JPS6193694A - Ic device - Google Patents

Ic device

Info

Publication number
JPS6193694A
JPS6193694A JP21541684A JP21541684A JPS6193694A JP S6193694 A JPS6193694 A JP S6193694A JP 21541684 A JP21541684 A JP 21541684A JP 21541684 A JP21541684 A JP 21541684A JP S6193694 A JPS6193694 A JP S6193694A
Authority
JP
Japan
Prior art keywords
ic device
ic
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21541684A
Inventor
Masakazu Matsuyama
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP21541684A priority Critical patent/JPS6193694A/en
Publication of JPS6193694A publication Critical patent/JPS6193694A/en
Application status is Pending legal-status Critical

Links

JP21541684A 1984-10-15 1984-10-15 Ic device Pending JPS6193694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21541684A JPS6193694A (en) 1984-10-15 1984-10-15 Ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21541684A JPS6193694A (en) 1984-10-15 1984-10-15 Ic device

Publications (1)

Publication Number Publication Date
JPS6193694A true JPS6193694A (en) 1986-05-12

Family

ID=16671968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21541684A Pending JPS6193694A (en) 1984-10-15 1984-10-15 Ic device

Country Status (1)

Country Link
JP (1) JPS6193694A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327053U (en) * 1986-08-07 1988-02-22
JPS63296292A (en) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp Semiconductor device
WO1999024896A1 (en) * 1997-11-06 1999-05-20 Hitachi, Ltd. Information processor
JP2014027216A (en) * 2012-07-30 2014-02-06 Renesas Electronics Corp Semiconductor device and manufacturing method of the same
JP2014528652A (en) * 2011-10-03 2014-10-27 インヴェンサス・コーポレイション Stub minimized by offsetting the terminal grid from the center of the package
JP2014528650A (en) * 2011-10-03 2014-10-27 インヴェンサス・コーポレイション Stub minimized for multi-die wire bond assemblies with orthogonal windows
JP2014535165A (en) * 2011-10-03 2014-12-25 インヴェンサス・コーポレイション Stub minimized with no wire bonds to the package board assembly
WO2016068264A1 (en) * 2014-10-31 2016-05-06 川崎重工業株式会社 Control circuit board and robot control device
US9460758B2 (en) 2013-06-11 2016-10-04 Invensas Corporation Single package dual channel memory with co-support
US9679838B2 (en) 2011-10-03 2017-06-13 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
US9679876B2 (en) 2011-10-03 2017-06-13 Invensas Corporation Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications
US10026467B2 (en) 2015-11-09 2018-07-17 Invensas Corporation High-bandwidth memory application with controlled impedance loading
US10032752B2 (en) 2011-10-03 2018-07-24 Invensas Corporation Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327053U (en) * 1986-08-07 1988-02-22
JPS63296292A (en) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp Semiconductor device
WO1999024896A1 (en) * 1997-11-06 1999-05-20 Hitachi, Ltd. Information processor
US10090280B2 (en) 2011-10-03 2018-10-02 Invensas Corporation Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
JP2014528652A (en) * 2011-10-03 2014-10-27 インヴェンサス・コーポレイション Stub minimized by offsetting the terminal grid from the center of the package
JP2014528650A (en) * 2011-10-03 2014-10-27 インヴェンサス・コーポレイション Stub minimized for multi-die wire bond assemblies with orthogonal windows
JP2014534624A (en) * 2011-10-03 2014-12-18 インヴェンサス・コーポレイション Stub minimize wirebond assembly of multi-die having parallel windows
JP2014535165A (en) * 2011-10-03 2014-12-25 インヴェンサス・コーポレイション Stub minimized with no wire bonds to the package board assembly
JP2015502652A (en) * 2011-10-03 2015-01-22 インヴェンサス・コーポレイション Stub minimized with no wire bonds to the package board assembly
US10032752B2 (en) 2011-10-03 2018-07-24 Invensas Corporation Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
US9679838B2 (en) 2011-10-03 2017-06-13 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
US9679876B2 (en) 2011-10-03 2017-06-13 Invensas Corporation Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
JP2014027216A (en) * 2012-07-30 2014-02-06 Renesas Electronics Corp Semiconductor device and manufacturing method of the same
US9460758B2 (en) 2013-06-11 2016-10-04 Invensas Corporation Single package dual channel memory with co-support
JP2016092111A (en) * 2014-10-31 2016-05-23 川崎重工業株式会社 Control circuit board and robot control device
CN107107341A (en) * 2014-10-31 2017-08-29 川崎重工业株式会社 Control circuit board and robot control device
WO2016068264A1 (en) * 2014-10-31 2016-05-06 川崎重工業株式会社 Control circuit board and robot control device
US10251275B2 (en) 2014-10-31 2019-04-02 Kawasaki Jukogyo Kabushiki Kaisha Control circuit board and robot control device
US10026467B2 (en) 2015-11-09 2018-07-17 Invensas Corporation High-bandwidth memory application with controlled impedance loading
US9928883B2 (en) 2016-05-06 2018-03-27 Invensas Corporation TFD I/O partition for high-speed, high-density applications
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications

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