JPH0388353A - Lead-forming die - Google Patents
Lead-forming dieInfo
- Publication number
- JPH0388353A JPH0388353A JP22612589A JP22612589A JPH0388353A JP H0388353 A JPH0388353 A JP H0388353A JP 22612589 A JP22612589 A JP 22612589A JP 22612589 A JP22612589 A JP 22612589A JP H0388353 A JPH0388353 A JP H0388353A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punch
- ball
- mold
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置のリードを成形するリード成形金型
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead molding die for molding leads of semiconductor devices.
第３図は従来のリード成形金型の一例を示す断面図であ
る。従来、この種のリード成形金型は、例えば、第３図
に示すように、半導体装置の外郭体５を保持し、その外
郭体５より突出するリード２の根元を挟む上型４及び下
型３と、このリード２の先端側を折り曲げるポンチｌと
で構成されていた。そして、このポンチの先端は、折り
曲げられたリードの形状と相似である平坦面に形成され
ていた。FIG. 3 is a sectional view showing an example of a conventional lead molding die. Conventionally, as shown in FIG. 3, this type of lead molding mold has conventionally held an outer shell 5 of a semiconductor device, and has an upper die 4 and a lower die that sandwich the bases of leads 2 protruding from the outer shell 5. 3, and a punch l for bending the tip end side of the lead 2. The tip of this punch was formed into a flat surface similar to the shape of the bent lead.
しかしながら、上述した従来のリード成形金型では、ポ
ンチでリードを折り曲げるときに、ポンチの先端面とリ
ードの表面の間ですべりを生じ、このため、ポンチの先
端面のエツジ等によりリードのめっき層を削り取り、こ
の削り取られためつき屑が金型や外郭体に付着し、この
リード成形する際に外郭体に傷をつけたり、あるいは次
工程である捺印工程で、捺印ぎれを生じさせたりする欠
点がある。また、この対策として、例えば、ローラベン
ダーのようにローラを回転しながら、成形する方法があ
るが、半導体装置のリードが細いこともあって、小さい
アールをもつ曲げ加工に際しては、成形しにくいという
欠点がある。However, in the conventional lead forming mold described above, when the lead is bent with the punch, slippage occurs between the tip surface of the punch and the surface of the lead, and as a result, the edges of the tip surface of the punch, etc. cause the plating layer of the lead to The disadvantage is that the scraped chips adhere to the mold and outer shell, causing damage to the outer shell during lead molding, or causing gaps in the stamping process in the next step, the stamping process. be. In addition, as a countermeasure for this, there is a method of forming while rotating the rollers, such as in a roller bender, but since the leads of semiconductor devices are thin, it is difficult to form when bending with a small radius. There are drawbacks.
本発明の目的は、かかる欠点を解消するリード成形金型
を提供することにある。An object of the present invention is to provide a lead molding die that eliminates such drawbacks.
本発明のリード成形金型は、半導体装置の外郭体を保持
するとともにこの外郭体より突出する複数本のリードの
根元を挟む上型及び下型と、前記リードの先端側を折り
曲げる先端部に回転し得る球状部材が取り付けられたポ
ンチとを備え構成される。The lead molding mold of the present invention has an upper mold and a lower mold that hold the outer shell of a semiconductor device and sandwich the roots of a plurality of leads protruding from the outer shell, and a rotating tip part that bends the tips of the leads. and a punch to which a spherical member is attached.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ＞、（ｂ）及び（Ｃ）は本発明によるリード
成形金型の一例を説明するために金型の動作順に示した
断面図、第２図は第１図のポンチを拡大して示した側面
図である０本発明の実施例によるリード成形金、型は、
第１図（ａ）、（ｂ）及び（Ｃ）並びに第２図に示すよ
うに、ポンチｌ・
ａの先端にボール状部材６を取り付けたことである。ま
た、このボール状部材６はポンチ１ａの先端に保持され
ながら矢印の方向に回転し得ることである。このポンチ
の製作方法は、鋼棒の先端にボール状部材６が挿入され
る窪みを形成し、この窪みにボール状部材６を挿入し、
窪みのエツジ部をコーキングすれば、ボール状部材６は
保持されるとともに自転出来る。なお、このボール状部
材６の表面は鏡面仕上げしておく必要がある。その他は
、従来例と同様である。Figures 1 (a>, (b), and (C) are cross-sectional views shown in order of operation of the mold to explain an example of a lead forming mold according to the present invention, and Figure 2 is an enlarged view of the punch in Figure 1. The lead molding die and mold according to the embodiment of the present invention are shown in a side view as shown in FIG.
As shown in FIGS. 1(a), (b), and (C) and FIG. 2, a ball-shaped member 6 is attached to the tip of the punch l/a. Further, this ball-shaped member 6 can be rotated in the direction of the arrow while being held at the tip of the punch 1a. The method for manufacturing this punch involves forming a recess into which the ball-shaped member 6 is inserted at the tip of a steel rod, inserting the ball-shaped member 6 into the recess, and
By caulking the edges of the depression, the ball-shaped member 6 can be held and rotated. Note that the surface of this ball-shaped member 6 needs to be mirror-finished. The rest is the same as the conventional example.
次に、このリード成形金型の動作について説明する。ま
ず、第１図（ａ）に示すように、上型４と下型６を開き
、半導体装置を入れ、リード２の根元を上型４と下型６
とで挟みこむ０次に、第１図（ｂ）に示すように、ポン
チ１ａが下降し、リード２の根元側から接触し、下型に
押しつけるように曲げ成形を開始する。このとき、ボー
ル状部材６はリード２表面をすべることなく、下降につ
れて回転する０次に、第１図（Ｃ）に示すように、ボー
ル状部材６が下降しきり、リード２の成形を完了する。Next, the operation of this lead molding die will be explained. First, as shown in FIG. 1(a), open the upper mold 4 and the lower mold 6, insert the semiconductor device, and insert the base of the lead 2 into the upper mold 4 and the lower mold 6.
Next, as shown in FIG. 1(b), the punch 1a descends, contacts the base of the lead 2, and presses it against the lower die to begin bending. At this time, the ball-shaped member 6 rotates as it descends without sliding on the surface of the lead 2. Then, as shown in FIG. .
このように、リード成形時に、ポンチの先端がリード表
面をすべらないように、自転する球状部材で押して成形
するので、リード表面のめつき層が剥れることがなくな
る。また、成形する工具の接触面積が点接触であるため
、曲げ力が集中し易く、さらに、ローラベンダーのよう
にローラ回転軸をもつことがなく、破損する部品をもつ
ことがない、利点がある。In this way, when forming the lead, the tip of the punch is pressed with the rotating spherical member so that it does not slip on the lead surface, so that the plating layer on the lead surface does not peel off. In addition, since the contact area of the forming tool is point contact, bending force can be easily concentrated, and there is also the advantage that it does not have a roller rotation axis like a roller bender, so there are no parts that can break. .
以上説明したように本発明は、半導体装置のリードを成
形するポンチの先端に自在の方向に回転し得るボール状
部材を設けることによって、リード成形時に、ボール状
部材とリード表面との間にすべりが生ずることがなくな
り、リードのめつき層を剥すことなく成形出来るリード
成形金型が得られるという効果がある。As explained above, the present invention provides a ball-shaped member that can rotate in any direction at the tip of a punch for forming leads of semiconductor devices, thereby preventing slippage between the ball-shaped member and the lead surface during lead forming. This has the effect of eliminating the occurrence of lead molding and providing a lead molding die that can be molded without peeling off the lead plating layer.
第１図（ａ）、（ｂ）及び（Ｃ）は本発明によるリード
成形金型の一例を説明するために金型の動作順に示した
断面図、第２図は第１図のポンチを拡大して示した側面
図、第３図は従来のリード成形金型の一例を示す断面図
である。
１、ｌａ・・・ポンチ、２・・・リード、３・・・下型
、４・・・上型、５−・・外郭体、６・・・ボール状部
材。Figures 1 (a), (b), and (C) are cross-sectional views shown in order of operation of the mold to explain an example of a lead forming mold according to the present invention, and Figure 2 is an enlarged view of the punch in Figure 1. FIG. 3 is a sectional view showing an example of a conventional lead molding die. DESCRIPTION OF SYMBOLS 1, la... Punch, 2... Lead, 3... Lower die, 4... Upper die, 5-... Outer body, 6... Ball-shaped member.
Claims (1)
り突出する複数本のリードの根元を挟む上型及び下型と
、前記リードの先端側を折り曲げる先端部に回転し得る
球状部材が取り付けられたポンチとを備えることを特徴
とするリード成形金型。Upper and lower molds that hold the outer shell of a semiconductor device and sandwich the bases of a plurality of leads protruding from the outer shell, and a punch that has a rotatable spherical member attached to the tip for bending the tips of the leads. A lead molding mold characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22612589A JPH0388353A (en) | 1989-08-30 | 1989-08-30 | Lead-forming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22612589A JPH0388353A (en) | 1989-08-30 | 1989-08-30 | Lead-forming die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388353A true JPH0388353A (en) | 1991-04-12 |
Family
ID=16840234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22612589A Pending JPH0388353A (en) | 1989-08-30 | 1989-08-30 | Lead-forming die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388353A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4225055C2 (en) * | 1991-07-29 | 2003-03-27 | Fitel Innovations Heerenberg | Method for packaging a semiconductor device and simultaneously bending conductors of the semiconductor device |
-
1989
- 1989-08-30 JP JP22612589A patent/JPH0388353A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4225055C2 (en) * | 1991-07-29 | 2003-03-27 | Fitel Innovations Heerenberg | Method for packaging a semiconductor device and simultaneously bending conductors of the semiconductor device |
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