JPS6018578U - 湿式多層セラミツク基板 - Google Patents

湿式多層セラミツク基板

Info

Publication number
JPS6018578U
JPS6018578U JP10894383U JP10894383U JPS6018578U JP S6018578 U JPS6018578 U JP S6018578U JP 10894383 U JP10894383 U JP 10894383U JP 10894383 U JP10894383 U JP 10894383U JP S6018578 U JPS6018578 U JP S6018578U
Authority
JP
Japan
Prior art keywords
ceramic substrate
multilayer ceramic
wet multilayer
wet
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10894383U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231797Y2 (enExample
Inventor
元山　郁夫
品川　充久
松本　智三
茂 斉藤
浅羽　洋史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10894383U priority Critical patent/JPS6018578U/ja
Publication of JPS6018578U publication Critical patent/JPS6018578U/ja
Application granted granted Critical
Publication of JPH0231797Y2 publication Critical patent/JPH0231797Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP10894383U 1983-07-15 1983-07-15 湿式多層セラミツク基板 Granted JPS6018578U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10894383U JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10894383U JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Publications (2)

Publication Number Publication Date
JPS6018578U true JPS6018578U (ja) 1985-02-07
JPH0231797Y2 JPH0231797Y2 (enExample) 1990-08-28

Family

ID=30253973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10894383U Granted JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Country Status (1)

Country Link
JP (1) JPS6018578U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61216394A (ja) * 1986-03-26 1986-09-26 イビデン株式会社 Ｉｃカード用多層プリント配線基板
JPH06140764A (ja) * 1992-10-29 1994-05-20 Kyocera Corp コンデンサ内蔵多層回路基板
JP2016082074A (ja) * 2014-10-17 2016-05-16 ダイキン工業株式会社 電装装置およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853256A (enExample) * 1971-11-08 1973-07-26
JPS5032473A (enExample) * 1973-07-30 1975-03-29
JPS57143891A (en) * 1981-03-02 1982-09-06 Hitachi Ltd Multilayer circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853256A (enExample) * 1971-11-08 1973-07-26
JPS5032473A (enExample) * 1973-07-30 1975-03-29
JPS57143891A (en) * 1981-03-02 1982-09-06 Hitachi Ltd Multilayer circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61216394A (ja) * 1986-03-26 1986-09-26 イビデン株式会社 Ｉｃカード用多層プリント配線基板
JPH06140764A (ja) * 1992-10-29 1994-05-20 Kyocera Corp コンデンサ内蔵多層回路基板
JP2016082074A (ja) * 2014-10-17 2016-05-16 ダイキン工業株式会社 電装装置およびその製造方法

Also Published As

Publication number Publication date
JPH0231797Y2 (enExample) 1990-08-28

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