JPS6020944Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6020944Y2
JPS6020944Y2 JP1979125345U JP12534579U JPS6020944Y2 JP S6020944 Y2 JPS6020944 Y2 JP S6020944Y2 JP 1979125345 U JP1979125345 U JP 1979125345U JP 12534579 U JP12534579 U JP 12534579U JP S6020944 Y2 JPS6020944 Y2 JP S6020944Y2
Authority
JP
Japan
Prior art keywords
external lead
lead terminal
semiconductor device
molded resin
resin part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979125345U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5643170U (enExample
Inventor
倖三 山上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1979125345U priority Critical patent/JPS6020944Y2/ja
Publication of JPS5643170U publication Critical patent/JPS5643170U/ja
Application granted granted Critical
Publication of JPS6020944Y2 publication Critical patent/JPS6020944Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1979125345U 1979-09-10 1979-09-10 半導体装置 Expired JPS6020944Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979125345U JPS6020944Y2 (ja) 1979-09-10 1979-09-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979125345U JPS6020944Y2 (ja) 1979-09-10 1979-09-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS5643170U JPS5643170U (enExample) 1981-04-20
JPS6020944Y2 true JPS6020944Y2 (ja) 1985-06-22

Family

ID=29357235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979125345U Expired JPS6020944Y2 (ja) 1979-09-10 1979-09-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS6020944Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2730888B2 (ja) * 1986-04-28 1998-03-25 三菱電機株式会社 半導体装置
JP5566181B2 (ja) * 2010-05-14 2014-08-06 三菱電機株式会社 パワー半導体モジュールとその製造方法
JP7641862B2 (ja) 2021-09-02 2025-03-07 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS5643170U (enExample) 1981-04-20

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