JPS6193694A - Ic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an integrated circuit device used in electronic equipment.

Conventional configurations and their problems In recent years, integrated circuit devices have been developed using various types of electronics, 5. Container: Used. Furthermore, as equipment becomes more complex, more sophisticated implementation is required.

The mounting of conventional integrated circuit elements will be described below with reference to the drawings.

FIG. 1 shows wiring between memory elements when memory elements are mounted on both sides of a printed circuit board.

In FIG. 1, 1 and 4 are memory elements, 2 is an address signal of the memory element 1, and 3 is a printed circuit board on which the memory element 1 is mounted and constitutes a circuit. Note that this first
In the figure, memory element 1. ．． 4 is drawn floating above and below the printed circuit board 3 in order to easily illustrate the wiring connections, but it is actually mounted on the front and back surfaces of the printed circuit board 3.

When a memory circuit is constructed using a plurality of memory elements in this manner, all address signal sources 2 are normally connected in parallel and tangentially. That is, in FIG. 1, for example, terminal numbers 1 and 2
, 3.4'i respectively as address signal terminals, connect one terminal of the memory element 1 on the front side of the printed circuit board 3 to one terminal of the memory element 4 on the back side, and Wires are made from two terminals of the memory element 1 to two terminals of the memory element 4 on the back surface of the printed circuit board 3, and in the same way, 3 terminals are connected to 3 terminals, and 4 terminals are connected to 4 terminals, respectively.

However, in the above method, since the address signals W2 intersect with each other, the packaging density cannot be increased and the wiring length becomes long.

Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides a method for high-density mounting by eliminating the need for wiring to cross each other when terminals having the same function are connected to each other in integrated circuit elements mounted on the front and back surfaces of a printed circuit board. The present invention provides an integrated circuit device that has the shortest wiring length possible.

Structure of the Invention In order to achieve this object, the present invention configures the terminal wiring of the first integrated circuit element in a mirror image relationship with the terminal arrangement of the second integrated circuit element.

Description of a practical example A practical example of the present invention will be described below with reference to the drawings.

In FIG. 2, 11 is a memory element, 12 is an address signal line, and 13 is a printed circuit board, which are the same as 1, 2, . ．． These are the same as those shown in 3. Further, 14 is a memory element whose terminal arrangement is a mirror image of the memory element 11 and has the same function as the memory element 11.

In this example, a memory element 11 and an integrated circuit element 1
4, when terminals having the same function are connected to each other, the terminals of the memory element 11 and the integrated circuit element 14 are mirror images of each other.
and terminal 16 of integrated circuit element 4 have the same function, and similarly, terminal 2 of memory element 1 and terminal 15 of integrated circuit element 4 have the same function.
, terminal 3 of memory element 1 and terminal 14 of integrated circuit element 4,
Terminal 4 of memory element 1 and terminal 13 of integrated circuit element 4 serve the same function. When these terminals having the same function are connected to each other, as is clear from FIG. 2, the address signal lines 2, which are the connection lines, do not cross each other.

As a result, the wiring length can be shortened and the mounting difficulty can be increased.

Note that the actual sister example above used a memory element, but
It can also be applied to other devices as long as they are integrated circuits. Moreover, the same effect can be obtained not only when the integrated circuit element is provided on both the front and back surfaces of the printed circuit board 13, but also when it is used close to one surface.

Effects of the Invention As is clear from the above description, the present invention provides a second integrated circuit element package having a terminal arrangement mirror-like with the terminal arrangement of the first integrated circuit element. When used in close proximity to each other or mounted on both sides of a printed circuit board, terminals having the same function in each integrated circuit element can be connected to each other without having their wiring cross each other. As a result, high-density packaging is possible and the wiring length is minimized, which has great effects.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a conventional integrated circuit device, and FIG. 2 is an exploded perspective view of an integrated circuit device according to an embodiment of the present invention. 11.14...Memory element, 12...Address signal win, 3...Printed circuit board. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2

Claims (2)

[Claims] (1) having a first integrated circuit element and a second integrated circuit having a terminal arrangement that is a mirror image of the terminal arrangement of the first integrated circuit; An integrated circuit device characterized by being mounted on the same printed circuit board. (2) The integrated circuit device according to claim 1, wherein the first integrated circuit is mounted on one side of a printed circuit board and the second integrated circuit is mounted on the other side.