JPS6020934Y2 - bending equipment - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a bending device, and more particularly to a bending device for external conductors of semiconductor devices such as molded diodes.

Molded diodes, which are generally used in automobile generators, include a resin molding member with a rectangular external shape that surrounds the diode chip and threatens the main body of the molded diode, and a resin molding member that is attached to one surface of the resin molding member from the inside. A support plate for the diode chip that is provided so as to be exposed and serves as an anode and a heat sink, and another surface that faces the surface of the resin sealing member on which this support plate is provided, the tip of which is perpendicular to this surface. In order to efficiently produce the molded diode, a plate-shaped cathode external lead conductor provided in a manner that is transparent is led out from the side surface of the resin sealing member at right angles to one surface of the supporting plate, and then this cathode external lead conductor is By bending the conductor, the conductor is provided so that its leading end stands upright on the other surface of the resin sealing member opposite to one surface on which the support plate is located, as described above.

In such a molded diode, its support plate and the heat sink of the generator are bonded together with solder or the like, and furthermore, the wiring for connecting this to other electrical parts to the cathode external conductor is soldered or the like. It is mounted by being glued.

FIGS. 1a" to 1d are step-by-step plan views showing a conventional bending method using a bending mold such as a punch or die for the cathode external conductor of such a molded diode.

As shown in FIG. 1a, the first resin surface la1 of the rectangular parallelepiped resin sealing member 1a is the bottom surface 2a of the groove 2ai of the holding plate 2.
2 and the side surface 1a3 of the support plate 1a2 is in contact with the groove 2a.
It is guided and held on the side surface 2a3 of l.

In this state, the plate-shaped cathode external lead-out conductor 1b is led out at right angles from the side surface 1a of the resin sealing member 1a, which is perpendicular to the first resin surface 1a1.

Next, a block-shaped die A3 is applied to one surface 1b2 of the cathode external lead-out conductor 1b at approximately the center thereof, and then a punch A4 having an L-shaped recess at the tip is applied so that the die A3 of the cathode external lead-out conductor 1b is in contact with the punch A4. By pressing the cathode external lead-out conductor 1b against the surface 1b3 opposite to the one surface 1b2 that is attached, the tip portion 1b1 of the cathode external conductor 1b is pressed against the resin sealing member 1a.
The supporting plate 1a2 is bent at right angles to the direction in which the supporting plate 1a2 is parallel to the side surface '1a of the support plate 1a2.

Next, as shown in FIG.
The surface 1b of the protrusion 1b5 from the resin sealing member 1a
3, apply a die B5 with a blade-shaped tip to the tip, and then apply a block-shaped punch B6 to one surface lb2 of the cathode external lead-out conductor 1b.
The cathode external lead-out conductor 1b of the first portion 1 between the first bent portion 1h formed by the bending process according to FIG. 1b7 is bent so as to be parallel to the side surface 1a4 of the resin sealing member 1a.

Next, as shown in FIG. 1C, the cathode external lead conductor (1
) A die C7 having a semicircular cross section is applied to the surface 1ba of the protrusion lh of b, and then a block-shaped punch C8 is applied.
is pressed onto one surface (1) of the cathode external lead-out conductor 1b, thereby forming a gap between the second bent portion 1b8 formed by the bending process according to FIG. 1 and the first bent portion 1. The cathode external lead-out conductor 1b of the second portion 1b9 is connected to the second portion 1
A part of b9 on the side toward the first bent portion 1 is the resin sealing member 1
Bend it at right angles toward the resin sealing member 1a so as to be parallel to the second resin surface 1a5 of a.

In this state, the external lead-out conductor 1b has a U-shaped shape near the protrusion 1b, and the second portion 1bQ
approaches the second resin surface 1a5 of the resin sealing member 1a.

Further, the tip portion 1b1 of the cathode external lead-out conductor 1b is perpendicular to the second resin surface la5 of the resin sealing member 1a.

Next, as shown in FIG. 1d, a punch having an L-shaped recess at the tip is used so that the second portion 1b9 of the external conductor 1b comes into close contact with the second resin surface 1a5 of the resin sealing member 1a. Bending of the external conductor 1b is completed by pressing D9 onto the external conductor surface 1b3.

The bending process for conventional molded diodes is
Since this process requires a lot of time, there is a problem that it takes a lot of time and productivity is low.

This invention was made to eliminate the above drawbacks, and includes a bending member that bends the workpiece along the bending die member that is in contact with the workpiece, and a bending die member that is separated from the bent workpiece. The present invention provides a bending device that is equipped with a drive device that can bend the workpiece in one step and that can easily take out the bent workpiece.

FIGS. 2a" to 2h are perspective views showing the state of bending the external cathode conductor of a molded diode using a bending apparatus according to an embodiment of the present invention.

In the figure, the same reference numbers as in FIG. 1 show corresponding parts.

In the figure, 10 is a holding part of a bending device that holds the molded diode 1, and includes a guide rail 10a provided from the upper part of this bending device to the lower part of this bending device, and this guide rail. The molded diode 1 has a stopper 10b that receives the resin sealing member 1a of the molded diode 1 which is bent while being lowered by the molded diode 10a, and a holding portion 10c that prevents the resin sealing member 1a from coming out.

Reference numeral 12 designates a bending member of this bending device, which has an L-shaped recess at its tip and a first pressing surface 12a at its top.

The bending member 12 is formed into a U-shape as shown in FIG. 1C by rotating the first pressing surface 12a while pressing the cathode external lead-out conductor 1b using an arc of a predetermined radius.

Reference numeral 13a denotes a round bar-shaped bending die portion, which guides the cathode external lead-out conductor 1b along the bending die portion 13a when the bending member 12 rotates in an arc as described above.

13b is an arm that supports the bending mold part 13a at one end 13h so that the bending mold part 13a stands upright.

Reference numeral 13c is a spline shaft provided at the other end 13b2 of the arm 13b opposite to the one end 13b□ in a direction opposite to the direction in which the bending mold part 13a faces, and this spline shaft 13c is driven by a drive device (not shown). Vertical movement and rotational movement are performed to position the bending die part 13a near the first pressing surface 12a of the bending member 12 during the bending process, and to separate it from the vicinity of the first pressing surface 12a when the bending process is completed. let

13 is a first bending mold member consisting of the above-mentioned 13a to 13c;
14 is a second bending member having a conductor tip receiving surface 14a parallel to the side surface 1a4 of the resin sealing member 1a; A second pressing surface 12b that is perpendicular to the surface 12a and located inside the bending member 12, and the conductor tip receiving surface 14.
The tip portion 1b1 of the cathode external lead-out conductor 1b, which has completed the U-shape shown in FIG. 1C by step a, is bent as shown in FIG. 1d.

The second bending die member 14 in this embodiment is configured to also serve as the holding portion 10c of the holding member 10.

Reference numeral 15 denotes a bending device composed of the above-mentioned parts 10 to 14.

The operation of such bending device 15 will be explained below.

As shown in FIG. 2a, before the cathode external lead-out conductor 1b is bent, the bending member 12 is stationary at the first predetermined position, and the bending die portion 13a of the bending die member 13 is also bent. It is stationary at a second predetermined position separated from the vicinity of the first pressing surface 12a.

In this state, two molded diodes 1 are supplied while being lowered along the guide rail 10a of the holding member 10, and the molded diodes 1 are received by the splines 10b of the holding member 10, and the holding part I
Retained by nc.

In this state, one surface 1b2 of the protrusion 1 of the cathode external lead-out conductor 1b is in contact with the first pressing surface 12a of the bending member 12.

Next, as shown in FIG. 2, the spline shaft 13c is raised, and as shown in FIG.
is located near the first pressing surface 12a of the bending member 12.

In this state, the bending mold part 13a and the first pressing surface 12a sandwich the cathode external lead-out conductor 1b.

Next, as shown in FIG. 2d, the bending material 12 is bent so that the first suppressing surface 12a extends around the round bar-shaped bending part 13a to a length equal to this radius plus the thickness of the cathode external lead conductor 1b. The protrusion part 1 of the cathode external lead-out conductor 1b is shaped into a U-shape as shown in FIG. 1C, and the tip of the cathode external lead-out conductor 1b is i bl is pressed against the receiving surface 14a of the second bending mold member 14 by the second pressing surface 12b of the member 12, so that this tip portion 1b1 is perpendicular to the second resin surface 1a5 of the resin sealing member 1a. Shape it into a shape.

Next, as shown in FIG. 2f, the bending mold part 13a is separated from the cathode external lead-out conductor 1b of the molded diode 1 which has been bent on the extension line of the central axis of the bending mold part 13a. Lower the spline shaft 13c.

Next, as shown in FIG. 2g, the bending mold part 13a is further
The bending die portions 13a spaced apart on the extension line of the central axis are separated from this position to the second predetermined position by rotating the spline shaft 13c in a direction opposite to the rotation direction shown in FIG. 2C. .

Next, as shown in the second diagram, the stopper 1 of the holding member 10 is
0b is the resin sealing member 1a of the molded diode 1.
At the same time, the holding part 10c of the holding member 10 is released and the bent molded diode 1 is lowered by the guide rail 10a, thereby bending the cathode external lead conductor 1b of the molded diode 1. Complete.

According to the bending device 15 according to the above-mentioned embodiment, a large number of man-hours as many as 4 steps are required as in the case of bending the cathode external conductor 1b of the molded diode 1 using a mold such as a die or a punch in the conventional art. The bending process can be completed in one step, and the molded diode 1 can be automatically supplied and taken out.

Further, guide rails 10 for supplying and extracting the molded diode 1 are continuously provided above and below the bending device 15.
The molded diode 1 which has been bent by step a can be taken out in a predetermined posture, and the molded diode 1 after this bending process can be easily electrically tested.

As described above, this invention has an excellent effect in that the bent workpiece can be easily taken out because it is provided with a drive device that separates the bending mold member from the bent workpiece.

[Brief explanation of the drawing]

Figures 1a to d are step-by-step plan views showing a conventional bending method using a mold for bending a cathode external conductor of a molded diode, and Figures 2g and 2h are bending diagrams showing an embodiment of this invention. It is a perspective view by process showing the bending process state of the cathode external lead-out conductor of a molded diode by a processing device. The same reference numerals indicate corresponding parts. 1 is a molded diode, 10 is a holding member, 12 is a bending member, and 13 is a bending member. A first bending die member, 14 a second bending die member, and 15 a bending device.

Claims (1)

[Scope of utility model registration request] A holding member that holds a workpiece to be bent, a bending die member provided so as to be held by the holding member and in contact with the workpiece to be bent, and the workpiece along the bending die member. A bending device comprising: a bending member that moves along a predetermined trajectory to bend the workpiece; and a drive device that separates the bending die member from the bent workpiece.