90% temperature and humidity for 48 hours. After the test, place it at room temperature for 2 hours, and then check Appearance and function;

Standard: The appearance and function are the same as before the artificial sweat static test, without change. Generally, the appearance should not have rust, corrosion and discoloration.

It has been verified that the charging contact structure of this embodiment has passed the above-mentioned artificial sweat electrolysis test, salt spray test and artificial sweat static test. Moreover, the charging contact structures of the fourth and fifth embodiments have the best performance in the artificial sweat electrolysis test, the salt spray test and the artificial sweat static test.

The embodiment of the present invention not only improves the flatness and smoothness of the surface of the magnetic part by electroplating a special functional coating on the magnetic part, but also realizes the SMT of the magnetic part, and solves the problem that the magnet cannot be SMT in the existing charging contact structure. In this embodiment, the charging contact structure has the performance of salt spray resistance test, artificial sweat resistance static test, and artificial sweat electrolysis test performance, which solves the problem of charging artificial sweat electrolysis test after the traditional magnet electroplating process SMT. All coatings will be tested within 1 minute. Electrolysis causes the problem of not being able to charge.

Example two

Fig. 8 is a schematic cross-sectional view of the contact of the second embodiment of the present invention. Fig. 9 is a schematic diagram of the metal shell plating layer in the contact of the second embodiment of the present invention. FIG. 10 is a schematic diagram of the plating layer of the magnetic element in the contact of the second embodiment of the present invention. 11 is a schematic cross-sectional view of the contact structure of the second embodiment of the present invention.

As shown in FIG. 8, the contact 8 includes a magnetic member 81 and a conductive layer 82. Among them, the conductive layer 82 is on the outer layer of the magnetic member 81. The conductive layer 82 is a metal shell, and a containing cavity is formed in the metal shell, and the magnetic member 81 is arranged in the containing cavity. In an optional implementation manner, the magnetic member 81 and the metal casing 82 may be cylindrical, and optionally, the magnetic member 81 and the metal casing 82 are coaxial. It should be understood that this embodiment does not specifically limit the shape of the magnetic member, and other shapes such as cubes can be applied in this embodiment.

In an optional implementation manner, in this embodiment, the charging device and the electronic device are electrically connected through the contact 8, and the contact 8 on the electronic device and the contact 8 on the charging device are adsorbed by the magnetic member 81 Relative positioning, therefore, the contact 8 on the electronic device and the contact 8 on the charging device will not be worn during the connection or separation process, and the adsorption force will not be reduced during long-term use, which improves the electronic equipment The stability of the connection between the contact 8 and the contact 8 on the charging device avoids the problems of loosening and power failure, and improves the reliability of the use of the contact 8. At the same time, since the metal shell 82 is formed on the outer surface of the magnetic member 81, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of electronic equipment and charging equipment.

In an alternative implementation, the surface of the magnetic element 81 is provided with a first plating layer; the surface of the metal shell 82 is provided with a second plating layer, and the metal shell 82 is sleeved outside the magnetic element 81 to connect the magnetic element 81 with the outside. The power source conducts and conducts the magnetism of the magnetic member 81. In an optional implementation manner, the second plating layer may be an acid copper layer, a metal barrier layer, and an artificial sweat-resistant electrolytic metal layer in order from the inside to the outside.

The implementation of the present invention is to electroplate an acid copper layer on the surface of the metal shell 82. On the one hand, it is to make use of the good ductility of the acid copper layer to make the surface of the metal shell smooth and flat, reduce the surface roughness of the metal shell, and improve the performance of other metal coatings. Adhesion; on the other hand, it can control the matt degree of the second plating layer, so that the matt degree of the surface of the contact structure meets the required requirements. The metal barrier layer has high density. Electroplating the metal barrier layer on the acid copper layer is to effectively prevent the Cu layer on the surface of the metal shell from being released and diffused into other metal coatings, which will affect the performance of other metal coatings; on the other hand; It is to improve the salt spray resistance and artificial sweat resistance of the second coating static test. Electroplating the anti-artificial sweat electrolytic metal layer outside the metal barrier layer, the anti-artificial sweat electrolytic metal layer is Rh, Ru, or RhRu alloy plating; this is to enhance the metal shell resistance to salt spray test, artificial sweat static test and artificial sweat during charging Performance of electrolysis test. In this implementation manner, the electroplating process can all be implemented using a conventional electroplating process.

In a further implementation manner, the contact of this embodiment can be used as a contact structure to be arranged in an electronic device or a charging device, so that the metal shell in the contact is electrically connected to the circuit board in the electronic device/charging device. Therefore, when the contact structure in the electronic device and the contact structure in the charging device are in contact with each other, the charging device can charge the electronic device.

In a further implementation manner, this embodiment also provides another contact structure. The contact structure includes a contact and a circuit board; both the magnetic component and the metal shell are connected to the circuit board by surface mounting .

In the implementation of the present invention, the metal shell with the second plating layer is sleeved on the surface of the magnet substrate with the first plating layer, so that the magnet substrate and the metal shell are combined in the same structure, which has both a magnetic absorption function and a charging function, and then Reduce the space of the contact structure. In addition, an acid copper layer, a metal barrier layer, and an anti-artificial sweat electrolytic metal layer are sequentially arranged on the surface of the metal shell to protect the magnet substrate and pass the salt spray test, artificial sweat static test and artificial sweat electrolysis test .

In a further implementation manner, in order to make the metal shell with the second plating layer have a good performance of resistance to artificial sweat electrolysis test, the anti-artificial sweat electrolysis metal layer is a RhRu alloy plating layer.

In a further implementation manner, the thickness of the anti-artificial sweat electrolytic metal layer ranges from 0.75 μm to 100 μm (for example, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, 1 μm, 10 μm, or 100 μm, etc.); in a further implementation In the manner, the thickness of the anti-artificial sweat electrolytic metal layer ranges from 0.75 μm to 1 μm (for example, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, or 1 μm).

In a further implementation manner, in order to effectively prevent the Cu layer on the surface of the metal shell from being released and diffused into other metal coatings, thereby affecting the performance of other metal coatings; the metal barrier layers are Pd coatings, Pt coatings, PdCo coatings, PdPt coatings, PdAg plating, PdAu plating, or PdIn plating. In a further implementation manner, in order to improve the salt spray resistance test and artificial sweat resistance static test performance of the metal shell; the metal barrier layer is a Pd plating layer. Since the Pd plating layer has heat resistance, it can prevent the second plating layer on the surface of the metal shell from bursting.

In a further implementation manner, the thickness of the metal barrier layer ranges from 0.4 μm to 100 μm (for example, 0.4 μm, 0.6 μm, 0.63 μm, 0.65 μm, 0.7 μm, 0.8 μm, 1 μm, 10 μm, 50 μm, or 100 μm, etc.); In a further implementation manner, the thickness of the metal barrier layer ranges from 0.75 μm to 1 μm (for example, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, or 1 μm, etc.).

In a further implementation manner, the second plating layer further includes: an easy-to-weld metal layer provided on the artificial sweat-resistant electrolytic metal layer. In order to improve the welding performance of the second plating layer and the solder during SMT, the easy-to-weld metal layer is Au, Sn, CuSnZn, or SnAg plating. In a further implementation manner, in order to improve the conductivity, weldability, salt spray resistance test and artificial sweat resistance static test performance of the second plating layer, the weldable metal layer is an Au plating layer. The Au plating layer improves the soldering performance of the second plating layer, because SMT is the solder that can easily infiltrate the Au plating layer, which facilitates rapid soldering.

In a further implementation manner, the thickness of the easily solderable metal layer ranges from 0.125 μm to 100 μm (for example, 0.125 μm, 0.15 μm, 0.18 μm, 0.20 μm, 0.25 μm, 10 μm, or 100 μm, etc.); in a further embodiment Wherein, the thickness of the easily solderable metal layer ranges from 0.125 μm to 0.25 μm (for example, 0.125 μm, 0.15 μm, 0.18 μm, 0.20 μm, 0.25 μm, etc.).

In a further implementation manner, the second plating layer further includes: a conductive metal layer disposed between the metal barrier layer and the anti-artificial sweat electrolysis metal layer. In order to improve the conductivity of the second plating layer, the conductive metal layer is Ag, SnAg, CuSnZn, or Au plating. In a further embodiment, the conductive metal layer is an Au plating layer. The choice of Au plating as the conductive metal plating is due to the low impedance and good conductivity of the Au plating; on the other hand, the Au plating can improve the salt spray test and artificial sweat static test performance of the second plating.

In a further implementation manner, the thickness of the conductive metal layer ranges from 0.3 μm to 100 μm (for example, 0.3 μm, 0.5 μm, 0.6 μm, 0.63 μm, 0.65 μm, 0.7 μm, 0.75 μm, 1 μm, 10 μm, 50 μm, or 100 μm. Etc.); In a further implementation manner, the thickness of the conductive metal layer ranges from 0.5 μm to 0.75 μm (for example, 0.5 μm, 0.6 μm, 0.63 μm, 0.65 μm, 0.7 μm, or 0.75 μm, etc.).

In a further implementation manner, the first plating layer is a coke copper layer and a Ni layer in order from the inside to the outside. The reason for electroplating the scorched copper layer on the surface of the magnet substrate is that the Cu material is soft, and it is easy to be evenly electroplated on a small-sized magnet substrate, and there are few problems such as surface bubbles and edge bursts. Electroplating the Ni layer on the coke copper layer, on the one hand, is to protect the coke copper layer from copper from being oxidized, and on the other hand, to facilitate the soldering of the magnet base material and the solder during SMT, that is, to improve the soldering performance.

In a further implementation manner, the thickness of the burnt copper layer ranges from 3 μm to 100 μm (for example, 3 μm, 5 μm, 10 μm, 20 μm, 50 μm, or 100 μm, etc.), and the thickness of the Ni layer ranges from 5 μm to 100 μm (for example, 5 μm, 8μm, 10μm, 20μm, 50μm or 100μm, etc.); in a further implementation manner, the thickness of the burnt copper layer ranges from 18μm-20μm (for example, 18μm, 18.5μm, 19μm, 19.5μm or 20μm, etc.), The thickness of the Ni layer ranges from 5 μm to 8 μm (for example, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, or 8 μm, etc.).

In a further implementation manner, the thickness of the acid copper layer ranges from 2 μm to 100 μm (2 μm, 5 μm, 10 μm, 20 μm, 50 μm, or 100 μm, etc.); in a further implementation manner, the thickness range of the acid copper layer It is 3 μm-5 μm (for example, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, etc.); the acid copper layer can be replaced by the acid nickel layer.

In a further implementation manner, the first plating layer and the second plating layer are both the outermost plating layers that have been sealed; the outermost layer of the first plating layer refers to a nickel layer, and the outermost layer of the second plating layer is a nickel layer. The outer layer refers to the anti-artificial sweat electrolytic metal layer or the weldable metal plating layer. Sealing on the Ni layer in the first plating layer can not only protect the Ni layer from oxidation and improve the welding effect of the first plating layer during SMT; it can also prevent air from passing through the microporous oxide magnet substrate, thereby preventing the magnet base during SMT. The first coating on the surface of the material bursts. The sealing treatment on the second plating layer can protect the anti-artificial sweat electrolytic metal layer or the weldable metal plating layer from being oxidized, and improve the welding effect of the second plating layer during SMT.

In a further implementation manner, in order to improve the magnetic permeability of the metal casing, the material of the metal casing is selected as a stainless steel substrate; in order to improve the magnetism of the magnetic part, the magnetic part is selected as neodymium iron boron or samarium cobalt. In a further implementation manner, the material of the metal shell is a SUS430 base material; this is because the SUS430 base material has low resistance to magnetism and good magnetic permeability.

The contact structure of the implementation of the present invention realizes the direct magnetic attraction charging function of a magnet for the first time in wearable devices such as earphones, watches, glasses or VR, and electronic products such as electronic cigarettes on the market. The structure is combined into one, which has achieved a new technological breakthrough for the product slimming.

The implementation mode of the present invention is provided with a second plating layer on the surface of the metal shell, which can protect the magnet substrate SMT after passing the salt spray test, artificial sweat static test, and artificial sweat electrolysis test; thus, the contact structure of wearable products or electronic products is realized The contact structure with the charging box (the charging box has a contact structure, and the contact structure and the contact structure of the product form a magnetic charging). It works normally when charging for a long time in the state of human sweat, which greatly extends the wearable The service life of the product or electronic product and the charging box.

In an optional implementation manner, this embodiment also provides a method for manufacturing the contact structure, which includes the following steps:

Select the first specific specification of the magnet substrate (that is, the basic material of the magnetic element); electroplating on the surface of the magnet substrate to form a plating layer; performing a sealing treatment on the surface of the plating layer to obtain a first plating layer Magnet substrate;

Selecting a metal shell of a second specific specification; electroplating on the surface of the metal shell to form a plating layer; performing hole sealing treatment on the surface of the plating layer to obtain a metal shell with a second plating layer;

The metal shell with the second plating layer is sleeved on the outer surface of the magnet substrate with the first plating layer, so that the upper surface of the magnet substrate with the first plating layer is in contact with the metal with the second plating layer. The inner upper surface of the shell is connected by HONDE9736 glue to obtain the contact structure to be magnetized;

Magnetizing treatment is performed on the magnet base material in the contact structure to be magnetized to obtain the contact structure.

In this implementation, the sealing treatment refers to sealing the micropores on the surface of the outermost plating layer with a sealing agent.

In a further implementation manner, performing magnetization processing on the magnet substrate in the contact structure to be magnetized includes: mounting the surface of the contact structure to be magnetized into the circuit board, and then Magnetizing treatment is performed on the magnet base material in the contact structure to be magnetized to obtain the contact structure.

The implementation mode of the present invention assembles the magnetic part with the first plating layer and the metal shell with the second plating layer to the SMT to the circuit board, and then magnetizes the magnetic part; it solves the problem of SMT after the traditional contact structure is magnetized The high temperature demagnetization and mutual attraction problems facilitate the contact structure SMT to the circuit board.

Embodiment 2-1

In an optional implementation manner, as shown in FIG. 8, a contact structure of this embodiment includes a magnetic member 81 and a metal casing 82, and the metal casing 82 is sleeved outside the magnetic member 81 for connecting the magnetic member 81 81 is connected to an external power source and conducts the magnetism of the magnetic element 81. As shown in Figure 10, the surface of the magnetic member 81 is provided with a first plating layer 10, which is a coke copper layer 101 and a Ni layer 102 from the inside to the outside. The thickness of the coke copper layer 101 ranges from 18μm-20μm; the Ni layer The thickness of 102 ranges from 5 μm to 8 μm. As shown in Fig. 9, the surface of the metal shell 82 is provided with a second plating layer 9. The second plating layer 9 is an acid copper layer 91, a Pd plating layer 92, a first Au plating layer 93, a RhRu alloy plating layer 94, and a second Au plating layer from the inside to the outside.层95。 Plated layer 95. The thickness of the acid copper layer 201 in the second plating layer 9 is 3μm-5μm, the thickness of the Pd plating layer 202 is 0.75μm-1μm, the thickness of the first Au plating layer 203 is 0.5μm-0.75μm, and the thickness of the RhRu alloy plating layer 204 The range is 0.75 μm-1 μm, the thickness of the second Au plating layer 205 is in the range of 0.125 μm-0.25 μm, and the second Au plating layer 205 is the plating layer after the sealing treatment.

The manufacturing method of the contact structure of this embodiment includes the following steps:

Step 1: Preparation of the magnetic member 81 with the first plating layer. In this embodiment, the magnetic member 81 is a neodymium iron boron magnet:

1) Paste the neodymium iron boron blank onto the cutting board with glue, and then cut it with a cutting machine to obtain a rectangular neodymium iron boron. Optionally, the glue may be 502 glue. It should be understood that this embodiment does not limit the glue.

3) The rectangular NdFeB that has passed the test is rounded with a spheroning machine to prepare a cylindrical NdFeB; the quality of the specifications of the cylindrical NdFeB is tested.

4) Align one end of the multiple cylindrical NdFeB that passed the test, and then glue the aligned end to the cutting board. Use glue between the multiple cylindrical NdFeB to fix the cylindrical NdFeB The length direction of the quasi-cylindrical neodymium iron boron is cut by a cutting machine to obtain a quasi-cylindrical neodymium iron boron; the quality inspection is performed on the cylindrical neodymium iron boron; among them, the quasi-cylindrical neodymium iron boron refers to a cylindrical neodymium iron boron with a specific length.

6) Use ∮5mm abrasive grain lead angle for the quasi-cylindrical neodymium iron boron that passed the inspection; pickling the quasi-cylindrical neodymium iron boron after the lead angle, and then ultrasonic cleaning; obtain the first specific specification neodymium iron boron. The pickling solution is nitric acid, the volume concentration is 5%, and the pickling time is 30S. The first specific specification NdFeB refers to NdFeB with a clean surface and a specific size.

7) Electroplating is performed on the neodymium iron boron of the first specific specification, followed by the coke copper layer and the nickel layer; then the hole sealing agent is used for the hole sealing treatment on the nickel layer to obtain the neodymium iron boron with the first plating layer.

8) Detect the thickness, appearance and size of the first plating layer, and then vacuum package the neodymium iron boron with the first plating layer that passed the inspection. Among them, the appearance inspection standard of the first coating layer is: the surface of the first coating layer must not have chipping, scorching, cracking, peeling, wrinkling, knife marks and other undesirable phenomena. The first coating layer must be uniform and the surface must be flat. The overall size of the coated NdFeB should be controlled within the tolerance range of +/-0.05mm.

Step 2: Preparation of a metal shell with a second plating layer. Optionally, the metal shell is made of stainless steel SUS430. It should be understood that this embodiment does not limit this.

1) Turn the rod-shaped SUS430 substrate diameter size on the lathe into the outer diameter size required for the metal shell; then place the SUS430 substrate on the lathe, and turn the SUS430 substrate inside the circular groove for placing the magnet substrate (I.e. containment cavity), and then use a lathe to deburr the shape and inner round edge of the SUS430 metal shell after being turned out, and finally cut the metal shell from the rod-shaped SUS430 base material according to the height of the metal shell to obtain SUS430 metal shell.

2) Use a grinder to grind the outer end surface of the SUS430 metal shell; then inspect its specifications and appearance.

3) Pickling the SUS430 metal shell that passed the test and then ultrasonic cleaning to obtain the second specific specification of SUS430 metal shell; electroplating on the surface of the second specific specification of SUS430 metal shell, and then plating acid copper layer, Pd plating layer, and second specific specification. An Au plating layer, RhRu alloy plating layer and a second Au plating layer. The outermost plating layer is sealed with a sealing agent to obtain a SUS430 metal shell with a second plating layer. Among them, pickling and ultrasonic cleaning are mainly to remove impurities and oil on the SUS430 metal shell; the solution of pickling is sulfuric acid, the volume concentration is 8%, and the pickling time is 60s.

4) Inspect the thickness, appearance and size of the SUS430 metal shell with the second plating layer, and then vacuum package the SUS430 metal shell with the second plating layer that passed the test. Among them, the appearance inspection standard of SUS430 metal shell with the second coating is: the surface is smooth, no knives, no deformation, flatness ≤0.1mm, and the second coating surface must not have undesirable phenomena such as scorching, cracking, and peeling.

Step 3: Paste the neodymium iron boron with the first coating layer (such as HONDE 9736 glue) into the SUS430 metal casing with the second coating layer, and connect the upper surface of the neodymium iron boron with the inner upper surface of the SUS430 metal casing. Then the carrier tape is packaged; the contact structure to be magnetized is obtained. Among them, the carrier tape packaging means that the electroplated product is placed in the hole of the carrier tape according to the placement requirements, and the product is covered with a transparent top film. The edge of the top film is glued to the carrier tape, and the carrier tape is rolled at the same time. On the carrier tape, after the packaging is completed, use the film to roll a few more times to fix the carrier tape on the carrier tape to prevent the carrier tape from loosening and falling off.

Step 4: Magnetizing the magnet substrate in the contact structure to be magnetized to obtain the contact structure.

In this embodiment, due to the high acidity of the air in the electroplating plant, vacuum packaging can prevent the neodymium iron boron with the first coating layer or the SUS430 metal shell with the second coating layer from being corroded by the acid gas during storage and transportation. ; On the other hand, vacuum packaging can also prevent the neodymium iron boron with the first plating layer or the SUS430 metal shell with the second plating layer from being scattered and leaking during transportation.

The realization method of the electroplating process in this embodiment: Put the quasi-cylindrical neodymium iron boron or SUS430 metal shell together with the plated steel balls into the electroplating bath, and apply electric current for electroplating. Co-plating steel ball is mainly to prevent the phenomenon of lamination of small-sized quasi-cylindrical NdFeB or SUS430 metal shell, and the problem of uneven plating in small currents. Each coating has a corresponding electroplating bath. After each coating is plated, the thickness of the coating needs to be measured. After the thickness of the coating reaches the required requirements, it is placed in the next electroplating bath, and electroplating is carried out in sequence.

In the related art, the magnet is separated from the copper POGO PIN, and the magnet is assembled into the casing for magnetic attraction, and the copper material POGO PIN is assembled on the casing for charging; the combination of NdFeB and SUS430 metal casing in this embodiment is Combining the magnet and the metal shell into the same structural space can achieve both the magnetic attraction function and the charging function, and the contact structure can be reduced. In this embodiment, a first plating layer of Cu-Ni is provided on the surface of the magnet substrate, and a second plating layer of Cu-Pd-Au-RhRu-Au is provided on the surface of the metal shell; so that the surface of the contact structure has good flatness and smoothness It can also protect the contact structure through salt spray test, artificial sweat static test and charging artificial sweat electrolysis test.

Embodiment 2-2

11 is a schematic cross-sectional view of the contact structure of the second embodiment of the present invention. The appearance of the contact structure of this embodiment is similar to the appearance of the contact structure of the first embodiment. For details, please refer to FIG. 2, which will not be repeated here.

In the embodiment, the contact structure includes a magnetic element 81, a metal casing 82 and a circuit board 110. Optionally, the metal housing 82 can be made of stainless steel material with a model of SUS430. The metal casing 82 is sleeved outside the magnetic part 81 for connecting the magnetic part 81 with an external power source and conducts the magnetism of the magnetic part 81; the magnetic part 81 and the metal casing 82 are both connected to the circuit board 110 by surface mounting . The surface of the magnetic member 81 is provided with a first plating layer, the first plating layer is a coke copper layer and a Ni layer from the inside to the outside. The thickness of the coke copper layer ranges from 18 μm to 20 μm; the thickness of the Ni layer ranges from 5 μm to 8 μm. The surface of the SUS430 metal shell is provided with a second plating layer. The second plating layer is acid copper layer, Pd plating layer, first Au plating layer, RhRu alloy plating layer and second Au plating layer from the inside to the outside; the thickness range of the acid copper layer in the second plating layer The thickness of the Pd coating is 3μm-5μm, the thickness of the Pd coating is 0.75μm-1μm, the thickness of the first Au coating is 0.5μm-0.75μm, the thickness of the RhRu alloy coating is 0.75μm-1μm, and the thickness of the second Au coating is 0.125μm-0.25μm, the second Au plating layer is the plating layer after sealing treatment.

The preparation method of the contact structure of this embodiment is similar to that of the embodiment 2-1, and the difference from the embodiment 2-1 is step 4.

In this embodiment, step 4: SMT the contact structure to be magnetized into the circuit board, and then magnetize the magnet substrate in the contact structure to be magnetized to obtain the contact structure.

In this embodiment, a first plating layer of Cu-Ni is provided on the surface of the magnetic member 81, and a second plating layer of Cu-Pd-Au-RhRu-Au is provided on the surface of the metal casing; and then the unmagnetized magnetic member 81 and the metal casing are SMT to In the circuit board, magnetization is performed last. This can protect the magnet SMT in the contact structure and pass the salt spray test, artificial sweat static test and charging artificial sweat electrolysis test. The problem that the magnet in the contact structure of the related technology cannot be SMT or cannot be charged after SMT is solved.

Embodiment 2-3

The contact structure of this embodiment includes: magnetic parts (such as neodymium iron boron magnets), a metal shell (such as SUS430 stainless steel) and a circuit board; the SUS430 metal shell is sleeved outside the neodymium iron boron to connect the neodymium iron boron with The external power supply conducts and conducts the magnetism of the neodymium iron boron; the neodymium iron boron and the SUS430 metal shell are both connected to the circuit board by surface mounting. The surface of the neodymium iron boron is provided with a first plating layer. The first plating layer is a coke copper layer and a Ni layer from the inside to the outside. The thickness of the coke copper layer ranges from 18 μm to 20 μm; the thickness of the Ni layer ranges from 5 μm to 8 μm. The surface of the metal shell is provided with a second plating layer. The second plating layer is acid copper layer, Pd plating layer, and RhRu alloy plating layer from the inside to the outside; the thickness of the acid copper layer in the second plating layer ranges from 3 μm to 5 μm, and the thickness range of the Pd plating layer is The thickness of the RhRu alloy coating is 0.75μm-1μm, and the thickness of the RhRu alloy coating is 0.75μm-1μm. The RhRu alloy coating is the coating after the sealing treatment.

The preparation method of the contact structure of this embodiment is similar to that of the embodiment 2-1, and the difference from the embodiment 2-1 is 3) and step 4 in step 2.

In this embodiment, step 2:3) pickling the SUS430 metal shell that passed the test, and then ultrasonic cleaning, to obtain the second specific specification of SUS430 metal shell; electroplating is performed on the surface of the second specific specification of SUS430 metal shell, Plating acid copper layer, Pd plating layer, RhRu alloy plating layer in sequence. The outermost plating layer is sealed with a sealing agent to obtain a SUS430 metal shell with a second plating layer. Among them, pickling and ultrasonic cleaning are mainly to remove impurities and oil on the SUS430 metal shell; the pickling solution is sulfuric acid, the volume concentration is 8%, and the pickling time is 60s.

Step 4: Put the SMT of the contact structure to be magnetized into the circuit board, and then perform magnetization treatment on the magnet base material in the contact structure to be magnetized to obtain the contact structure.

Embodiment 2-4

The contact structure of this embodiment includes: magnetic parts (such as neodymium iron boron magnets), a metal shell (such as SUS430 stainless steel) and a circuit board; the SUS430 metal shell is sleeved outside the neodymium iron boron to connect the neodymium iron boron with The external power supply conducts and conducts the magnetism of the neodymium iron boron; the neodymium iron boron and the SUS430 metal shell are both connected to the circuit board by surface mounting. The surface of the neodymium iron boron is provided with a first plating layer. The first plating layer is a coke copper layer and a Ni layer from the inside to the outside. The thickness of the coke copper layer is 18μ-20μ; the thickness of the Ni layer is 5μ-8μ. The surface of the metal shell is provided with a second plating layer. The second plating layer is acid copper layer, Pd plating layer, RhRu alloy plating layer, and Au plating layer from the inside to the outside; the thickness of the acid copper layer in the second plating layer is 3-5μ, and the Pd plating layer The thickness of the RhRu alloy plating layer is 0.75μ-1μ, the thickness of the RhRu alloy plating layer is 0.75μ-1μ, the thickness of the Au plating layer is 0.125μ-0.25μ, and the Au plating layer is the plating layer after the sealing treatment.

In this embodiment, step 2:3) pickling the SUS430 metal shell that passed the test, and then ultrasonic cleaning, to obtain the second specific specification of SUS430 metal shell; electroplating is performed on the surface of the second specific specification of SUS430 metal shell, Plating acid copper layer, Pd plating layer, RhRu alloy plating layer and Au plating layer in sequence. The outermost plating layer is sealed with a sealing agent to obtain a SUS430 metal shell with a second plating layer. Among them, pickling and ultrasonic cleaning are mainly to remove impurities and oil on the SUS430 metal shell; the pickling solution is sulfuric acid, the volume concentration is 8%, and the pickling time is 60s.

Embodiment 2-5

The contact structure of this embodiment includes: magnetic parts (such as neodymium iron boron magnets), a metal shell (such as SUS430 stainless steel) and a circuit board; the SUS430 metal shell is sleeved outside the neodymium iron boron to connect the neodymium iron boron with The external power supply conducts and conducts the magnetism of the neodymium iron boron; the neodymium iron boron and the SUS430 metal shell are both connected to the circuit board by surface mounting. The surface of the neodymium iron boron is provided with a first plating layer. The first plating layer is a coke copper layer and a Ni layer from the inside to the outside. The thickness of the coke copper layer ranges from 18 μm to 20 μm; the thickness of the Ni layer ranges from 5 μm to 8 μm. The surface of the metal shell is provided with a second plating layer. The second plating layer is acid copper layer, Pd plating layer, Au plating layer, and RhRu alloy plating layer from the inside to the outside; the thickness of the acid copper layer in the second plating layer ranges from 3μm-5μm, and the thickness of the Pd plating layer The thickness range is 0.75μm-1μm, the thickness range of the Au plating layer is 0.5μm-0.75μm, the thickness range of the RhRu alloy plating layer is 0.75μm-1μm, and the RhRu alloy plating layer is the plating layer after the sealing treatment.

The preparation method of the contact structure of this embodiment is similar to that of the embodiment 2-1, and the difference from the embodiment 2-1 is: 3) in step 2 and step 4.

In this embodiment, step 2:3) pickling the passed SUS430 metal shell and then ultrasonic cleaning to obtain the second specific specification SUS430 metal shell; electroplating on the surface of the second specific specification SUS430 metal shell, in turn Acid copper plating, Pd plating, Au plating, RhRu alloy plating. The outermost plating layer is sealed with a sealing agent to obtain a SUS430 metal shell with a second plating layer. Among them, pickling and ultrasonic cleaning are mainly to remove impurities and oil on the SUS430 metal shell; the pickling solution is sulfuric acid, the volume concentration is 8%, and the pickling time is 60s.

Embodiment 2-6

The contact structure of this embodiment includes: a magnetic component (such as a samarium cobalt magnet), a metal shell (such as SUS430 stainless steel) and a circuit board; the SUS430 metal shell is sleeved outside the samarium cobalt magnet to connect the samarium cobalt magnet to the outside The power supply conducts and conducts the magnetism of the samarium cobalt magnet; both the samarium cobalt magnet and the SUS430 metal shell are connected to the circuit board by surface mounting. The surface of the samarium cobalt is provided with a first plating layer. The first plating layer is a coke copper layer and a Ni layer from the inside to the outside. The thickness of the coke copper layer ranges from 18 μm to 20 μm; the thickness of the Ni layer ranges from 5 μm to 8 μm. The surface of the metal shell is provided with a second plating layer. The second plating layer is acid nickel layer, Pt plating layer, SnAg plating layer, Rh plating layer, and Sn plating layer from the inside to the outside; the thickness of the acid nickel layer in the second plating layer ranges from 3 μm to 5 μm, The thickness range of Pt coating is 0.75μm-1μm, the thickness of SnAg coating is 0.5μm-0.75μm, the thickness of Rh coating is 0.75μm-1μm; the thickness of Sn coating is 0.125μm-0.25μm, and the Sn coating is sealing. Plating after hole treatment.

The preparation method of the contact structure of this embodiment is similar to that of the embodiment 2-1, and the difference from the embodiment 2-1 is: 3) and step 4 in step 2.

In this embodiment, step 2:3) pickling the metal shell that passes the test and then ultrasonic cleaning to obtain a metal shell of the second specific specification; electroplating on the surface of the metal shell of the second specific specification, followed by nickel plating Layer, Pt plating, SnAg plating, Rh plating, and Sn plating. The outermost plating layer is sealed with a sealing agent to obtain a metal shell with a second plating layer. Among them, pickling and ultrasonic cleaning are mainly to remove impurities and oil on the SUS430 metal shell; the pickling solution is sulfuric acid, the volume concentration is 8%, and the pickling time is 60s.

Step 4: Put the SMT of the contact structure to be magnetized into the circuit board, and then magnetize the samarium cobalt in the contact structure to be magnetized to obtain the contact structure.

The principle of the artificial sweat electrolysis test in this embodiment is similar to that in the first embodiment, and the principle diagram can refer to FIG. 7. In an optional implementation manner, the electronic device is an earphone and the charging device is a charging box as an example. It should be understood that this embodiment does not limit this.

1. Artificial sweat electrolysis test:

1) Solder the pad end of the contact structure suitable for earphones and the pin end of the contact structure suitable for the charging box with wires respectively; among them, the contact structure with SMT solder can not cover the test contact surface to keep the test contact The cleanliness of the surface.

2) Magnetize the magnetic parts of the two contact structures separately, so that the pad end and pin end of the contact structure are attracted together (that is, the contact state of the pad end and the pin end during normal charging is consistent), and a set of contacts is obtained structure.

3) Put the two groups of contact structures after the above treatment in the same container filled with artificial sweat (PH4.7), and the two groups of contact structures can be completely immersed in the sweat to serve as the positive and negative electrodes of the electrolytic cell, respectively . The distance between the positive and negative poles is 1-3cm, and a 55Ω resistor is connected in series between the two sets of contact structures and connected to the power supply to form a loop.

4) Adjust the current to 90mA (voltage is about 5V) and stabilize the current, turn on the loop, keep the power on, disconnect the circuit after each power on for one minute, take out the pad near the positive pole from the artificial sweat, and wipe it clean Observe the damage of the coating under the microscope. If the coating is silver, continue the test; if the coating appears black and expose the bottom SUS430 metal shell, stop the test.

2. Salt spray test:

Place the contact structure in the salt spray machine test box, and spray NaCl solution with 5% salt spray concentration at a temperature of 35±2℃ and humidity >85% for 48 hours, PH value 6.5-7.2, spray pressure 1± 0.3kg/cm2; After the test, place it to dry at room temperature for 2H, and then check the appearance and function;

3. Artificial sweat static test:

Soak the contact structure in artificial sweat (acidic ph4.7), wrap the sample with a dust-free cloth after soaking, and place it at 60°C and 90% temperature and humidity for 48 hours. After the test, place it at room temperature for 2 hours, and then check Appearance and function;

It has been verified that the contact structure of this embodiment has passed the above-mentioned artificial sweat electrolysis test, salt spray test and artificial sweat static test. Moreover, the contact structure of Example 2 has the best performance in the artificial sweat electrolysis test, the salt spray test and the artificial sweat static test.

In the embodiment of the present invention, the magnetic parts and the metal shell are respectively electroplated, which not only ensures the flatness and smoothness of the product surface, but also greatly helps to maintain the beauty of the product; electroplating the metal shell can protect the magnetic parts after SMT Pass salt spray test, artificial sweat static test, artificial sweat electrolysis test.

Example three

Fig. 12 is a schematic cross-sectional view of a contact structure according to a third embodiment of the present invention. As shown in FIG. 12, this embodiment provides a contact, which includes a magnetic element 121 and a metal shell 122. Wherein, a receiving cavity 1221 is formed in the metal shell 122; the magnetic member 121 is arranged in the receiving cavity 1221.

The contacts in this embodiment can be arranged on electronic equipment and/or charging equipment. The metal shell 122 can be electrically connected to the circuit of the electronic equipment. When it is necessary to electrically connect with an external electronic equipment (such as a charging equipment), the metal shell 122 can be electrically connected to an external electronic equipment (such as a charging equipment). The metal casing 122 is in contact with the connecting end of the external electronic device (such as a terminal provided in the external electronic device), so that the electronic device is electrically connected to the external electronic device, and at the same time, the magnetic member 121 can adsorb the external electronic device to ensure The stability of the connection between the contact and the connection terminal of the external electronic device is improved. Since the magnetic element 121 is arranged in the accommodating cavity 1221 in the metal shell 122, it does not occupy the external space of the contact, which is conducive to the miniaturization of the contact, improves the flexibility and convenience of the use of the contact, and the metal shell 122 is resistant The wear performance is good, it can resist the abrasion when contacting the connecting end of the external electronic equipment and other internal components, and is not easy to be damaged. Since the magnetic part 121 is arranged in the receiving cavity 1221 in the metal housing 122, the metal housing 122 is opposite to the magnetic part. 121 forms a layer of protection to avoid the wear caused by the contact between the magnetic part 121 and the internal components of the electronic device, and at the same time prevent the magnetic part 121 from being directly exposed to the air to oxidize, which improves the reliability of the contact.

In this embodiment, preferably, the metal shell 122 is a copper alloy shell. The metal shell 122 made of copper alloy is easily soldered on the circuit board, which improves the convenience of using the contacts.

In this embodiment, preferably, the magnetic member 121 is a neodymium iron boron magnet. The neodymium iron boron magnet has high magnetic strength and good magnetic attraction performance, which improves the reliability of the contact. At the same time, the neodymium iron boron magnet has a high magnetic strength per unit volume. In practice, without affecting the magnetic attraction performance, it can be made into a smaller size magnetic part 121, which can be installed on a smaller electronic device to improve the contact Ease of use.

In this embodiment, preferably, a conductive anticorrosive coating 124 is formed on the outer surface of the metal shell 122. Multiple dense conductive anticorrosive coatings 124 can be formed on the metal shell 122, which improves the conductivity and anticorrosion ability of the metal shell 122. As a result, the reliability of the use of the contacts is improved.

In this embodiment, preferably, the conductive anticorrosive plating layer 122 is a gold plating layer. The gold coating has strong corrosion resistance and better electrical conductivity.

In an optional implementation manner, this embodiment also provides a contact structure. The contact structure includes the contacts of this embodiment and the circuit board 123, and the circuit board 123 is electrically connected to the metal casing 122. When in use, the circuit board 123 can be electrically connected to the circuit of the electronic device, so that the metal shell 122 is electrically connected to the circuit of the electronic device. The connection is convenient, and the circuit board 123 occupies a small space, thus facilitating the miniaturization of the contacts.

In this embodiment, preferably, the metal housing 122 includes a barrel-shaped main body 1222 and a base 1223. The accommodating cavity 1221 is formed in the barrel-shaped main body 1222. The bottom of the barrel-shaped main body 1222 is formed with an opening 1224. The base 1223 is formed in the barrel-shaped main body. At the edge of the 1222 opening 1224, the base 1223 is ring-shaped and coaxial with the barrel-shaped main body 1222. The outer diameter of the base 1223 is larger than that of the barrel-shaped main body 1222; the bottom surface of the base 1223 is welded and fixed to the circuit board 123 to make the metal shell 122 Electrically connected to the circuit board 123. As a result, the magnetic element 121 is sealed in the sealed cavity formed by the metal casing 1222 and the circuit board 123, which avoids contact and wear with internal components of the electronic device. At the same time, the base 1223 is ring-shaped and the outer diameter of the base 1223 is larger than the outer diameter of the barrel-shaped body 1222, which increases the contact area with the circuit board 123, and is more stable when welded on the circuit board 123, which improves the reliability of the contact. .

In this embodiment, preferably, the magnetic member 121 is closely attached to the inner wall of the barrel-shaped main body 1222. Thus, the magnetic part 121 and the barrel-shaped main body 1222 are seamlessly connected, and the magnetic part 121 is prevented from being displaced in the barrel-shaped main body 1222. When the contact is connected with an external electronic device, it is beneficial to reduce the gap between the magnetic part 121 and the external electronic device. Distance, thereby improving the adsorption force for the external electronic device, and improving the stability of the connection between the contact and the connection end of the external electronic device.

In this embodiment, preferably, the bottom surface of the magnetic member 121 is in contact with the circuit board 123. Thus, the circuit board 123 can support the magnetic element 121, so that the magnetic element 121 can be firmly positioned in the sealed cavity formed by the metal casing 122 and the circuit board 123.

In an optional implementation manner, an embodiment of the present invention also provides an electronic device, including a device body and the contact or contact structure described in any embodiment of the present invention. The circuit in the device body is electrically connected to the metal casing 123. connection.

When the electronic device in this embodiment needs to be electrically connected with an external electronic device, the metal housing 123 can be contacted with the connecting end of the external electronic device, so that the electronic device is electrically connected with the external electronic device, and at the same time, the magnetic member 121 The external electronic device can be adsorbed, thereby ensuring the stability of the connection between the contact and the connection terminal of the external electronic device. Since the magnetic element 121 is arranged in the accommodating cavity 1221 in the metal casing 122, it does not occupy the external space of the contact, which is conducive to the miniaturization of the contact, and improves the flexibility and convenience of the use of electronic equipment, and the metal casing 122 is resistant to The wear performance is good, it can resist the abrasion when contacting the connecting end of the external electronic equipment and other internal components, and is not easy to be damaged. Since the magnetic part 121 is arranged in the receiving cavity 1221 in the metal housing 122, the metal housing 122 is opposite to the magnetic part. 121 forms a layer of protection to avoid the wear caused by the contact between the magnetic part 121 and the internal components of the electronic device, and at the same time prevent the magnetic part 121 from being directly exposed to the air to oxidize, which improves the reliability of the use of the electronic device.

Example four

Fig. 13 is a schematic diagram of the switching of contacts in the fourth embodiment of the present invention. Fig. 14 is a schematic diagram of the contact structure of the fourth embodiment of the present invention. Fig. 15 is a schematic diagram of an electronic device and a charging device according to a fourth embodiment of the present invention in a use state.

13-15, the present embodiment provides a contact 1300, including a magnetic member 1301 and a conductive layer 1302, the conductive layer 1302 is formed on the outer surface of the magnetic member 1301, the magnetic member 1301 is used to set On the circuit board 1400, the conductive layer 1302 is used to electrically connect with the circuit board 1400. In an optional implementation manner, the conductive layer 1302 is a conductive material plating layer formed on the outer surface of the magnetic member 1301. Optionally, the conductive layer 1302 is a conductive anticorrosive coating. Preferably, the conductive layer 1302 is a gold coating to improve the conductivity and corrosion resistance of the conductive layer. It should be understood that the conductive layer 1302 may also be a nickel plating layer, a copper plating layer, or a nickel copper alloy plating layer, etc., which is not limited in this embodiment.

For the contact 1300 in this embodiment, when in use, the magnetic member 1301 can be disposed on the circuit board 1400 of the electronic device 1000 and the charging device 1500, and the conductive layer 1302 is electrically connected to the circuit board 1400 of the electronic device 1000 and the charging device 1500, When the electronic device 1000 needs to be charged, the contact 1300 on the electronic device 1000 can be brought into contact with the contact 1300 on the charging device 1500, and the contact 1300 on the electronic device 1000 can be charged with the adsorption of the magnetic member 1301. The contact 1300 on the device 1500 is adsorbed and positioned. Since the conductive layer 1302 is a conductive material plating layer 1302, when the contact 1300 on the electronic device 1000 is in contact with the contact 1300 on the charging device 1500, the electronic device 1000 and the charging device 1500 can be brought into contact with each other. It is electrically connected, so that the charging device 1500 can charge the electronic device 1000. Since the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500 are relatively positioned by adsorption, the contact 1300 on the electronic device 1000 is connected or separated from the contact 1300 on the charging device 1500 There will be no wear during long-term use, and the adsorption force will not be reduced during long-term use, which improves the stability of the connection between the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500, and avoids loosening and power failure. The problem has improved the reliability of the use of the contact 1300. At the same time, since the conductive layer 1302 is formed on the outer surface of the magnetic member 1301, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of the electronic device 1000 and the charging device 1500.

In this embodiment, preferably, the conductive layer 1302 is a conductive and corrosion-resistant material plating layer 1302. This prevents the conductive layer 1302 from being corroded during the use of the contact 1300 and affecting the conductive effect.

In this embodiment, preferably, the conductive layer 1302 is a gold conductive layer 1302. Therefore, it is beneficial to improve the conductivity and corrosion resistance of the conductive layer 1302. Of course, the conductive layer 1302 can also be a nickel conductive layer 1302, a copper conductive layer 1302, and the like.

In this embodiment, preferably, the magnetic member 1301 includes a base 103 and a contact 104, the base 1303 and the contact 1304 are both cylindrical, the contact 1304 is connected to the base 1303, and the base 1303 and the contact The axis of the head 1304 extends in the same direction, the diameter of the base 1303 is larger than the diameter of the contact 1304, and the bottom surface of the base 1303 is used to connect with the circuit board 1400. As a result, the stability of the connection of the magnetic member 1301 is better, and the force-receiving performance of the magnetic member 1301 is improved.

In this embodiment, preferably, the base 1303 and the contact 1304 are both cylindrical. As a result, the stability of the connection of the magnetic member 1301 is better, and the force-receiving performance of the magnetic member 1301 is improved.

In this embodiment, preferably, the base 1303 and the contact 1304 are coaxial. Therefore, it is beneficial to improve the force-receiving performance of the magnetic member 1301.

In this embodiment, preferably, the base 1303 and the contact 1304 are integrally formed. Therefore, it is beneficial to improve the connection strength between the base 1303 and the contact 1304.

The embodiment of the present invention provides a contact structure, including a circuit board 1400 and the contact 1300 according to any embodiment of the present invention. The magnetic member 1301 is disposed on the circuit board 1400, and the conductive layer 1302 is connected to the The circuit board 1400 is electrically connected.

The contact structure in this embodiment can be set on the electronic device 1000 and the charging device 1500 when in use. When the electronic device 1000 needs to be charged, the contact 1300 on the electronic device 1000 can be made to touch the charging device 1500. The point 1300 is in contact with each other. The contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500 can be adsorbed and positioned under the adsorption of the magnetic member 1301. Since the conductive layer 1302 is a conductive material plating layer 1302, when the electronic device 1000 is When the contact 1300 of is in contact with the contact 1300 on the charging device 1500, the electronic device 1000 and the charging device 1500 can be electrically connected, so that the charging device 1500 can charge the electronic device 1000. Since the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500 are relatively positioned by adsorption, the contact 1300 on the electronic device 1000 is connected or separated from the contact 1300 on the charging device 1500 There will be no wear during long-term use, and the adsorption force will not be reduced during long-term use, which improves the stability of the connection between the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500, and avoids loosening and power failure. The problem has improved the reliability of the use of the contact 1300. At the same time, since the conductive layer 1302 is formed on the outer surface of the magnetic member 1301, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of the electronic device 1000 and the charging device 1500.

An embodiment of the present invention also provides an electronic device 1000, which includes an electronic device main body and the contact structure described in the embodiment of the present invention, and the contact structure is disposed on the electronic device main body.

An embodiment of the present invention further provides a charging device 1500, which includes a charging device main body and the contact structure described in the embodiment of the present invention, and the contact structure is disposed on the charging device main body.

For the electronic device 1000 and the charging device 1500 in this embodiment, when the electronic device 1000 needs to be charged, the contact 1300 on the electronic device 1000 can be brought into contact with the contact 1300 on the charging device 1500, and the magnetic member 1301 is adsorbed The contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500 can be adsorbed and positioned. Since the conductive layer 1302 is a conductive material plating layer 1302, when the contact 1300 on the electronic device 1000 and the contact on the charging device 1500 are When 1300 is in contact, the electronic device 1000 and the charging device 1500 can be electrically connected, so that the charging device 1500 can charge the electronic device 1000. Since the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500 are relatively positioned by adsorption, the contact 1300 on the electronic device 1000 is connected or separated from the contact 1300 on the charging device 1500 There will be no wear during long-term use, and the adsorption force will not be reduced during long-term use, which improves the stability of the connection between the contact 1300 on the electronic device 1000 and the contact 1300 on the charging device 1500, and avoids loosening and power failure. The problem has improved the reliability of the use of the contact 1300. At the same time, since the conductive layer 1302 is formed on the outer surface of the magnetic member 1301, the occupied space and installation difficulty are effectively reduced, which is beneficial to the miniaturization of the electronic device 1000 and the charging device 1500.

Example five

FIG. 16 is a schematic diagram of a partial structure of an electronic device according to a fifth embodiment of the present invention. Fig. 17 is a partial structural diagram of the contact structure of the fifth embodiment of the present invention.

16-17, the embodiment of the present invention provides a contact structure, including a frame 161, a contact 162 and a contact 163, the contact 162 is connected to the frame 161; the contact 163 is connected to the frame 161 through an elastic member 164, elastic The member 164 is used to apply elastic force to the contact 163 to position the contact 163 relative to the frame 161, and to make the contact 163 and the contact 162 have a set distance in the first direction. The elastic member 164 can move along the edge under the action of external force. The first direction extends toward the contact 162 so that the contact 163 can contact and be electrically connected to the contact 162.

The contact structure in this embodiment can be set on an electronic device, and the contact 162 is electrically connected to the circuit of the electronic device. When the electronic device needs to be connected to an external electronic device (such as a charging device) electrical connection terminal (such as the contact of the charging device) When point) is connected, the connecting end of the external electronic device will contact the contact 163 and apply pressure to the contact 163. At the same time, the elastic member 164 will also be pressed and stretched toward the contact 162 in the first direction to make the contact 163 It is in contact with and electrically connected to the contact 162, thereby electrically connecting the electronic device and the external electronic device. When the connecting end of the electronic device is separated from the external electronic device, the elastic member 164 drives the contact 163 back to the contact member 162 in the first direction under the elastic action to reset and position the contact 163 relative to the frame 161. At this time, the contact 163 and the contact 162 maintain a set distance in the first direction. Since the contact 163 and the contact 162 are kept at a set distance in the first direction, the contact 163 and the contact 162 are not conducted, which prevents the exposed contact 163 from forming a closed inside in the case of external water seepage or metal overlap. The internal battery power loss and circuit damage of the electronic device caused by the circuit improve the reliability and safety of the structure of the contact 163. At the same time, the contact 163 is connected to the frame 161 through the elastic member 164. When the contact 163 moves relative to the frame 161, the elastic member 164 can produce a certain buffer effect, preventing the contact 163 and the contact 162 from violently colliding, and improving the structure of the contact 163. Reliability.

In this embodiment, preferably, a cavity 165 is formed in the frame 161, the contact member 162 is located in the cavity 165, and the elastic member 164 closes the gap between the contact 163 and the frame 161 to seal the cavity 165. Due to the sealing effect of the elastic member 164, external liquid can be prevented from entering the cavity 165 and contacting the contact member 162, which further improves the reliability and safety of the structure of the contact 163.

In this embodiment, preferably, a first clamping portion 166 is formed on the contact 163, the first clamping portion 166 extends along the circumference of the contact 163, the elastic member 164 is plate-shaped, and the elastic member 164 is formed with a connection A hole 167 and a second clamping portion 168. The second clamping portion 168 is provided at the edge of the connecting hole 167 and extends along the circumference of the connecting hole 167. The first clamping portion 166 and the second clamping portion 168 are connected by clamping . The contact 163 passes through the connecting hole 167 of the elastic member 164, and the first clamping portion 166 on the contact 163 and the second clamping portion 168 on the elastic member 164 are clamped with each other, thereby making the contact 163 and The elastic member 164 is convenient and stable in connection, and the contact 163 and the frame 161 can achieve a more stable relative positioning through the elastic member 164, which improves the reliability of the structure of the contact 163.

In this embodiment, preferably, the first clamping portion 166 is a tenon, and the second clamping portion 168 is a clamping slot. Therefore, the structure of the connection structure between the contact 163 and the frame 161 is simple and the cost is low.

In this embodiment, preferably, a third clamping portion 169 is formed on the outer edge of the elastic member 164, a fourth clamping portion 1610 is formed on the frame 161, and the third clamping portion 169 is clamped with the fourth clamping portion 1610. connection. As a result, the connection between the elastic member 164 and the frame 161 is convenient and stable, and the contact 163 and the frame 161 can achieve a more stable relative positioning through the elastic member 164, which improves the reliability of the structure of the contact 163.

In this embodiment, preferably, the third clamping portion 169 is a tenon, and the fourth clamping portion 1610 is a clamping slot. Therefore, the structure of the connection structure between the contact 163 and the frame 161 is simple and the cost is low.

In this embodiment, preferably, a groove 1611 is further formed on the elastic member 164. The groove 1611 extends along the circumference of the connecting hole 167 to surround the connecting hole 167, and there is a set distance between the groove 1611 and the connecting hole 167. . Therefore, the arrangement of the groove 1611 can reduce the thickness of the elastic member 164 at the position of the groove 1611. Therefore, the elastic force of the elastic member 164 at the position of the groove 1611 is relatively small, and the groove 1611 is along the circumferential direction of the connecting hole 167. Extending and setting around the connecting hole 167, when the contact 163 is pressed, it can cause greater deformation of the elastic member 164, making the movement of the contact 163 in the first direction more flexible and free, and ensuring that the contact 163 can act under pressure. The lower part can be in contact with the contact 162, which further improves the reliability and safety of the structure of the contact 163.

In this embodiment, preferably, the elastic member 164 is a silicone member. The silicone element itself has elasticity, and can play a role in sealing the contact 163 and the contact 162, and can also buffer the movement of the contact 163 relative to the frame 161. Improve the reliability of the structure of the contact 163.

In this embodiment, preferably, the contact structure further includes a circuit board, the circuit board is connected to the frame 161, and the contact 162 is an elastic piece on the circuit board. Therefore, when the contact 163 is in contact with the elastic piece, the elastic piece can play a buffering effect to prevent damage to the circuit board.

An embodiment of the present invention provides an electronic device, including an electronic device main body and the contact 163 structure according to any embodiment of the present invention. The electronic device main body is connected to the frame 161, and the contact 162 is electrically connected to the circuit of the electronic device main body.

When the electronic device in this embodiment needs to be connected to an electrical connection terminal of an external electronic device, the connection terminal of the external electronic device will contact the contact 163 and apply pressure to the contact 163, and at the same time, the elastic member 164 will also be subjected to The pressure extends toward the contact 162 in the first direction, so that the contact 163 and the contact 162 are in contact and electrically connected, thereby electrically connecting the electronic device and the external electronic device. When the electronic device is separated from the external electronic device, the elastic member 164 drives the contact 163 to reset back to the contact member 162 in the first direction under the elastic action and position the contact 163 relative to the frame 161. At this time, the contact 163 and The contact 162 maintains a set distance in the first direction. Since the contact 163 and the contact 162 are kept at a set distance in the first direction, the contact 163 and the contact 162 are not conductive, which prevents the exposed contact 163 from forming a closed inside in the case of external water seepage or metal overlap. The internal battery power loss and circuit damage of the electronic device caused by the circuit improve the reliability and safety of the structure of the contact 163. At the same time, the contact 163 is connected to the frame 161 through the elastic member 164. When the contact 163 moves relative to the frame 161, the elastic member 164 can produce a certain buffering effect, preventing the contact 163 and the contact 162 from violently colliding, and improving the reliability of the use of electronic equipment. Sex.

The above are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

A contact, characterized in that the contact includes a magnetic part and a conductive layer, the conductive layer is on the outside of the magnetic part, the magnetic part is arranged on a circuit board, and the conductive layer is connected to the circuit The board is electrically connected.
The contact according to claim 1, wherein the magnetic member comprises a first base and a contact, the base and the contact are both cylindrical, the contact is connected to the base, and the base Extending in the same direction as the axis of the contact, the diameter of the base is larger than the diameter of the contact, and the bottom surface of the base is connected to the circuit board.
The contact according to claim 2, wherein the base and the contact are both cylindrical.
The contact of claim 2, wherein the base and the contact are coaxial.
The contact according to claim 2, wherein the base and the contact are integrally formed.
The contact according to claim 1, wherein the conductive layer is a plating layer of conductive material, and the conductive layer is formed on an outer surface of the magnetic member.
The contact according to claim 6, wherein the conductive layer is a conductive anticorrosive plating layer.
The contact according to claim 6, wherein the conductive layer comprises an anti-corrosion metal layer, an acid copper layer or an acid nickel layer, a metal barrier layer and an anti-artificial sweat electrolysis metal layer, the conductive anticorrosion layer, acid A copper layer or an acid nickel layer, a metal barrier layer and an anti-artificial sweat electrolytic metal layer are sequentially formed on the outer surface of the magnetic member.
The contact according to claim 8, wherein the corrosion-resistant metal layer is a coke copper plating layer or a neutral nickel plating layer.
The contact according to claim 9, wherein the thickness of the corrosion-resistant metal layer ranges from 8 μm to 10 μm.
The contact according to claim 8, wherein the thickness of the acid copper layer ranges from 18 μm to 20 μm.
The contact according to claim 8, wherein the outermost layer of the conductive layer is a plating layer that has been sealed.
The contact according to claim 1, wherein the conductive layer is a metal shell, a receiving cavity is formed in the metal shell, and the magnetic member is arranged in the receiving cavity.
The contact according to claim 13, wherein the metal shell comprises a barrel-shaped main body and a second base, the receiving cavity is formed in the barrel-shaped main body, and an opening is formed at the bottom of the barrel-shaped main body. Part, the second base is formed at the edge of the opening part.
The contact according to claim 14, wherein the second base is ring-shaped and coaxial with the barrel-shaped main body, and the outer diameter of the second base is larger than the outer diameter of the barrel-shaped main body , The bottom surface of the second base is welded and fixed to the circuit board so that the metal shell is electrically connected to the circuit board.
The contact according to claim 15, wherein the magnetic member is closely attached to the inner wall of the barrel-shaped body.
The contact according to claim 13, wherein the metal shell is a copper alloy shell.
The contact according to claim 13, wherein a conductive anticorrosive coating is formed on the outer surface of the metal shell.
The contact according to claim 7 or 18, wherein the conductive anticorrosive plating layer is a gold plating layer.
The contact according to claim 13, wherein a first plating layer is formed on the surface of the magnetic member, and a second plating layer is formed on the surface of the metal shell.
The contact according to claim 20, wherein the first plating layer is a coke copper layer and a nickel layer in order from the inside to the outside.
The contact according to claim 21, wherein the thickness of the burnt copper layer is in the range of 18 μm-20 μm, and the thickness of the nickel layer is in the range of 5 μm-8 μm.
The contact according to claim 20, wherein the second plating layer is an acid copper layer or an acid nickel layer, a metal barrier layer, and an anti-artificial sweat electrolytic metal layer in order from the inside to the outside.
The contact according to claim 23, wherein the thickness of the acid copper layer ranges from 3 μm to 5 μm.
The contact according to claim 20, wherein the outermost layer of the first plating layer and the outermost layer of the second plating layer are plating layers that have been sealed.
The contact according to claim 8 or 23, wherein the anti-artificial sweat electrolytic metal layer is a rhodium plating layer, a ruthenium plating layer, or a rhodium ruthenium alloy plating layer.
The contact according to claim 25 or 26, wherein the thickness of the anti-artificial sweat electrolysis metal layer ranges from 0.75 μm to 1 μm.
The contact according to claim 8 or 23, wherein the metal barrier layer is palladium plating, platinum plating, palladium-cobalt alloy plating, palladium-platinum alloy plating, palladium-silver alloy plating, palladium-gold alloy plating, or palladium Indium alloy coating.
The contact according to claim 27 or 28, wherein the thickness of the metal barrier layer ranges from 0.6 m to 1 m.
The contact according to claim 8 or 23, wherein an anti-oxidation metal layer is further provided between the acid copper layer and the metal barrier layer.
The contact according to claim 30, wherein the anti-oxidation metal layer is a silver plating layer, a tin-silver alloy plating layer, or a copper-tin-zinc alloy plating layer.
The contact according to claim 30 or 31, wherein the thickness of the anti-oxidation metal layer ranges from 2 μm to 4.5 μm.
The contact according to claim 8 or 23, wherein a conductive metal layer is further provided between the metal barrier layer and the anti-artificial sweat electrolysis metal layer.
The contact according to claim 33, wherein the conductive metal layer is a silver plating layer, a tin-silver alloy plating layer, a copper-tin-zinc alloy plating layer, or a gold plating layer.
The contact according to claim 33 or 34, wherein the thickness of the conductive metal layer ranges from 0.5 μm to 0.75 μm.
The contact according to claim 8 or 23, wherein an easy-to-weld metal layer is formed outside the anti-artificial sweat electrolysis metal layer.
The contact according to claim 36, wherein the solderable metal plating layer is a gold plating layer, a tin plating layer, a copper-tin-zinc alloy plating layer, or a tin-silver alloy plating layer.
The contact according to claim 36 or 37, wherein the thickness of the easily solderable metal layer ranges from 0.125 μm to 0.25 μm.
The contact according to any one of claims 1-38, wherein the magnetic member is a neodymium iron boron magnet or a samarium cobalt magnet.
A contact structure, characterized in that the contact structure includes:

frame;

A contact piece connected to the frame; and

The contact according to any one of claims 1-39;

Wherein, the contact is connected to the frame through an elastic member, and the elastic member is used to apply an elastic force to the contact to position the contact relative to the frame, and to make the contact and the contact The element has a set distance in the first direction, and the elastic element stretches along the first direction under the action of an external force so that the contact can contact the contact element and form an electrical connection.
The contact structure according to claim 40, wherein a cavity is formed in the frame, the contact member is located in the cavity, and the elastic member closes the gap between the contact and the frame to Seal the cavity.
The contact structure according to claim 40, wherein a first clamping portion is formed on the contact, the first clamping portion extends along the circumferential direction of the contact, and the elastic member is A plate shape, a connecting hole and a second clamping portion are formed on the elastic member, the second clamping portion is arranged at the edge of the connecting hole and extends along the circumferential direction of the connecting hole, the first The clamping portion and the second clamping portion are connected in a clamping manner.
42. The contact structure according to claim 42, wherein the first clamping portion is a tenon, and the second clamping portion is a clamping slot.
The contact structure according to claim 42, wherein a third clamping portion is formed on the outer edge of the elastic member, a fourth clamping portion is formed on the frame, and the third clamping portion and The fourth clamping part clamps the connection.
The contact structure according to claim 44, wherein the third clamping portion is a tenon, and the fourth clamping portion is a clamping slot.
The contact structure according to claim 42, wherein a groove is further formed on the elastic member, the groove extends in the circumferential direction of the connecting member to surround the connecting hole, and the groove There is a set distance between the groove and the connecting hole.
The contact structure according to any one of claims 40-46, wherein the elastic member is a silicone member.
The contact structure according to any one of claims 40-46, wherein the elastic member is an elastic piece on the circuit board.
An electronic device, characterized in that, the electronic device includes:

The main body of the electronic equipment; and

The contact according to any one of claims 1-39 or the contact structure according to any one of claims 40-48.
A charging device, characterized in that, the charging device includes:

The main body of the charging device; and

The contact according to any one of claims 1-39 or the contact structure according to any one of claims 40-48.