JPS60189231A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS60189231A
JPS60189231A JP59044303A JP4430384A JPS60189231A JP S60189231 A JPS60189231 A JP S60189231A JP 59044303 A JP59044303 A JP 59044303A JP 4430384 A JP4430384 A JP 4430384A JP S60189231 A JPS60189231 A JP S60189231A
Authority
JP
Japan
Prior art keywords
substrate
camera
capillary
height
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59044303A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367338B2 (en, 2012
Inventor
Yutaka Makino
豊 牧野
Takeichi Yoshida
吉田　竹一
Seishirou Yanaike
征志郎 梁池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59044303A priority Critical patent/JPS60189231A/ja
Publication of JPS60189231A publication Critical patent/JPS60189231A/ja
Publication of JPH0367338B2 publication Critical patent/JPH0367338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59044303A 1984-03-08 1984-03-08 ワイヤボンデイング装置 Granted JPS60189231A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59044303A JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59044303A JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60189231A true JPS60189231A (ja) 1985-09-26
JPH0367338B2 JPH0367338B2 (en, 2012) 1991-10-22

Family

ID=12687724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59044303A Granted JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60189231A (en, 2012)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998054545A3 (en) * 1997-05-28 1999-03-04 Scient Generics Ltd Position transducer and method of manufacture
US6304014B1 (en) 1997-10-02 2001-10-16 Synaptics (Uk) Limited Motor control system
US6489899B1 (en) 1994-05-14 2002-12-03 Synaptics (Uk) Limited Position detector
US6522128B1 (en) 1997-10-15 2003-02-18 Synaptics (Uk) Limited Position sensor having compact arrangement of coils
US6534970B1 (en) 1998-05-22 2003-03-18 Synaptics (Uk) Limited Rotary position sensor and transducer for use therein
US6888538B2 (en) 1994-05-14 2005-05-03 Synaptics (Uk) Limited Position sensor
US6980134B2 (en) 1996-06-28 2005-12-27 Synaptics (Uk) Limited Signal processing apparatus and method
US7019672B2 (en) 1998-12-24 2006-03-28 Synaptics (Uk) Limited Position sensor
US7030782B2 (en) 1994-05-14 2006-04-18 Synaptics (Uk) Limited Position detector
US7133793B2 (en) 2003-07-24 2006-11-07 Synaptics (Uk) Limited Magnetic calibration array
US7406393B2 (en) 2002-03-05 2008-07-29 Synaptics (Uk) Limited Position sensor
US7511705B2 (en) 2001-05-21 2009-03-31 Synaptics (Uk) Limited Position sensor
US7812268B2 (en) 2003-08-26 2010-10-12 Synaptics (Uk) Limited Digitizer system
US7907130B2 (en) 2002-06-05 2011-03-15 Synaptics (Uk) Limited Signal transfer method and apparatus
US9410791B2 (en) 2010-12-24 2016-08-09 Cambridge Integrated Circuits Limited Position sensing transducer
US9470505B2 (en) 2012-06-13 2016-10-18 Cambridge Integrated Circuits Limited Position sensing transducer

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7030782B2 (en) 1994-05-14 2006-04-18 Synaptics (Uk) Limited Position detector
US6489899B1 (en) 1994-05-14 2002-12-03 Synaptics (Uk) Limited Position detector
US6888538B2 (en) 1994-05-14 2005-05-03 Synaptics (Uk) Limited Position sensor
US6980134B2 (en) 1996-06-28 2005-12-27 Synaptics (Uk) Limited Signal processing apparatus and method
US6705511B1 (en) 1997-05-28 2004-03-16 Synaptics (Uk) Limited Transducer and method of manufacture
WO1998054545A3 (en) * 1997-05-28 1999-03-04 Scient Generics Ltd Position transducer and method of manufacture
US6304014B1 (en) 1997-10-02 2001-10-16 Synaptics (Uk) Limited Motor control system
US6522128B1 (en) 1997-10-15 2003-02-18 Synaptics (Uk) Limited Position sensor having compact arrangement of coils
US6534970B1 (en) 1998-05-22 2003-03-18 Synaptics (Uk) Limited Rotary position sensor and transducer for use therein
US7019672B2 (en) 1998-12-24 2006-03-28 Synaptics (Uk) Limited Position sensor
US7511705B2 (en) 2001-05-21 2009-03-31 Synaptics (Uk) Limited Position sensor
US8243033B2 (en) 2001-05-21 2012-08-14 Synaptics (Uk) Limited Position sensor
US7406393B2 (en) 2002-03-05 2008-07-29 Synaptics (Uk) Limited Position sensor
US7907130B2 (en) 2002-06-05 2011-03-15 Synaptics (Uk) Limited Signal transfer method and apparatus
US7133793B2 (en) 2003-07-24 2006-11-07 Synaptics (Uk) Limited Magnetic calibration array
US7812268B2 (en) 2003-08-26 2010-10-12 Synaptics (Uk) Limited Digitizer system
US8022317B2 (en) 2003-08-26 2011-09-20 Synaptics (Uk) Limited Digitizer system
US9410791B2 (en) 2010-12-24 2016-08-09 Cambridge Integrated Circuits Limited Position sensing transducer
US9470505B2 (en) 2012-06-13 2016-10-18 Cambridge Integrated Circuits Limited Position sensing transducer

Also Published As

Publication number Publication date
JPH0367338B2 (en, 2012) 1991-10-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term