JPH02158161A - Method of forming j-shaped lead of resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To improve the quality of a product by shaping a lead in a J shape without sliding the face of the lead to be connected to a board and the lead sliding face of a mold component. CONSTITUTION:After a semiconductor device 1 molded by third bending is fed at a predetermined pitch, it is fixed by a fourth forming die 15 and an upper holder 4, a lead 2 is bent at its root by a dropping forming roller 6, and a fourth bending is conducted. Thus, after the semiconductor device 1 shaped by the fourth bending is fed at a predetermined pitch, it is secured by a second lower holder 16 and the upper holder 4, the lead 2 is further bent at 90 degrees by the dropping forming roller 6, and conducted by fifth bending. Thus, since the lead 2 of the semiconductor device 1 is shaped in the J shape, the lead can be shaped without bringing a mold component such as the forming roller 6, etc., into contact with the board connecting face 2a of the lead 2. Thus, the mold component is not slid on the board connecting face of the lead, and the solder plating of the board connecting face of the lead is not peeled, and not damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a J-shaped lead forming method for a resin-sealed semiconductor device.

[Prior Art] A conventional J-shaped lead forming method of this type will be explained with reference to FIGS. 2 to 5. Fig. 2 is a side view showing the resin-sealed semiconductor device before molding, Fig. 3 is a plan view showing the right half of Fig. 2, and Fig. 4 is a side view showing the resin-sealed semiconductor device after molding. , FIG. 5 is a schematic side view showing the forming process, in which (a) is the state immediately before forming, (b) is the first bending state, (c) is the second bending state, (d) is the third bending state, (8) shows the fourth bending state. In the figure, (1) is a resin-sealed semiconductor device, (2) is a lead, and (2a) is a lead (2).
board connection surface, (3) is the forming punch, (4) is the upper holder, (5) is the first forming die, (6
) is a forming roller, (7) is a second forming die, (8) is a lower holder, (9) is a third forming die, and (9a) is a lead sliding surface of the third forming die (9).

Next, the operation will be explained. As shown in FIG. 5(a), the semiconductor device (1) that has descended onto the first forming die (5) is fixed by the descending upper holder (4) and then lead by the descending forming punch (3). (
2) is bent, and the first bending is performed as shown in FIG. 5(b). The semiconductor device (1), which has been subjected to the first bending, is fed by a certain pitch, and then fixed by the second forming die (7) and the upper holder (4), and the forming roller (6) is moved downward. ), the lead (2) is bent from the base, and a second bend is performed as shown in FIG. 5(c). The semiconductor device (1), which has undergone the second bending in this way, is fed at a constant pitch, then fixed by the lower holder (8) and the upper holder (4), and then guided by the descending forming roller (6). 2
) is further bent to 90 degrees, and a third bend is made as shown in FIG. 5(d). The semiconductor device (1), which has been subjected to the third bending process, is fed by a certain pitch and then lowered together with the upper holder (4), so that the substrate connection surface (2a) of the lead (2) is inserted into the third forming die ( The lead (2) is bent into a J shape by sliding on the lead sliding surface (9a) of 9), and a fourth bend is performed as shown in FIG. 5(e). In this way, the leads (
2) is formed into a J shape as shown in FIG.

[Problems to be Solved by the Invention] In the conventional J-shaped lead forming method for resin-sealed semiconductor devices as described above, the contact between the substrate connecting surface (2a) of the lead (2) and the third forming die (9) is Since the lead sliding surface (9a) slides, there are problems such as the solder plating applied to the board connecting surface (2a) of the lead (2) peeling off or being damaged.

This invention was made in order to solve these problems, and is a resin-sealed type that allows the leads to be formed into a J-shape without peeling off the solder plating or damaging the board connection surface of the leads, thereby improving the quality of the product. The object of the present invention is to obtain a method for forming J-shaped leads for semiconductor devices.

[Means to solve the problem]

In order to achieve the above object, a J-shaped lead forming method for a resin-sealed semiconductor device according to the present invention provides a method for forming a J-shaped lead for a resin-sealed semiconductor device. Lead J without slipping on the lead sliding surface
It is something that is molded into a shape.

[Effect]

In this invention, when forming the lead of a semiconductor device into a J shape, the surface of the lead connected to the substrate and the lead sliding surface of the mold component do not slip.

[Embodiment] An embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic side view showing the molding process of a resin-sealed semiconductor device, in which (a) is a first bent state, (b) is a second bent state, and (C
) shows the third bending state, (d) shows the fourth bending state, and (e) shows the fifth bending state, and the same or equivalent parts as in the conventional method are given the same reference numerals and explanations are omitted. do. In the figure, (10) is the second forming punch, (11) is the second forming die, (12) is the third forming punch, (13) is the third forming die, and (14) is the first lower part. Holder (15) is the fourth forming die, and (16) is the second lower holder.

Next, the operation will be explained. As shown in FIG. 1(a), the leading end side of the lead (2) of the semiconductor device (1) fixed by the first forming die (5) and the upper holder (4) is pressed into the first position by the forming punch (3). Bending is done. The semiconductor device (1), which has been subjected to the first bending in this way, is fed at a constant pitch and then fixed by the second forming die (11) and the upper holder (4).
The lead (2) is further bent by the descending second forming punch (10), and a second bending is performed as shown in FIG. 1(b). The semiconductor device (1), which has undergone the second bending in this way, is fed at a constant pitch, then fixed by the first lower holder (14) and the upper holder (4), and then transferred to the third forming die (13). and a third forming punch (12), the lead (2) is bent into a semicircular shape, and a third bending is performed as shown in FIG. 1(c). After the semiconductor device (1), which has undergone the third bending process, is fed at a constant pitch, it is fixed by the fourth forming die (15) and the upper holder (4), and the forming roller (6) is moved downward. Lead by (2
) is bent from the root, and the fourth
Bending is done. After the semiconductor device (1), which has undergone the fourth bending process, is fed by a certain pitch, it is fixed by the second lower holder (16) and the upper holder (4), and is moved by the descending forming roller (6). Lead (
2) is further bent by 90 degrees, and a fifth bend is performed as shown in FIG. 1(e). In this way, semiconductor device (1)
Since the lead (2) is formed into a J-shape, the lead can be formed without applying a mold part such as a forming roller (6) to the board connection surface (2a) of the lead (2).

In the above embodiment, from the first bend in FIG. 1(a) to the first bend in FIG.
) up to the third bend with a forming punch (3), (10
) and (12), but these bends may also be performed using a forming roller.

Further, in the above embodiment, the J-shape of the lead (2) is bent downward, but it may be bent upward.

[Effects of the Invention] As described above, according to the present invention, the mold parts do not slide on the board connection surface of the lead, so the solder plating on the board connection surface of the lead does not come off or get damaged, and a high quality product can be obtained. It has the effect of being

[Brief explanation of the drawing]

1(a) to 1(e) are schematic side views showing the process of molding a resin-sealed semiconductor device according to the method of the present invention, FIG. 2 is a side view showing the resin-sealed semiconductor device before molding, and FIG. The figure is the second
A plan view showing the right half of the figure, FIG. 4 is a side view showing the resin-sealed semiconductor device after molding, and FIGS. 5 (a,) to (e) are molding of the resin-sealed semiconductor device by the conventional method. It is a schematic side view which shows a process. In the figure, (1) is a resin-embedded semiconductor device, (2) is a lead, (2a) is a board connection surface of lead (2), and (3) is a resin-embedded semiconductor device.
, (10), (12) are forming punches, (4) are upper holders (5), (11), (13), (15)
The forming die (6) is the forming roller, (1
4) and (16) indicate the lower holder. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] (1) When molding the leads of a resin-sealed semiconductor device into a J-shape, the lead is molded into a J-shape without causing the surface of the lead that connects to the substrate and the lead sliding surface of the mold component to slip. A J-shaped lead forming method for a resin-sealed semiconductor device.