JPS60198897A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Serijo soil ori number 1'?) A: Concerning the manufacturing method of a large number of printed condolences.

(Use rice technique ψ1σ) Similar to multi-layer printing layout lfM, Rie Shio is a special public official 1497-1977.
As shown in Publication No. 7, the conductor pattern [multilayer board and prepreg] was pressed on one side with the n-core layer, and then the layer was pressed, drilled with a no-corrugated hole, and fully exposed with chemical steel plating. It is manufactured by plating with electrolytic copper plating and etching the copper layer using the temporary etching resist. However, when multi-layering is applied, the prepreg is
ζ, large manufacturing equipment is required, and the cost is 77:9, and the limit is 6゜ (objective of the invention). The manufacturing method of the 1st degree pattern multi-mosquito ink paulownia plate is provided.

(Yang g of invention) Process of this invention for a long time? 0, which is the method of dressing Tanoshi Indou Adenya, including: A, Gokuden Kinkoho 9. Similar to the 6 loquats containing B, the plating resist τj is used, and no scales are used. 'I:'(J')
.

B. Strip off the plating resist and perform quick etching [After the plating resist is formed, remove the paint mold Mτ and apply catalyst 9 engravings on the entire surface. .

D, Roughen the wide eyebrows Δ, D, Roughen the width, E, Form a resist τ, open a through hole. Resist is formed a
Perform an electroless whistle on the rib)')+ that has not been r.

The present invention will be explained based on the following figure 1. 〇Palladium, platinum, and non-electroplating copper υ were mixed with a heavy alcoholic medium.
A dark blue copper plating plate was formed using the 2τ process, and a plating resist 6τ was formed on aJ (bJ).

Hitun scrap plane Messaune V
Inside! <C) Q inner layer circuit 4 formed by the circuit pattern
"11 stitches are the same as above, city 1 dense 1 tajime self-gutter Shimaguchi" hhi 〇 Also, the inner layer is made using the etching method without 7 # doves 7C
I used the medicine board τ and licked it to the samurai.

Resist f taste thick with υ for a long time a), quick engraving of 艷? Il-What, plating resist was formed! A sake's ultimate sword k-remove the inner layer circuit pattern Bonji already ^(e).

Next, 7!11i Intermediate Monkey β Creation 5 f Q Jli Ding (f). This adhesive is coated and formed using a method that does not require large presses such as hot rolls.
ゐ○ Chemical recombination was carried out in Shukoku (ω, resist 6τ was formed), and 7 rounds were bent. In this case, it may be possible to open a through hole → form a resist → roughen it.

Opening the through hole τ is complicated, and σ plating voids are likely to occur in the case of electroplating. , there is also the advantage that there is no sintering process.Through holes can also be drilled.Next, resisting the desire to use electroless copper and poking, resist is not formed, and through holes and their surroundings can be drilled. Solve No. 1! and perform plating 8 (it.

Above I have explained about the VC of 4J So, but there are also traps that leave behind 6 Ichimata and 5 or more pigeons.

(Paddy rice of invention) As explained above, 'f'c non-invention has the following effects IL
ゐ〇(1) There is no 7-Russ flying pigeon τ line, so the cost is low.
h-tonai 0 (2) Insulation τ or π due to the thickness of the shield τ, impedance) u! Easy to control.

[Brief explanation of the drawing]

Explanation of 1〇 code 1, tlsu ffu 1 (person! 1lii * no in shi 2, wakan Hiroshi★ same white & resist 4, in) Zeng [11] Road 5, catalyst person! 7 Adhesive 6, Resist B Through Hole A Mutsu-tun Hamaguri Metsusa Substitute to Masu Burialist Kuni Wakabayashi Hikote I Continuation Amendment (Method) Showa 59'F Near Month IB Date of Invention Name Multilayer Printed Wiring Date of amendment order by the person amending the manufacturing method of the plate: June 26, 1980 (shipment date) Details of the amendment (1) Specification page 3, line 9 to page 4, line 17 I: ``The following is based on the drawings...'' Perform electroless plating 8 (1).'' should be corrected as follows. [The present invention will be explained below based on the drawings.] A plating resist is applied to an ultra-thin copper-clad laminate (Fig. 1) in which a catalyst-containing ultra-thin steel foil 2 of several μm to 10 μm is laminated to a laminate 1 mixed with palladium, platinum, and a catalyst for mediation electroless copper plating. 6), then immersed in an electroless copper plating solution to perform electroless copper plating 4 to form an inner layer circuit pattern (FIG. 3). The accuracy of inner layer circuits is improved and high-density wiring becomes possible. It is also possible to use etched circuit boards without an adhesive layer on the inner layer. Next, the plating resist is removed (Fig. 4), and quick copper etching is performed to remove the extremely thin copper where the plating resist had been formed to complete the inner layer circuit pattern (Fig. 5).
figure). Next, a catalyst-containing adhesive 5 is applied (FIG. 6). The adhesive may be applied or formed by methods that do not require large presses, such as hot rolls. Roughening is performed with a chemical roughening solution (FIG. 7), a resist 6 is formed (FIG. 8), and a through hole 7 is opened (FIG. 9). In this case, the process may be as follows: opening a through hole → forming a resist → roughening. Use a punch to open the through hole. The punch hole shape is rough and plating voids are likely to occur in the case of electroplating, but electroless copper plating has the advantage of good throwing power, low cost, and no smear treatment. Through holes can also be drilled. Next, it is immersed in an electroless steel plating solution to perform electroless plating 8 on the through holes and their surroundings where no resist is formed (FIG. 10). (2) On page 5 of the specification, the column for a brief explanation of the drawings has been amended as follows. ``Figures 1 to 10 are cross-sectional views showing the method of the present invention.'' (3) All figures in the drawings will be corrected as separate sheets. Continuation of page 1 [phase] Inventor Nobuo Uozu Tochigi Company

Claims (1)

[Claims] 1. Next step t Manufacture of rubber printed gland pattern w0A, Zr
A 11A thin gold plate was formed on the catalyst-containing insulating substrate, and a non-a-plated plate was applied. B. Plating resist [Peel ^1 and quick etching τ
After the plating resist is formed, the catalytic contact '4 will be applied to the OC8 complete table, which will remove the n7 and other parts used for painting. D. I'm going to turn into a pigeon. E. Shape the electroless plating resist. F, through hole and light is heart. G, No% immersion in the plating enemy, the resist is blemish f
Electroless plating on solid n1 without τ9゜