JPS633164Y2 - - Google Patents
Info
- Publication number
- JPS633164Y2 JPS633164Y2 JP2912083U JP2912083U JPS633164Y2 JP S633164 Y2 JPS633164 Y2 JP S633164Y2 JP 2912083 U JP2912083 U JP 2912083U JP 2912083 U JP2912083 U JP 2912083U JP S633164 Y2 JPS633164 Y2 JP S633164Y2
- Authority
- JP
- Japan
- Prior art keywords
- punch
- lead
- leads
- bending
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 27
- 238000007747 plating Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
この考案は電子部品のリード曲げ成形用パンチ
の構造改良に関する。[Detailed description of the invention] (a) Industrial application field This invention relates to structural improvement of a punch for bending and forming leads of electronic parts.
(ロ) 従来技術
製造工程でリード曲げ成形工程を有する電子部
品の一例として、第１図に樹脂封止型半導体装置
１を示すと、２は樹脂外装された部品本体、３，
３…は部品本体２の両側面より導出された複数本
のリードで、各リード３，３…は部品本体２の近
傍定位置から同一方向に90゜折曲される。この半
導体装置１は例えば、第２図及び第３図に示すよ
うなリードフレーム４から複数個が一括して次の
要領で製造される。(b) Prior Art As an example of an electronic component having a lead bending process in the manufacturing process, a resin-encapsulated semiconductor device 1 is shown in FIG.
3... are a plurality of leads led out from both sides of the component body 2, and each lead 3, 3... is bent 90 degrees in the same direction from a fixed position near the component body 2. This semiconductor device 1 is manufactured, for example, in a batch from a lead frame 4 as shown in FIGS. 2 and 3 in the following manner.
上記リードフレーム４は複数の半導体装置１，
１…における各リード３，３…をタイバー５で一
連に一体化した薄い帯板状のもので、このリード
フレーム４をペレツトマウント工程やワイヤボン
デイング工程、樹脂モールド工程に送つて要所に
部品本体２，２…が形成され、その後ストレート
な各リード３，３…からタイバー５を切断分離し
ておいて、各リード３，３…の90゜の折曲加工が、
例えば第４図及び第５図に示す如き要領で行われ
る。第４図の６は金型、７，７…はリード曲げ成
形用パンチである。金型６は上面にリードフレー
ム４から分離された半導体装置１，１…の各部品
本体２，２…を位置決め載置する凹部８，８…
と、凹部８，８…の両側にあつて上記パンチ７，
７…が嵌まるリード曲げ成形用垂直溝９，９…を
有し、垂直溝９，９…の上端エツジは各リード
３，３…の折曲予定点に当接する。各パンチ７，
７…は下端面がアール状に成形され、その幅d1は
垂直溝９，９…の幅d2よりリード厚ｔの２倍程度
小さく設定されている。各パンチ７，７…は上部
が支持体１０にて連結され、同時に下降して対応
する垂直溝９，９…にリード３，３…を曲げなが
ら圧入される。即ち、１つのパンチ７で考える
と、これは下端のアール面から続く両側面ｍ，ｍ
が対応する垂直溝９の両側面ｎ，ｎと平行なスト
レートな面であり、パンチ７を下降させると先ず
下端面がリード３，３…の先端部に当つて各リー
ド３，３…を垂直溝９内へ押し下げ、更に下降さ
せるとリード３，３…はパンチ７の両側面ｍ，ｍ
を摺動しながら垂直溝９の両側面ｎ，ｎへと押し
込まれ、パンチ７を下死点まで下降させたところ
で各リード３，３…はパンチ７と垂直溝９に挾ま
れて所望の形に折曲加工される。 The lead frame 4 includes a plurality of semiconductor devices 1,
Each lead 3, 3... in 1... is integrated in series with a tie bar 5 to form a thin strip, and this lead frame 4 is sent to a pellet mounting process, wire bonding process, or resin molding process to form parts at key points. After the main body 2, 2... is formed, the tie bar 5 is cut and separated from each straight lead 3, 3..., and each lead 3, 3... is bent by 90 degrees.
For example, this is carried out as shown in FIGS. 4 and 5. In FIG. 4, 6 is a mold, and 7, 7, . . . are lead bending punches. The mold 6 has recesses 8, 8, . . . on its upper surface in which the component bodies 2, 2, .
and the punches 7, on both sides of the recesses 8, 8...
7 are fitted into lead bending forming vertical grooves 9, 9..., and the upper edges of the vertical grooves 9, 9... contact the planned bending points of each lead 3, 3.... Each punch 7,
7 has a rounded lower end surface, and its width d 1 is set smaller than the width d 2 of the vertical grooves 9, 9 . . . by about twice the lead thickness t. The upper parts of each punch 7, 7... are connected by a support 10, and are simultaneously lowered and pressed into the corresponding vertical grooves 9, 9... while bending the leads 3, 3.... That is, considering one punch 7, it has two sides m, m continuing from the rounded surface of the lower end.
is a straight surface that is parallel to both sides n, n of the corresponding vertical groove 9, and when the punch 7 is lowered, the lower end surface first hits the tip of the leads 3, 3... and makes each lead 3, 3... vertical. When pushed down into the groove 9 and further lowered, the leads 3, 3... are pushed down on both sides m, m of the punch 7.
are pushed into both sides n and n of the vertical groove 9 while sliding, and when the punch 7 is lowered to the bottom dead center, each lead 3, 3... is sandwiched between the punch 7 and the vertical groove 9 and formed into the desired shape. It is bent into a shape.
ところで、リード３，３…の表面には半田付け
性を良好にする等の目的で半田メツキやスズメツ
キなどのメツキ処理が予め行われているため、１
つのパンチ７で何回もリード曲げ成形を行うとパ
ンチ７の側面ｍ，ｍにリード３，３…表面のメツ
キが擦り取られて第６図に示すようにメツキかす
１１として付着し、これが厚く蓄積されていくこ
とがある。このようなメツキかす１１が厚く蓄積
されると、パンチ７を垂直溝９に挿入した時の両
者間の間隙が小さくなつてリード曲げ成形時にリ
ード３，３…に与える機械的ダメージが大きくな
り、リード３，３…の表面を傷付けて外観を悪く
することがあつた。これを防止するため、従来は
リード曲げ作業を中断してパンチ７に付着蓄積し
たメツキかす１１を除去する作業を頻繁に行つて
いるが、この除去作業が煩雑で時間を要し、全体
の製造作業性を極めて悪くする要因になつてい
た。 By the way, the surfaces of the leads 3, 3, etc. have been subjected to plating treatment such as solder plating or tin plating in advance for the purpose of improving solderability.
When lead bending is performed many times with one punch 7, the plating on the surfaces of the leads 3, 3, etc. is rubbed off on the sides m, m of the punch 7, and as shown in FIG. It may accumulate. When such plating scum 11 accumulates thickly, the gap between the punches 7 when inserted into the vertical grooves 9 becomes small, and the mechanical damage caused to the leads 3, 3, etc. during lead bending becomes large. In some cases, the surfaces of the leads 3, 3, etc. were damaged, resulting in poor appearance. In order to prevent this, conventionally, the lead bending operation is interrupted and the plating scum 11 that has accumulated on the punch 7 is frequently removed, but this removal operation is complicated and time-consuming, and This was a factor that made workability extremely poor.
(ハ) 考案の目的
本考案はパンチのリード曲げ成形用側面へのメ
ツキかすの付着蓄積を防止し、もつてリードの損
傷を抑制して作業性の向上化を実現させるパンチ
を提供することを目的とする。(c) Purpose of the invention The present invention aims to provide a punch that prevents the accumulation of plating scum on the side surface of the punch for lead bending, thereby suppressing lead damage and improving workability. purpose.
(ニ) 考案の構成
本考案はリード曲げ成形用パンチのリードを押
し付け摺動させて曲げる側面にリード曲げ方向と
直交する横方向に凹溝を形成することを特徴とす
る。前記凹溝はパンチ側面のメツキかすが蓄積さ
れ易い一部に形成される。このようにするとパン
チ側面に付着したメツキかすは１回のリード曲げ
成形の動作毎に前記凹溝へと押しやられて凹溝内
に入り、パンチ側面でのメツキかすの蓄積が無く
なつてリードの表面が傷付くことが無くなる。(d) Structure of the invention The present invention is characterized in that a recessed groove is formed in the lateral direction perpendicular to the lead bending direction on the side surface of the lead bending punch against which the lead is pressed and slid. The groove is formed in a part of the side surface of the punch where plating scum is likely to accumulate. By doing this, the plating scum that has adhered to the side surface of the punch is pushed into the groove and enters the groove with each lead bending operation, and the accumulation of plating scum on the side surface of the punch is eliminated and the lead is No more surface scratches.
(ホ) 実施例
第１図の半導体装置１のリード曲げ成形用パン
チに適用した一例を第７図に示す。この第７図の
パンチ１２は第６図のパンチ７と同一寸法のもの
で、相違点はリード３，３…を押し付け摺動させ
て曲げる両側面ｍ，ｍに横方向に一条ずつ凹溝１
３，１３を切削等で形成することのみである。凹
溝１３，１３は断面コ字状のもので、深さ１mm幅
２mm程度のものである。また凹溝１３，１３はパ
ンチ１２の下端アール面の最終端に沿う位置に形
成される。(E) Embodiment FIG. 7 shows an example in which the present invention is applied to a lead bending punch for the semiconductor device 1 shown in FIG. 1. The punch 12 shown in FIG. 7 has the same dimensions as the punch 7 shown in FIG.
3 and 13 are simply formed by cutting or the like. The grooves 13, 13 have a U-shaped cross section, and are about 1 mm deep and 2 mm wide. Further, the grooves 13, 13 are formed at positions along the final end of the lower end rounded surface of the punch 12.
上記パンチ１２によるリード曲げ成形は従来と
同様に例えば第８図に示すように金型６の垂直溝
９とでもつて行われる。この本考案の場合、パン
チ１２を下降させてリード３，３…を曲げながら
垂直溝９に挿入していくとリード３，３…表面の
メツキが擦られて一部はパンチ１２に付着するこ
ともあるが、付着したメツキかすはパンチ１２の
下降に伴つて押し上げられて凹溝１３，１３内に
入り、そのまま凹溝１３，１３内に残溜する。従
つて、１つのパンチ１２で何回もリード曲げ成形
を行つてもその側面ｍ，ｍにメツキかすが厚く付
着して蓄積されることは無く、パンチ１２の側面
ｍ，ｍと垂直溝９の側面ｎ，ｎとの間隙はほぼ一
定に保たれてリード３，３…に与えるダメージは
小さく、リード３，３…の表面が傷付く心配は皆
無となる。 The lead bending by the punch 12 is performed in the same way as in the conventional case, for example, by using the vertical groove 9 of the mold 6 as shown in FIG. In the case of this invention, when the punch 12 is lowered and the leads 3, 3... are inserted into the vertical groove 9 while being bent, the plating on the surfaces of the leads 3, 3... will be rubbed and some will adhere to the punch 12. However, the adhering plating scum is pushed up as the punch 12 descends and enters the grooves 13, 13, and remains therein. Therefore, even if lead bending is performed many times with one punch 12, the plating scum will not thickly adhere and accumulate on the side surfaces m, m of the punch 12 and the side surfaces of the vertical groove 9. Since the gap between the leads 3, 3, etc. is kept almost constant, damage to the leads 3, 3, etc. is small, and there is no fear that the surfaces of the leads 3, 3, etc. will be damaged.
凹溝１３，１３内にメツキかすが多く溜るとこ
れを除去する必要があるが、この除去作業は凹溝
１３，１３の容積にもよるが、深さ１mm幅２mm程
度の大きさにすると、パンチ１２や金型６の定期
的に行われる研磨修理時に併行して行う程度でよ
い。つまり、メツキかす除去作業の回数が大幅に
減り、作業性の大幅な改善が図れる。 If a lot of plating scum accumulates in the grooves 13, 13, it will need to be removed.This removal work depends on the volume of the grooves 13, 13, but if the grooves are about 1 mm deep and 2 mm wide, the punch It suffices to carry out the polishing at the same time as the periodic polishing repair of the mold 12 or the mold 6. In other words, the number of times the plating scum must be removed is greatly reduced, and work efficiency is greatly improved.
上記凹溝１３，１３の断面形状は任意で、半円
形状や例えば第９図に示す凹溝１４，１４のよう
に底をテーパ状にしたものなどが可能である。 The cross-sectional shape of the grooves 13, 13 is arbitrary, and may be a semicircular shape or may have a tapered bottom like the grooves 14, 14 shown in FIG.
尚、本考案は半導体装置のリード曲げ成形用パ
ンチに限るものではなく、また１つのパンチの両
側面で同時に両側方から延びるリードを曲げ成形
するパンチに限らず、例えば第１０図に示すパン
チ１５のように一側面m′でのみリード曲げ成形
を行うようにしたものにおいてはリード曲げ成形
用の一側面m′にのみ凹溝１６を形成するように
すればよい。またパンチの一側面の凹溝は一条に
限らず、平行に複数条形成してもよい。 Note that the present invention is not limited to punches for bending and shaping leads of semiconductor devices, and is not limited to punches for bending and shaping leads that extend simultaneously from both sides of a single punch; for example, the punch 15 shown in FIG. In the case where the lead bending is performed only on one side m', the groove 16 may be formed only on the one side m' for lead bending. Furthermore, the number of grooves on one side of the punch is not limited to one, but may be formed in a plurality of grooves in parallel.
(ヘ) 考案の効果
以上の如く、本考案によればリード曲げ成形時
にリードに与える機械的ダメージを少くしてリー
ド表面を損傷すること無くリード曲げ成形がで
き、製品の外観改善、品質向上を図ることが可能
となる。またパンチ側面の凹溝に溜つたメツキか
すの除去作業は容易で且つ頻繁に行う必要が無く
て全体の作業性の大幅な改善が図れる。(f) Effects of the invention As described above, according to the invention, mechanical damage to the leads during lead bending can be reduced, lead bending can be performed without damaging the lead surface, and the appearance and quality of the product can be improved. It becomes possible to achieve this goal. Furthermore, the work of removing plating scum accumulated in the grooves on the side surface of the punch is easy and does not need to be carried out frequently, so that the overall workability can be greatly improved.
第１図は電子部品の一例を示す斜視図、第２図
及び第３図は第１図の電子部品の一製造工程時の
平面図及び正面図、第４図及び第５図は従来のリ
ード曲げ成形用パンチを使つたリード曲げ成形装
置の各動作時の部分断面図、第６図は第４図のパ
ンチの斜視図、第７図は本考案の一実施例を示す
斜視図、第８図は第７図のパンチを使つたリード
曲げ成形装置の部分断面図、第９図及び第１０図
は本考案の他の各実施例を示す斜視図である。
１……半導体装置（電子部品）、２……部品本
体、３……リード、１２……パンチ、１３，１４
……凹溝、１５……パンチ、１６……凹溝、ｍ，
m′……側面。
Figure 1 is a perspective view showing an example of an electronic component, Figures 2 and 3 are a plan view and front view of the electronic component shown in Figure 1 during one manufacturing process, and Figures 4 and 5 are conventional leads. 6 is a perspective view of the punch shown in FIG. 4; FIG. 7 is a perspective view showing an embodiment of the present invention; FIG. This figure is a partial sectional view of a lead bending apparatus using the punch shown in FIG. 7, and FIGS. 9 and 10 are perspective views showing other embodiments of the present invention. 1...Semiconductor device (electronic component), 2...Component body, 3...Lead, 12...Punch, 13, 14
...Concave groove, 15...Punch, 16...Concave groove, m,
m′……side.
Claims (1)
導出されたリードを該リードにリード曲げ方向に
側面を押し付け摺動させて曲げ加工するパンチに
おいて、前記パンチのリード曲げ成形用側面のリ
ード曲げ方向と直交する横方向に凹溝を形成した
ことを特徴とするリード曲げ成形用パンチ。 In a punch that bends a lead drawn out from an electronic component main body that is positioned and fixed at a fixed position by sliding the side surface against the lead in the lead bending direction, the side surface for lead bending of the punch is perpendicular to the lead bending direction. A lead bending punch characterized by having a concave groove formed in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2912083U JPS59135650U (en) | 1983-02-28 | 1983-02-28 | Punch for lead bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2912083U JPS59135650U (en) | 1983-02-28 | 1983-02-28 | Punch for lead bending |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59135650U JPS59135650U (en) | 1984-09-10 |
| JPS633164Y2 true JPS633164Y2 (en) | 1988-01-26 |
Family
ID=30159978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2912083U Granted JPS59135650U (en) | 1983-02-28 | 1983-02-28 | Punch for lead bending |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135650U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163394A (en) * | 1996-11-28 | 1998-06-19 | Iwate Toshiba Electron Kk | Semiconductor lead forming device |
| JP2002222908A (en) * | 2001-01-29 | 2002-08-09 | Nec Yamagata Ltd | Lead cutting die |
-
1983
- 1983-02-28 JP JP2912083U patent/JPS59135650U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59135650U (en) | 1984-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7247931B2 (en) | Semiconductor package and leadframe therefor having angled corners | |
| JPS633164Y2 (en) | ||
| JPH0371785B2 (en) | ||
| JPS59215758A (en) | Forming method of semiconductor lead | |
| JP3048480B2 (en) | Lead forming method | |
| JP2606736B2 (en) | Lead frame manufacturing method | |
| JPS5933983B2 (en) | Method for manufacturing lead frames for semiconductor devices | |
| JPS6244422B2 (en) | ||
| US6085804A (en) | Apparatus and method for forming leads and removing tin dust from leads | |
| JPH04196257A (en) | Lead formation method of semiconductor device | |
| JPS6223094Y2 (en) | ||
| JPS60231347A (en) | Dp machining method of lead frame | |
| JPH02137253A (en) | Semiconductor device | |
| JPH06218449A (en) | Cutting die device for thin sheet | |
| JPH06215989A (en) | Manufacture of vertical aluminum electrolytic chip capacitor | |
| JPS61242724A (en) | Processing method for press product having recessed groove | |
| JP2619525B2 (en) | Brush material for sliding | |
| JP2001060650A (en) | Lead forming device and method of semiconductor device | |
| JPH0637227A (en) | Method of manufacturing resin sealed semiconductor device and lead frame | |
| JP2004311889A (en) | Apparatus and method for shearing tie bar | |
| JP2955954B2 (en) | Method for manufacturing resin-encapsulated electronic component | |
| JPH0143460B2 (en) | ||
| JP3405303B2 (en) | Manufacturing method of lead frame and electronic component | |
| JP3278861B2 (en) | Method for manufacturing lead frame for semiconductor device | |
| JPS63281452A (en) | Equipment for shaping lead of ic |