JPS60201642A - 半導体ウエハの処理方法 - Google Patents

半導体ウエハの処理方法

Info

Publication number
JPS60201642A
JPS60201642A JP59060393A JP6039384A JPS60201642A JP S60201642 A JPS60201642 A JP S60201642A JP 59060393 A JP59060393 A JP 59060393A JP 6039384 A JP6039384 A JP 6039384A JP S60201642 A JPS60201642 A JP S60201642A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
thin plate
adhesive layer
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59060393A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0472386B2 (ref
Inventor
Takemasa Uemura
植村　剛正
Yoshinari Satoda
良成 里田
Eiji Shigemura
重村　栄二
Zenzo Honda
本多　善三
Yujiro Kawashima
裕次郎 川嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP59060393A priority Critical patent/JPS60201642A/ja
Publication of JPS60201642A publication Critical patent/JPS60201642A/ja
Publication of JPH0472386B2 publication Critical patent/JPH0472386B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesive Tapes (AREA)
JP59060393A 1984-03-27 1984-03-27 半導体ウエハの処理方法 Granted JPS60201642A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59060393A JPS60201642A (ja) 1984-03-27 1984-03-27 半導体ウエハの処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59060393A JPS60201642A (ja) 1984-03-27 1984-03-27 半導体ウエハの処理方法

Publications (2)

Publication Number Publication Date
JPS60201642A true JPS60201642A (ja) 1985-10-12
JPH0472386B2 JPH0472386B2 (ref) 1992-11-18

Family

ID=13140861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59060393A Granted JPS60201642A (ja) 1984-03-27 1984-03-27 半導体ウエハの処理方法

Country Status (1)

Country Link
JP (1) JPS60201642A (ref)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
US7906582B2 (en) 2007-02-20 2011-03-15 Fujifilm Corporation Polymerizable composition, tacky material, and adhesive

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
US7906582B2 (en) 2007-02-20 2011-03-15 Fujifilm Corporation Polymerizable composition, tacky material, and adhesive

Also Published As

Publication number Publication date
JPH0472386B2 (ref) 1992-11-18

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