JPS6022845U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6022845U
JPS6022845U JP1983114261U JP11426183U JPS6022845U JP S6022845 U JPS6022845 U JP S6022845U JP 1983114261 U JP1983114261 U JP 1983114261U JP 11426183 U JP11426183 U JP 11426183U JP S6022845 U JPS6022845 U JP S6022845U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
aluminum
semiconductor device
expansion coefficient
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983114261U
Other languages
English (en)
Inventor
三好　明男
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to JP1983114261U priority Critical patent/JPS6022845U/ja
Publication of JPS6022845U publication Critical patent/JPS6022845U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の構成を示す断面図、第２図
は本考案の半導体装置の構成を示す正面図、第３図は同
じく本考案半導体装置の斜視図である。 １・・・セラミック基板、５−・・リードピン、７・・
・放熱フィン、８・・・線膨張係数α４〜１０　Ｘ　１
０−６／’Ｃの伝熱板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が固着されたセラミック基板の背面全面に線
    膨張係数αが４〜ＩＯＸ　１０−６／’　Ｃの伝熱板を
    介してアルミニウム又はアルミニウム合金製放熱フィン
    が取付けられている半導体装置。
JP1983114261U 1983-07-25 1983-07-25 半導体装置 Pending JPS6022845U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983114261U JPS6022845U (ja) 1983-07-25 1983-07-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983114261U JPS6022845U (ja) 1983-07-25 1983-07-25 半導体装置

Publications (1)

Publication Number Publication Date
JPS6022845U true JPS6022845U (ja) 1985-02-16

Family

ID=30264189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983114261U Pending JPS6022845U (ja) 1983-07-25 1983-07-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS6022845U (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6220558U (ja) * 1985-07-20 1987-02-06
JPS6220555U (ja) * 1985-07-20 1987-02-06
JPS6220557U (ja) * 1985-07-20 1987-02-06
JPS63150556U (ja) * 1987-03-24 1988-10-04
JPH03231610A (ja) * 1990-02-08 1991-10-15 Tooin Kk 商品表示および陳列装置
JPH05220033A (ja) * 1992-04-28 1993-08-31 Tooin Kk 商品陳列棚の仕切板およびその係止装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6220558U (ja) * 1985-07-20 1987-02-06
JPS6220555U (ja) * 1985-07-20 1987-02-06
JPS6220557U (ja) * 1985-07-20 1987-02-06
JPH0216698Y2 (ja) * 1985-07-20 1990-05-09
JPH0226383Y2 (ja) * 1985-07-20 1990-07-18
JPS63150556U (ja) * 1987-03-24 1988-10-04
JPH03231610A (ja) * 1990-02-08 1991-10-15 Tooin Kk 商品表示および陳列装置
JPH0712329B2 (ja) * 1990-02-08 1995-02-15 トーイン株式会社 商品表示および陳列装置
JPH05220033A (ja) * 1992-04-28 1993-08-31 Tooin Kk 商品陳列棚の仕切板およびその係止装置

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