JPS60221585A - ニツケル酸化被膜除去方法 - Google Patents

ニツケル酸化被膜除去方法

Info

Publication number
JPS60221585A
JPS60221585A JP7665784A JP7665784A JPS60221585A JP S60221585 A JPS60221585 A JP S60221585A JP 7665784 A JP7665784 A JP 7665784A JP 7665784 A JP7665784 A JP 7665784A JP S60221585 A JPS60221585 A JP S60221585A
Authority
JP
Japan
Prior art keywords
oxide film
nickel
lead
chemical polishing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7665784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123554B2 (enExample
Inventor
Yutaka Okuaki
奥秋　裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP7665784A priority Critical patent/JPS60221585A/ja
Publication of JPS60221585A publication Critical patent/JPS60221585A/ja
Publication of JPH0123554B2 publication Critical patent/JPH0123554B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP7665784A 1984-04-18 1984-04-18 ニツケル酸化被膜除去方法 Granted JPS60221585A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7665784A JPS60221585A (ja) 1984-04-18 1984-04-18 ニツケル酸化被膜除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7665784A JPS60221585A (ja) 1984-04-18 1984-04-18 ニツケル酸化被膜除去方法

Publications (2)

Publication Number Publication Date
JPS60221585A true JPS60221585A (ja) 1985-11-06
JPH0123554B2 JPH0123554B2 (enExample) 1989-05-02

Family

ID=13611474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7665784A Granted JPS60221585A (ja) 1984-04-18 1984-04-18 ニツケル酸化被膜除去方法

Country Status (1)

Country Link
JP (1) JPS60221585A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7320940B2 (en) * 2003-09-24 2008-01-22 Denso Corporation Method for manufacturing electronic device including package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7320940B2 (en) * 2003-09-24 2008-01-22 Denso Corporation Method for manufacturing electronic device including package

Also Published As

Publication number Publication date
JPH0123554B2 (enExample) 1989-05-02

Similar Documents

Publication Publication Date Title
KR101089201B1 (ko) 도체 기재, 반도체 장치 및 이들의 제조 방법
JP2007524996A (ja) 銅コンタクトを有する集積回路ダイおよび該集積回路ダイのための方法
JPS6178141A (ja) 集積回路のための銅突起形成方法
US8012886B2 (en) Leadframe treatment for enhancing adhesion of encapsulant thereto
JPH03504659A (ja) 銅含有リードフレームに対するプラスチック封入体の粘着度を向上させる方法
US4767049A (en) Special surfaces for wire bonding
US4800178A (en) Method of electroplating a copper lead frame with copper
CN109075150B (zh) 引线框结构，引线框式表面粘着型电子装置及其制造方法
JPS60221585A (ja) ニツケル酸化被膜除去方法
US5632438A (en) Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization
JPH10298788A (ja) 銅または銅合金の変色防止液並びに変色防止方法
JP3484367B2 (ja) 無電解めっき方法およびその前処理方法
JP6873311B2 (ja) 半導体素子及びその製造方法
JPS6138187Y2 (enExample)
JPS62173748A (ja) 半導体用リ−ドフレ−ムの製造方法
JP3748372B2 (ja) 配線基板の製造方法
JP3918462B2 (ja) 配線基板の製造方法
JPH06260741A (ja) 金属ベース回路基板の製造方法
JPH05175654A (ja) プリント配線板の基板表面処理方法
JPH11150355A (ja) セラミック基板のめっき方法
JP4307473B2 (ja) 導体基材及び半導体装置の製造方法
JP3214066B2 (ja) 回路導体の処理方法
JPH04215463A (ja) ガラス封止パッケージ端子へのメッキ方法
JPS6345895A (ja) アルミニウム回路基板材の製造方法
JPS62252343A (ja) ガラスの金属化方法