JPS62274683A - Semiconductor device - Google Patents

Abstract

PURPOSE:To assure easy alignment with high accuracy while improving the reliability and workability in case of assembling process by a method wherein bonding alignment step difference is provided to make the end of a mount and the end of a semiconductor chip constantly flush with each other. CONSTITUTION:A mount 6 is provided with the depth equivalent to the resonance length L of a semiconductor chip 1 e.g. a semiconductor laser chip 1 and an alignment step difference 6B slightly lower than the height of a plated electrode 4. The semiconductor laser chip 1 is loaded upon the step difference base 6C of mount 6 through the intermediary of a solder member 5 to be heated up to the melting point of the solder member 2. The plated electrode 4 can be bonded closely to the alignment step difference 6B of mount 6 so that the oscillating end 1A of semiconductor laser chip 1 may be aligned with the end 6A of mount 6 to be in parallel therewith not to be retracted or protruded therefrom. Through these procedures, the semiconductor chip 1 and the mount 6 can be aligned with excellent accuracy without fail while improving the reliability, workability and yield in case of assembling a semiconductor device.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a semiconductor device in which a semiconductor chip is bonded to a mount using a solder material.

Hereinafter, a description will be given by taking as an example a junction-down type semiconductor device that is bonded with the bonding side facing down. [Prior Art] FIG. 2 is a perspective view showing a state in which a conventional junction-down type semiconductor chip, such as a semiconductor laser chip, is mounted on a mount. In this figure, 1 is a semiconductor laser chip, 2 is a back electrode of the semiconductor laser chip 1,
3 is also a surface electrode, and between both electrodes 2 and 3, a semiconductor substrate, a lower cladding layer, an active layer with a junction, an upper cladding layer, a contact layer, etc. are successively formed, but these are not shown.

This is an abbreviation. Furthermore, a plating electrode 4 is provided on the surface electrode 3. Plating electrode 4 is bonded to mount 6 via solder material 5. When bonding, the semiconductor laser chip 1
It is desirable that the oscillation end surface 1A is located on the same plane as the end surface 6A of the mount 6 (the surface to be aligned with the oscillation end surface 1A).

If the oscillation end face 1A of the semiconductor laser chip 1 is bonded at a position further back than the end face 6A of the mount 6, there is a problem that the laser light will be rejected by the mount 6, especially when assembled in a junction-down manner. Conversely, the oscillation end face 1A of the semiconductor laser chip 1 is connected to the mount 6.
There was a problem that if the adhesive was bonded so as to protrude beyond the end surface 6A, the heat dissipation effect would deteriorate.

[Problem that the invention seeks to solve]

In the conventional semiconductor device in which the semiconductor laser chip 1 is bonded to the flat surface of the mount 6 as described above, the alignment between the oscillation end face 1A of the semiconductor laser chip 1 and the end face 6A of the mount 6 is performed visually. Both end faces 1A, 6
It is very difficult to bond the semiconductor laser chip 1 in the position where A matches, and for example, as shown in FIG. 3, the semiconductor laser chip 1 may not be bonded parallel to the mount 6, or as shown in FIG. There are problems with reliability and workability during assembly, such as the semiconductor laser chip 1 being glued backwards from the mount 6, or conversely, the semiconductor laser chip 1 being glued protruding from the mount 6 as shown in FIG. There was a point.

This invention was made in order to solve the above-mentioned problems, and provides a semiconductor chip that can be bonded so that the end face of the semiconductor chip and the end face of the mount always match and can be easily and precisely aligned. The purpose is to obtain equipment.

[Means for solving problems]

In the semiconductor device according to the present invention, the mount is provided with a positioning step portion that is bonded so that the end face of the mount and the end face of the semiconductor chip are always on the same plane.

[Effect]

In this invention, when the semiconductor chip is bonded to the mount, the plating electrode of the semiconductor chip is brought into close contact with the positioning step formed on the mount, so that the end surface of the semiconductor chip is parallel to the end surface of the mount. and is glued so that it does not recede or protrude.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. In the description of this embodiment, the description of parts that overlap with the description of the conventional technology will be omitted as appropriate.

FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention. The mount 6 is provided with a positioning step 6B having a depth equal to the resonance length of the semiconductor chip, for example, the semiconductor laser chip 1, and slightly lower than the height of the plated electrode 4 of the semiconductor laser chip 1. When the semiconductor laser chip 1 is placed on the step bottom 6C of the mount 6 via the solder material 5 and heated to the melting point of the solder material 5, the solder material 5 is melted. At this time, by bringing the plated electrode 4 of the semiconductor laser chip 1 into close contact with the positioning step portion 6B of the mount 6, the oscillation end surface 1A of the semiconductor laser chip 1 is aligned with the oscillation end surface 1A so that the surface to be aligned is aligned with the oscillation end surface 1A. It can be aligned so that it is parallel to the end surface 6A of the mount 6 and does not recede or protrude.

In the above embodiment, the case where the semiconductor laser chip 1 is bonded with the bond side down is shown, but even if the semiconductor laser chip 1 is bonded with the bond side up, the same effect can be achieved by providing the plating electrode 4 on the back electrode 2. Needless to say, semiconductor devices can be formed.

〔Effect of the invention〕

As explained above, in this invention, a positioning step is formed on the mount to which the end surface of the mount and the end surface of the semiconductor chip are bonded so that they always match and are on the same plane. By bringing the plated electrodes into close contact with each other, it is possible to accurately and reliably align the semiconductor chip and the mount. Therefore, the reliability and workability of semiconductor device assembly.

It has the advantage that the yield can be significantly improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention, FIGS. 2 to 5 show conventional semiconductor devices, and FIG. 2 shows a conventional Janfushi Bondarun type semiconductor laser. A perspective view showing the state where the chip is attached to the mount,
Figure 3 is a perspective view showing a state in which the semiconductor laser chip is not mounted parallel to the mount, Figure 4 is a perspective view showing the state in which the semiconductor laser chip is set back from the mount and bonded, and Figure 5 is a perspective view showing the semiconductor laser chip FIG. 3 is a perspective view showing a state in which the chip protrudes from the mount and is bonded. In the figure, 1 is a semiconductor laser chip, 1A is an oscillation end face, 2 is a surface electrode, 3 is a surface electrode, 4 is a plating electrode, 5 is a solder material, 6 is a mount, 6A is an end face of the mount, and 6B is a positioning step. , 6C is the bottom of the step. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 4 Procedural amendment (voluntary) I-11

Claims (1)

[Claims] In a semiconductor device in which a plating electrode formed on a front surface electrode or a back surface electrode of a semiconductor chip is bonded to a mount via a solder material, the end surface of the mount and the end surface of the semiconductor chip are always on the same plane. A semiconductor device characterized in that a positioning step portion to be bonded is formed on the mount.