JPS60105291A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a hybrid integrated circuit device having a complete degree of integration.

[Prior art]

Hybrid integrated circuit devices are generally constructed by mounting circuit components on an integrated circuit board in which passive elements such as circuit conductors and resistors are formed on an insulating substrate.Recently, hybrid integrated circuits are becoming more and more compact and highly integrated. As the demands for devices increase, semiconductor integrated circuit elements 2 (hereinafter referred to as ICs) are placed on the front and back surfaces of a single integrated circuit board 1 as shown in FIG.
(referred to as element), chip capacitor 3. Products are manufactured that are equipped with circuit components consisting of small molded components 4 such as transistors and diodes. However, forming all circuit conductors and passive elements on both sides of a single insulating substrate 1 complicates the manufacturing process, resulting in poor yields and making the integrated circuit board extremely expensive, which is disadvantageous. Furthermore, it is extremely difficult to attach the IC elements 2'f to both sides of the integrated circuit board 1 because it requires a special support mold to protect the IC elements 2. Reference numeral 5 is a lead terminal.

As shown in FIG. 2, the two integrated circuit boards 1a, lb'i on which circuit components are mounted are glued together, and a conductive pin 7 is inserted into the through hole 6 of each of the opposing integrated circuit boards 1a, tb.
A method of manufacturing a hybrid integrated circuit device by electrically connecting the two integrated circuit boards has been used.However, in the hybrid integrated circuit device manufactured by this method, a conductive pin 7 is used to connect two integrated circuit boards. For this reason, the diameter of the through hole 6 becomes large, and the soldering of the conductive bottle 7 requires the entire area, so there is a drawback that the degree of integration cannot be improved. Furthermore, soldering of the Vc conduction pin 7 to the integrated circuit board must be done manually, which is inefficient, and soldering is also disadvantageous in that it is prone to defects.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks, and to provide a highly reliable hybrid integrated circuit device with an improved degree of integration at a low cost.

[Structure of the invention]

The hybrid integrated circuit device of the present invention is comprised of two integrated circuit boards with heavy circuit parts mounted on the front surface and their back surfaces glued together. They are connected by a conductive material provided on the body through-hole.

[Explanation of Examples] Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a sectional view of one embodiment of the invention.

On the surfaces of two integrated circuit boards 1a and 1b on which passive elements such as circuit conductors and resistors are formed, there are IC elements 2.degree. chip capacitors 3. Circuit components such as small molded components 4 are mounted on these two integrated circuit boards 1a and 1b (D back surfaces are glued together and fixed by lead terminals 5 connected to the ends). Furthermore, these two integrated circuit boards 1a, l
The conductors 8, 8' in the through holes provided at opposite positions of b are electrically connected by conductive material 9 provided on the through holes.

As this conductive substance, a conductive paste or a conductive thin pattern can be used. When using conductive paste,
A conductive paste is formed on the through-holes on the back side of the integrated circuit board on which circuit components are mounted by H-printing method, etc., and after the two integrated circuit boards are glued together, heat treatment is performed for about 150 minutes and 0.30 minutes to make it volatile. remove the substance; After that, lead terminals are attached and the two integrated circuit boards are fixed to complete the hybrid integrated circuit device.

In a hybrid integrated circuit device configured in this way, the connection between the upper and lower integrated circuit boards is made by conductors in each opposing through-hole through a conductive material. Since no area is required for soldering, the degree of integration increases. Furthermore, since manual soldering of the conductive bottle is no longer required, reliability is improved and yield is improved.

〔Effect of the invention〕

As explained in detail above, in accordance with the invention, the back sides of two integrated circuit boards are glued together, and the conductors in the through holes are filled with a conductive material! ll connection, it is possible to obtain a hybrid integrated circuit device with improved integration and reliability at a low cost, so the effect is large.

[Brief explanation of the drawing]

Figure 1 is a side view of an example of a conventional hybrid integrated circuit device, Figure 2 is a sectional view of another example of a conventional hybrid integrated circuit device, and Figure 3 is a cross-sectional view of another example of a conventional hybrid integrated circuit device.
The figure is a sectional view of one embodiment of the present invention. 1.1a, 1b... integrated circuit board, 2...
...IC element, 3...Chip capacitor% 4
・・・・・・Small molded parts, Bottom: Lead terminal, 6: Through hole, 7: Conductive bottle, 8.8': Conductive Body, 9. Output: Conductive substance.

Claims (1)

[Claims] In a hybrid integrated circuit device constructed by joining the back surfaces of two integrated circuit boards with circuit components mounted on the front surfaces, the above-mentioned 2.
1. A hybrid integrated circuit device, characterized in that conductors in through holes provided at opposing positions of two integrated circuit boards are connected by a conductive material provided on the through holes.