JPS61100705A - Optical communicating equipment, and its production - Google Patents

Abstract

PURPOSE:To connect quickly and exactly a light emitting element or photodetector and optical fiber by providing a guide in the prescribed position of the light emitting element, etc. CONSTITUTION:The guide having the shape suitable for the purpose of matching the center of the light emitting pat 5a of the element 5 and the center of the optical fiber 3 consisting of a core part 3a and a clad part 3b and fixing the fiber in the proximate state as far as possible is provided in the prescribed position of the element 5 so that said purpose is achieved simply by matching the top end of the fiber 3 to the guide. The guide is formed of a lead 6 which is used for electrical connection of the element 5 and the electrode on the top surface of a substrate 2. The lead 6 is the so-called finger lead by tape carrier bonding and is formed by laminating a polyimid resin 6b having a prescribed shape on copper foil 6a and coating further rubber 6c as a cushion material onto the top end surface thereof. The lead 6 is electrically connected to the element by a bump electrode 8 formed to the copper foil 6a part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that can quickly and accurately achieve optical fiber connections to optical communication devices.

[Background technology]

Optical communication typically uses an optical fiber as an optical transmission medium, which consists of a core made of two materials with different refractive indexes and a cladding layer surrounding the core. This optical fiber is connected at its end to a light emitting element or a light receiving element.

Incidentally, the connection between the light emitting element or light receiving element and the optical fiber is determined by the efficiency of transmitting light from the light emitting part of the light emitting element to the optical fiber or the efficiency of transmitting light from the optical fiber to the light receiving part of the light receiving element (hereinafter referred to as coupling). (referred to as efficiency).

In other words, in order to obtain an optical communication device with high coupling efficiency, when connecting the light emitting section or the light receiving section of the light emitting element or the light receiving element mounted on the device with the optical fiber, it is necessary to It is required to bring the fiber tips as close as possible and to make their centers coincide.

However, it is difficult to connect the light emitting section and the optical fiber, and centering is especially difficult.

Therefore, the inventors have found that the connection requires careful work under a microscope, resulting in very poor workability.

, iU''・Hikari Tsushin■ 1'' section is explained in ・Special'' former No. 6-131527.

[Purpose of the invention]

An object of the present invention is to provide a technology that can easily achieve quick and accurate connection regarding optical fiber connections in optical communication devices.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings. In other words, by providing a connection guide with a shape suitable for alignment of the optical fiber at a predetermined position of the light emitting element or the light receiving element, the tip of the optical fiber and the light emitting part or the light receiving part are connected. By easily achieving an optimal connection with the optical fiber, it is possible to quickly and accurately connect the light emitting element, etc. with the optical fiber.

[Embodiment 1] FIG. 1 (at is a cross-sectional view of an optical communication device according to Embodiment 1 of the present invention taken approximately at the center thereof.

The optical communication device of the first embodiment is surrounded by a receptacle 1 made of a columnar body having a cavity of a predetermined shape.

An element mounting board 2 is placed at the lower end of the cavity, and a holder 4 into which an optical fiber 3 is inserted from above is also fitted into the cavity.The tip of the optical fiber 3 is attached to the board 2. The element 5 is connected to the electrode and lead 6 on the upper surface of the substrate 2.
It is electrically connected by. Note that the electrical conduction of the element 4 is performed by the external electrode 7 on the back surface of the substrate 2.The feature of the present embodiment 1 is that the optical connection between the optical fiber 3 and the element 5 is as shown in an enlarged cross-sectional view in FIG. 1° in the technique, that is, to align the center of the light emitting part 5a of the cable 5 with the center of the optical fiber 3 consisting of the core part 3a and the cladding layer 3b, and to fix the fiber as close as possible. The above object can be achieved by simply providing a guide element 5 of a shape suitable for this purpose at a predetermined position rK and simply adapting the tip of the original fiber 3 to the guide.

Another feature of the first embodiment is that the kite includes the element 5 and the substrate 2.
This lead 6 is formed by a lead 6 used for electrical connection with the electrode on the upper surface, and is a so-called finger lead by tape carrier bonding, and a polyimide resin 6b of a predetermined shape is laminated on a copper foil 6a. The tip surface is further coated with rubber 6C as a buffer. The lead 6 is electrically connected to the element through a bump electrode 8 formed on the copper foil 6a.

As explained above, in the optical communication device of the first embodiment, by electrically connecting the elements in the manufacturing process, it is possible to simultaneously form the guide for connecting the optical fiber 3.

[Embodiment 2] FIG. 2 rat is a cross-sectional view of an optical communication device according to a second embodiment of the present invention, taken along a plane cut approximately at its center. The only difference from Embodiment 1 is the attachment of element 5, and the rest is generally the same.

The element 5 in Example 2 is flip-chip bonded to the element mounting substrate 2 with bump electrodes 9, and sealed with a camp 10 in this state. Furthermore, the element is electrically connected to an external electrode 7 formed on the back surface of the substrate 2.

The feature of this second embodiment is that, as shown in FIG. The substrate 2 is made of a resin such as glass epoxy, and a copper wiring 2a is attached to the back surface of the substrate.
The surface of the perforated portion is coated with rubber 2b as a buffer.

As described above in 1-fc, there are three optical fibers in an optical communication device in which an element is attached by using a perforation formed in an element mounting board as a guide.

The optical connection between the light emitting element 5 and the light emitting element 5 can be easily achieved.

〔effect〕

(1) A light emitting element or a receiver in an optical communication device,
By providing a guide at a predetermined position of the light emitting element or the like, the element and the original fiber can be connected quickly and accurately, so that an optical communication device with high optical coupling efficiency can be easily manufactured.

(2) According to (1) above, it is possible to rationalize the manufacturing process of optical communication devices.

(3) The above +11 can improve the yield when manufacturing optical communication devices.

(4) By forming the guide using a lead, the manufacturing process can be shortened.

(5) By forming the guide with finger leads using tape carrier bonding, the guide can be easily provided. (6) By forming the guide with the perforated part of the element mounting board, it is possible to easily provide the guide for the element to be mounted. Optical fiber connections can also be easily achieved.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it goes without saying that various modifications can be made without departing from the gist thereof. Monatl.

For example, the optical communication device is not limited to the shape and material shown in the examples, but may be of any shape as long as it is used for the same purpose, and
The guide is not limited to one that uses a lead or one that is provided by drilling a hole in the board (although it goes without saying that it may be provided with a separate machine whose sole purpose is to serve as a guide).

In addition, the shape of the guide is not limited to that shown in the example (and the shape of the tip of the optical fiber is not necessarily limited to that shown in the example, so the shape may be uniform depending on the shape of the tip 1). 1i-id can be formed.

Furthermore, when forming a guide with a leap, if the optical fiber cannot be secured sufficiently due to the small number of leads,
A dummy lead for the purpose of forming a guide may also be used.

Further, in the second embodiment, the guide is formed by simply drilling a hole in the substrate, but it may be formed by fitting a separate machine into the hole in the substrate.

[Application field]

The above explanation has mainly been about the application of the invention developed by the present inventor to a transmission device equipped with a light-emitting element, which is the application field that forms the background of the invention, but the invention is limited thereto. For example,
It goes without saying that this technique is also effective when applied to a receiving device equipped with a light receiving element.

[Brief explanation of the drawing]

FIG. 1 (at is a cross-sectional view showing the optical communication device according to the first embodiment of the present invention, and FIG. 1 (bl is the connection state between the optical fiber and the light emitting element in the optical communication device of the first embodiment) FIG. 2 (al is a sectional view showing an optical communication device according to the second embodiment of the present invention, FIG. 1 is an enlarged partial sectional view showing a connection state with 1... Receptacle, 2... Board, 2a... Wiring, 2b... Rubber, 3... Optical fiber, 3a... Core part , 3b... Clamp 1 inertia, 4-... Holder, 5
...Element, 5a...Light emitting part, 6...Lead, 6a
...Copper foil, 6b...Polyimide resin, 6c...Rubber, 7...External electrode, 8.9...Bump electrode, 10
...Cap, Proxy Patent Attorney Akio Takahashi Figure 1

Claims (1)

[Claims] 1. An optical communication device in which an optical fiber connection guide is provided at a predetermined position of an element. 2. The optical communication device according to claim 1, wherein the guide is formed using a lead. 3. The optical communication device according to claim 1, wherein the leads are tape carrier bonded. 4. The optical communication device according to claim 1, wherein the guide is a perforation portion of a predetermined shape formed in the element mounting board. 5. The optical communication device according to claim 1, wherein the guide has a buffer attached to its optical fiber contact portion. 6. Manufacture of an optical communication device including the steps of providing an optical fiber connection guide at a predetermined position of the element, and fitting an optical fiber to the guide to connect the optical fiber to the light emitting part or the light receiving part of the element. Method. 7. The method of manufacturing an optical communication device according to claim 6, wherein the optical fiber is held in a holder at a predetermined portion. 8. The method of manufacturing an optical communication device according to claim 6, wherein the guide is formed of a finger lead connected to the element by tape carrier bonding.