JPS60187541U - 半導体ウエ−ハの保護テ−プはがし装置 - Google Patents

半導体ウエ−ハの保護テ−プはがし装置

Info

Publication number
JPS60187541U
JPS60187541U JP7529784U JP7529784U JPS60187541U JP S60187541 U JPS60187541 U JP S60187541U JP 7529784 U JP7529784 U JP 7529784U JP 7529784 U JP7529784 U JP 7529784U JP S60187541 U JPS60187541 U JP S60187541U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
protective tape
adhesive tape
tape
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7529784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0128687Y2 (enExample
Inventor
御堂　洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7529784U priority Critical patent/JPS60187541U/ja
Publication of JPS60187541U publication Critical patent/JPS60187541U/ja
Application granted granted Critical
Publication of JPH0128687Y2 publication Critical patent/JPH0128687Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Winding Of Webs (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electron Beam Exposure (AREA)
JP7529784U 1984-05-21 1984-05-21 半導体ウエ−ハの保護テ−プはがし装置 Granted JPS60187541U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7529784U JPS60187541U (ja) 1984-05-21 1984-05-21 半導体ウエ−ハの保護テ−プはがし装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7529784U JPS60187541U (ja) 1984-05-21 1984-05-21 半導体ウエ−ハの保護テ−プはがし装置

Publications (2)

Publication Number Publication Date
JPS60187541U true JPS60187541U (ja) 1985-12-12
JPH0128687Y2 JPH0128687Y2 (enExample) 1989-08-31

Family

ID=30616385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7529784U Granted JPS60187541U (ja) 1984-05-21 1984-05-21 半導体ウエ−ハの保護テ−プはがし装置

Country Status (1)

Country Link
JP (1) JPS60187541U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367442U (enExample) * 1989-11-07 1991-07-01
JP2019102289A (ja) * 2017-12-04 2019-06-24 リンテック株式会社 シート剥離装置およびシート剥離方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367442U (enExample) * 1989-11-07 1991-07-01
JP2019102289A (ja) * 2017-12-04 2019-06-24 リンテック株式会社 シート剥離装置およびシート剥離方法

Also Published As

Publication number Publication date
JPH0128687Y2 (enExample) 1989-08-31

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