JPS60219794A - Hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

TECHNICAL FIELD OF THE INVENTION This invention relates to a hybrid integrated circuit having conductors for piezoelectric wiring on both sides of a substrate.

[Prior art]

Conventional hybrid integrated circuit and C, Figures 1 and 2
There is one shown in the figure.

FIG. 1 is a diagram showing one side of a conventional hybrid integrated circuit, and FIG. 2 is a diagram showing the other side.

In FIGS. 1 and 2, 1o is a ceramic substrate,
11a is a chip transistor, 11b is a chip capacitor, 11c is a semiconductor chip which is a mini-mold type monolithic IC, 12 is an electric wiring conductor, 13 is an external lead layer, and 14 is this external lead #i! 13 is a terminal connected to the electrical wiring conductor 12; 15 is a semiconductor chip w4Ji directly attached to the substrate 10; 16 is a resin for Fk; 16 is electrical wiring on the surface shown in the figure and the surface shown in FIG. The through hole 11 connecting the conductor 12' is a thick film resistor printed on the substrate 10.

In a hybrid integrated circuit using a board 10 with double-sided wiring,
As shown in FIG. 2, the chip transistor 11a
, a chip capacitor 11b, a semiconductor chip 11c such as a mini-mold IC, a semiconductor chip protected by resin 15, and a thick film resistor 1T printed on the substrate 10 are placed on both sides of the substrate 100, which has electrical wiring on both sides. It is listed on the tower. In order to connect each of the elements 7 arranged on both sides of the board 100 to the necessary circuits, it is necessary to connect the electrical wiring conductors 12 on the side shown in Figure 1 and the side shown in Figure 2 of the board 10. . Conventionally, the surface shown in FIG. 1 and the surface shown in FIG. The wiring between them was connected.

As mentioned above, through holes 16 have been used in conventional hybrid integrated circuits that lack electrical wiring conductors 12 on both sides.

If through holes 16 are used in the substrate 10 for hybrid integrated circuits, the number of manufacturing steps for the substrate 10 will increase, and the printing position of each step between both sides of the substrate must be precisely aligned. The disadvantage was that the cost of the substrate increased significantly compared to the conventional method. In addition, the substrate 1. OK
When using ceramic board, through hole 1 is made on board 10.
It is difficult to drill 6Y, and it must be used exclusively for ceramic dandruff with holes, which is one of the causes of high prices and long construction times.

[Summary of the invention]

This invention was made in order to eliminate the above-mentioned drawbacks, and by providing a hybrid integrated circuit Y that can obtain the necessary circuit connections without using through holes in a double-sided wiring hybrid integrated circuit. be. Below, this yABA'
15 using drawings with VC! [Example of the invention] Figures 3 and 4 show an example of this invention.
0 to 1.7 ii Since this is the same as in Figures 1a and 2, the explanation will be omitted. 21 is a conductor 12' for electrical wiring on the surface shown in FIG. 3 and the surface shown in FIG. This is the connection terminal to be connected. In the hybrid integrated circuit shown in FIGS. 3 and 4, in which electrical wiring is provided on both sides of the substrate 10, the chip transistor 11a
, chip capacitor 11b, semiconductor chip 11C1 resin 15. 17'%' of thick film resistors are mounted on both sides of the substrate 100. In this embodiment, a nil chip transistor 11a, a chip capacitor 11b, and a semiconductor chip 11 are used.
c. 12 conductors for electrical wiring on both sides of the substrate 100 connected to the thick film resistor 1T, connecting terminals 22 arranged around the substrate 10 and conductive clips 21 for shorting. The external lead connection terminal 14 is connected to the external lead wire 13 to obtain the necessary circuit connection.

In the above embodiment, a chip transistor 11a and a chip capacitor 11b are provided on one side of the substrate 10.

Although the semiconductor chip 11C2 resin 15 is shown with a thick film resistor 17"k mounted on the other side, chip transistors 11a, chip capacitors 11b,
The semiconductor chip 11c, resin 15° thick film resistor 17 may be mixed and mounted on a tower.

Further, on one side of the substrate 100, a chip transistor 11a, a chip capacitor 11b, a semiconductor chip 11C1 and a resin 15 are provided.
．． The thick film resistor 177 may be mounted on the other surface, and only the electrical wiring conductor 12 may be provided on the other surface.

〔Effect of the invention〕

As explained in detail above, the present invention consists of a board made of an insulating material, a plurality of parts mounted on both sides of the board, and conductors for each electric wiring connected to each part on the board. In the hybrid integrated circuit configured, a conductive clip is provided to connect the electrical wiring conductors on both sides of the substrate and make an electrical connection between the two sides. There is an advantage of being able to use a highly productive board.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing one side of a conventional hybrid integrated circuit using a double-sided substrate, FIG. 92 is a schematic diagram showing the other side of the conventional hybrid integrated circuit, and FIG. FIG. 4 is a schematic diagram showing one side of the hybrid integrated circuit according to the device, and FIG. 4 is a schematic diagram showing the other side of the hybrid integrated circuit. In the figure, 10 is a substrate, 11a is a chip transistor, 11
b is a chip capacitor, 11e is a semiconductor chip, 12 is an electrical wiring conductor, 13 is an external lead wire, 14 is a terminal, 1
5 is a resin, 1T is a thick film resistor, 21 is a conductive clip,
22 is a connection terminal. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1

Claims (1)

[Claims] A hybrid integrated circuit consisting of a substrate made of an insulating material, a plurality of components mounted on both sides of the substrate, and electrical wiring conductors connected to each of the components on the substrate,
A hybrid integrated circuit characterized in that conductive clips are provided for coupling the electrical wiring conductors on both surfaces of the substrate to establish an electrical connection between the two surfaces.