JPS6021591A - 導電回路の製造方法 - Google Patents
導電回路の製造方法Info
- Publication number
- JPS6021591A JPS6021591A JP13058183A JP13058183A JPS6021591A JP S6021591 A JPS6021591 A JP S6021591A JP 13058183 A JP13058183 A JP 13058183A JP 13058183 A JP13058183 A JP 13058183A JP S6021591 A JPS6021591 A JP S6021591A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- conductive
- cured coating
- resin
- copper powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 63
- 229910052802 copper Inorganic materials 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 4
- 239000003929 acidic solution Substances 0.000 claims description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 18
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000000654 additive Substances 0.000 description 14
- 239000003973 paint Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 230000000996 additive effect Effects 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- CCFAKBRKTKVJPO-UHFFFAOYSA-N 1-anthroic acid Chemical compound C1=CC=C2C=C3C(C(=O)O)=CC=CC3=CC2=C1 CCFAKBRKTKVJPO-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- NXYLTUWDTBZQGX-UHFFFAOYSA-N ctk8h6630 Chemical compound C1=CC=C2C=C3C(N=C4C=CC=5C(C4=N4)=CC6=CC=CC=C6C=5)=C4C=CC3=CC2=C1 NXYLTUWDTBZQGX-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 241000430525 Aurinia saxatilis Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- -1 anthracene derivative copper compound Chemical class 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13058183A JPS6021591A (ja) | 1983-07-17 | 1983-07-17 | 導電回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13058183A JPS6021591A (ja) | 1983-07-17 | 1983-07-17 | 導電回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021591A true JPS6021591A (ja) | 1985-02-02 |
| JPH0358196B2 JPH0358196B2 (enrdf_load_stackoverflow) | 1991-09-04 |
Family
ID=15037633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13058183A Granted JPS6021591A (ja) | 1983-07-17 | 1983-07-17 | 導電回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021591A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6289179U (enrdf_load_stackoverflow) * | 1985-11-22 | 1987-06-08 | ||
| JPS62163387A (ja) * | 1986-01-14 | 1987-07-20 | 株式会社 アサヒ化学研究所 | 基板に蓄電回路を形成する方法 |
| JPH03141683A (ja) * | 1989-10-27 | 1991-06-17 | Furukawa Electric Co Ltd:The | プリント配線板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4865461A (enrdf_load_stackoverflow) * | 1971-12-16 | 1973-09-08 | ||
| JPS56142698A (en) * | 1980-04-08 | 1981-11-07 | Sumitomo Electric Industries | Method of forming conductive circuit |
| JPS5790995A (en) * | 1980-11-27 | 1982-06-05 | Asahi Kagaku Kenkyusho | Method of producing printed circuit |
| JPS57122597A (en) * | 1981-01-23 | 1982-07-30 | Hitachi Ltd | Method of producing conductive pattern of printed circuit board |
-
1983
- 1983-07-17 JP JP13058183A patent/JPS6021591A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4865461A (enrdf_load_stackoverflow) * | 1971-12-16 | 1973-09-08 | ||
| JPS56142698A (en) * | 1980-04-08 | 1981-11-07 | Sumitomo Electric Industries | Method of forming conductive circuit |
| JPS5790995A (en) * | 1980-11-27 | 1982-06-05 | Asahi Kagaku Kenkyusho | Method of producing printed circuit |
| JPS57122597A (en) * | 1981-01-23 | 1982-07-30 | Hitachi Ltd | Method of producing conductive pattern of printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6289179U (enrdf_load_stackoverflow) * | 1985-11-22 | 1987-06-08 | ||
| JPS62163387A (ja) * | 1986-01-14 | 1987-07-20 | 株式会社 アサヒ化学研究所 | 基板に蓄電回路を形成する方法 |
| JPH03141683A (ja) * | 1989-10-27 | 1991-06-17 | Furukawa Electric Co Ltd:The | プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0358196B2 (enrdf_load_stackoverflow) | 1991-09-04 |
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