JPS60208377A - ソルダ−レジストインキ用樹脂組成物 - Google Patents

ソルダ−レジストインキ用樹脂組成物

Info

Publication number
JPS60208377A
JPS60208377A JP59063167A JP6316784A JPS60208377A JP S60208377 A JPS60208377 A JP S60208377A JP 59063167 A JP59063167 A JP 59063167A JP 6316784 A JP6316784 A JP 6316784A JP S60208377 A JPS60208377 A JP S60208377A
Authority
JP
Japan
Prior art keywords
parts
resin
solder resist
epoxy
vinyl ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59063167A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0122312B2 (enrdf_load_stackoverflow
Inventor
Yoneji Sato
佐藤　米次
Masato Hoshino
政人 星野
Seiichi Kitazawa
北沢　清一
Tadashi Yasuda
忠司 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Asahi Chemical Laboratory Co Ltd
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd, Asahi Chemical Laboratory Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP59063167A priority Critical patent/JPS60208377A/ja
Publication of JPS60208377A publication Critical patent/JPS60208377A/ja
Publication of JPH0122312B2 publication Critical patent/JPH0122312B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
JP59063167A 1984-04-02 1984-04-02 ソルダ−レジストインキ用樹脂組成物 Granted JPS60208377A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59063167A JPS60208377A (ja) 1984-04-02 1984-04-02 ソルダ−レジストインキ用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59063167A JPS60208377A (ja) 1984-04-02 1984-04-02 ソルダ−レジストインキ用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS60208377A true JPS60208377A (ja) 1985-10-19
JPH0122312B2 JPH0122312B2 (enrdf_load_stackoverflow) 1989-04-26

Family

ID=13221416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59063167A Granted JPS60208377A (ja) 1984-04-02 1984-04-02 ソルダ−レジストインキ用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS60208377A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786579A (en) * 1986-04-28 1988-11-22 Tokyo Ohka Kogyo Co., Ltd. Heat-resistant photosensitive resin composition
JPH01141904A (ja) * 1987-11-30 1989-06-02 Taiyo Ink Seizo Kk 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
US5087552A (en) * 1988-10-19 1992-02-11 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition
EP0844809A3 (en) * 1996-11-20 1999-12-01 Ibiden Co, Ltd. Solder resist composition and printed circuit boards
EP2221666A4 (en) * 2007-11-12 2011-02-02 Hitachi Chemical Co Ltd LIGHT-SENSITIVE RESIN COMPOSITION OF THE POSITIVE TYPE, METHOD FOR PRODUCING A RESISTANCE STRUCTURE, SEMICONDUCTOR ARRANGEMENT AND ELECTRONIC ARRANGEMENT
US9587125B2 (en) 2012-05-22 2017-03-07 Hewlett-Packard Industrial Printing Ltd. Photo-curable ink composition
US10000648B2 (en) 2011-10-09 2018-06-19 Hp Scitex Ltd. Photo-curable ink composition

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786579A (en) * 1986-04-28 1988-11-22 Tokyo Ohka Kogyo Co., Ltd. Heat-resistant photosensitive resin composition
JPH01141904A (ja) * 1987-11-30 1989-06-02 Taiyo Ink Seizo Kk 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
US4943516A (en) * 1987-11-30 1990-07-24 Taiyo Ink Manufacturing Co., Ltd. Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
US5087552A (en) * 1988-10-19 1992-02-11 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition
EP0844809A3 (en) * 1996-11-20 1999-12-01 Ibiden Co, Ltd. Solder resist composition and printed circuit boards
US6217987B1 (en) 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards
EP2221666A4 (en) * 2007-11-12 2011-02-02 Hitachi Chemical Co Ltd LIGHT-SENSITIVE RESIN COMPOSITION OF THE POSITIVE TYPE, METHOD FOR PRODUCING A RESISTANCE STRUCTURE, SEMICONDUCTOR ARRANGEMENT AND ELECTRONIC ARRANGEMENT
US9786576B2 (en) 2007-11-12 2017-10-10 Hitachi Chemical Company, Ltd Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
US10000648B2 (en) 2011-10-09 2018-06-19 Hp Scitex Ltd. Photo-curable ink composition
US9587125B2 (en) 2012-05-22 2017-03-07 Hewlett-Packard Industrial Printing Ltd. Photo-curable ink composition

Also Published As

Publication number Publication date
JPH0122312B2 (enrdf_load_stackoverflow) 1989-04-26

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