JPS60189241A - 段差の被覆方法 - Google Patents

段差の被覆方法

Info

Publication number
JPS60189241A
JPS60189241A JP4293484A JP4293484A JPS60189241A JP S60189241 A JPS60189241 A JP S60189241A JP 4293484 A JP4293484 A JP 4293484A JP 4293484 A JP4293484 A JP 4293484A JP S60189241 A JPS60189241 A JP S60189241A
Authority
JP
Japan
Prior art keywords
film
pattern
deposited
conductive film
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4293484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0122738B2 (enExample
Inventor
Toru Mogami
徹 最上
Mitsutaka Morimoto
光孝 森本
Hidekazu Okabayashi
岡林　秀和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP4293484A priority Critical patent/JPS60189241A/ja
Publication of JPS60189241A publication Critical patent/JPS60189241A/ja
Publication of JPH0122738B2 publication Critical patent/JPH0122738B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP4293484A 1984-03-08 1984-03-08 段差の被覆方法 Granted JPS60189241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4293484A JPS60189241A (ja) 1984-03-08 1984-03-08 段差の被覆方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4293484A JPS60189241A (ja) 1984-03-08 1984-03-08 段差の被覆方法

Publications (2)

Publication Number Publication Date
JPS60189241A true JPS60189241A (ja) 1985-09-26
JPH0122738B2 JPH0122738B2 (enExample) 1989-04-27

Family

ID=12649838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4293484A Granted JPS60189241A (ja) 1984-03-08 1984-03-08 段差の被覆方法

Country Status (1)

Country Link
JP (1) JPS60189241A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107557A (ja) * 1987-10-21 1989-04-25 Agency Of Ind Science & Technol 配線の形成方法
JPH01107559A (ja) * 1987-10-21 1989-04-25 Agency Of Ind Science & Technol 配線の形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107557A (ja) * 1987-10-21 1989-04-25 Agency Of Ind Science & Technol 配線の形成方法
JPH01107559A (ja) * 1987-10-21 1989-04-25 Agency Of Ind Science & Technol 配線の形成方法

Also Published As

Publication number Publication date
JPH0122738B2 (enExample) 1989-04-27

Similar Documents

Publication Publication Date Title
EP0544648B1 (en) Method for forming a planarized Al thin film
US5580823A (en) Process for fabricating a collimated metal layer and contact structure in a semiconductor device
US4523975A (en) Integrated circuit planarizing process
JPS6135537A (ja) 半導体装置の製造方法
EP0107363B1 (en) Method of producing anisotropically-conducting layers
US4418095A (en) Method of making planarized Josephson junction devices
US4847673A (en) Semiconductor device
KR100269926B1 (ko) 배선형성 방법
US7432205B2 (en) Method for controlling polishing process
JPH0122738B2 (enExample)
JPS6332260B2 (enExample)
JPS61179532A (ja) コンタクト電極の形成方法
JPS61120417A (ja) コンタクト電極の形成方法
JPS60193336A (ja) コンタクト電極の形成方法
JPS5951549A (ja) 集積回路装置の製造方法
JPH01107557A (ja) 配線の形成方法
JPH03263833A (ja) テーパエツチング方法
JPH084088B2 (ja) 薄膜形成方法
JPS6052043A (ja) 配線構造の製造方法
JPS639660B2 (enExample)
JPS60115234A (ja) 半導体装置の製造方法
JPS5893344A (ja) 半導体装置及びその製造方法
JPS60233840A (ja) 段差の被覆方法
JPS6130053A (ja) 段差の被覆方法
JPH04116930A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term