JPS60182754A - Jig for glass terminal junction - Google Patents

Abstract

PURPOSE:To keep the gap at the junction narrow, and to perform soldering at accurate positions by penetrating solder to details by the capillery phenomenon by a method wherein glass terminals are set to an amplifier package while spring force is impressed. CONSTITUTION:The glass terminals 2 are inserted to fixed positions of a package 1 arranged in the recess 3a of the jig body 3 U-shaped in cross-section, supported by a rod 5 held to the side wall 3b, and pressed by a spring 4. The glass terminal 2 consists of the outer shell 2a and a connection pin 2b and is fixed by being filled with glass. When the whole jig is heated to over the melting point of solder in this state and a threadlike solder 6 is put in contact with the outer edge of the outer shell 2a, it penetrates between the outer shell 2a and the side wall of the package 1 easily by the capillery phenomenon, and sufficient hermetic property is kept. After cooling, the rod 5 is separated from the glass terminals 2 by pulling knobs 7 horizontally, and the package 1 is taken out. This construction enables hermetic property to be securely kept and reduction in working time.

Description

Detailed Description of the Invention (11) Technical Field of the Invention The present invention provides a jig for bonding glass terminals, for example, for quickly and correctly bonding (soldering) glass terminals of amplifier packages to IC chips.
It relates to a jig that can be used to

(2) Background of the Technology A predetermined number of semiconductor elements are housed in a pancase 1 indicated by the reference numeral 1 in FIG. In the figure, 1a indicates an input terminal, and an output terminal (not shown) is arranged on the opposite side. Reference numeral 2 indicates a glass terminal, through which the element in the hermetically sealed package is connected to an external power source. The package is made of stainless steel or copper, and its interior is kept airtight. The technology for making such packages is well established.

(3) Conventional technology and problems No particular jig is used to bond the glass terminals of conventional amplifier packages, and when setting the glass terminals on the amplifier package, care must be taken to prevent them from falling off. It is supported by a ceramic plate, or a weight with a hole inside is used. In any case, it takes time to set it up, and the terminals move when joining them during soldering, etc., and you have to adjust them later on when each glass item is connected. There is a drawback.

In addition, in the above method, only holding the glass terminal horizontally is taken into account, and pushing the glass terminal horizontally toward the side wall of the package (this term is important for soldering glass terminals). No efforts were made for this.

(4) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention provides a method that allows glass terminals to be joined at accurate positions and with sufficient airtightness when joining them to a pan cage such as an amplifier package by soldering or the like. The present invention provides a jig that can be joined in a maintained state.

(5) Structure and purpose of the invention According to the present invention, a support rod to which a spring force is applied is arranged on the side wall of a jig body having a U-shaped cross section, and is attached to a package fixed to the bottom of the jig body. This is achieved by providing a jig for bonding glass terminals, characterized in that the glass terminal is pressed against the side wall of the package by the support rod, and the glass terminal is soldered to the side wall of the package in this state. .

(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.

In the present invention, by setting the glass terminal in the amplifier package while applying force with a spring, the gap at the joint is kept narrow, and the solder penetrates into the fine details by capillary action, allowing the glass terminal to be soldered in the correct position. The present invention provides a jig that makes it possible to attach.

FIG. 1 shows a jig of the invention in a perspective view, and FIG. 2 is an enlarged sectional view showing the arrangement of one of the glass terminals and one of the support rods of the jig.

This will be explained with reference to FIGS. 1 and 2. A glass terminal 2 is inserted into a predetermined position of an amplifier package 1 placed in a recess 3a formed in a jig main body 3 having a U-shaped cross section, and the glass terminal is held within a side wall 3b of the jig main body 3. Support rod 5
, and use spring 4 to hold it in place. The spring 4 is attached to the side opposite to the side facing the glass M614 of the support rod 5 and the side wall 3.
The support rod pin 5a is arranged between the support rod pin 5a and the support rod pin 5a. As can be understood from FIG. 2, the glass terminal 2 consists of an outer shell part 2a soldered to the side wall of the pan cage 1 and a connecting pin 2b. Glass is enclosed.

1) Place the jig body in the state described in 11 at the solder melting point of 190°C.
It is heated to the above temperature, for example, 210° C., and the glass terminal is joined to the amplifier package 1 by soldering.

To do this, a solder wire 6 is brought into contact with the outer edge of the outer shell 2a as shown in the figure. Since the gap between the joints is reduced by the spring, the solder easily flows through capillary action to the area between the outer shell 2a and the side wall of the package 1, as shown by the sand in the figure, and a sufficient airtightness is maintained. become.

After soldering, the jig is cooled to 150° C. on a cooling plate (not shown) to solidify the solder. Thereafter, by pulling the handle 7 in the horizontal direction, the support rod is removed from the crow terminal to remove the amplifier package.

The amplifier package manufactured in this way is 10-”a
It was confirmed that it had airtightness of tm, cc/sec.

Forming a recess 5b at the end of the support rod 5 that contacts the pin 2b for centering the pin 2b has the effect of accurately positioning the pin.

(7) Advantages of the Invention As described above in detail, according to the present invention, the glass terminal can be accurately attached to the amplifier package, so there is no need to adjust the position of the glass terminal after soldering is completed.
Reliability is improved because airtightness is ensured. In addition, since the work is easy to perform, the work process and work time can be reduced by 11 times.

The above explanation uses an amplifier package as an example, but
The scope of application of the present invention is not limited to this case, but also extends to cases where glass α+'M elements are soldered to other packages. Further, when the support rod is released from the pin, a means other than the handle may be used. Further, other amplifier package fixing means may be provided in place of the recess 3a of the jig main body.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the external appearance of an amplifier package and a jig of the present invention, and FIG. 2 is an enlarged sectional view of the glass terminal and support rod of the jig shown in FIG. 1. 1-amplifier package, 2-glass terminal, 2a-outer shell, 2b-pin, 3-jig body, 3a-recess, 3b-side wall, 4-spring, 5-support rod, 58-support rod pin, 5b -Dent, 6-Thread solder, 7-Handle Figure 1 Figure 2

Claims (1)

[Claims] A support rod to which a spring force is applied is placed on the side wall of a jig body having a U-shaped cross section, and a glass terminal attached to a package fixed to the bottom of the jig body is attached to the side wall of the package using the support rod. A jig for bonding glass terminals, characterized in that the glass terminals are pressed and bonded to the package side wall in such a state.