JPS5984554A - Jig for airtight sealing - Google Patents

Abstract

PURPOSE:To enable the airtight sealing of high quality, which does not cause a defect such as the deterioration of spring characteristics due to a high temperature, by using a shape memory alloy as an arm pressure-bonding a sealing cap and a carrier stacked one upon another. CONSTITUTION:The arms 16, 16 pressure-bonding the sealing cap 10 and the carrier 11 stacked up and down are fitted oppositely on both sides of the upper opening section 15a of the jig 15 for airtight sealing, the arms 16, 16 are extended upward in straight bar shapes at room temperature and the opening section 15a of the jig 15 is opened, and the arms are constituted by the shape memory alloy memorized and treated so as to take an attitude pressure-welding the upper section of the sealing cap 10 at a high temperature. A package can be taken out easily after the carrier 11 and the sealing cap 10 are held, fixed and sealed by using the shape memory alloy.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an airtight sealing jig for holding a sealing cap and a carrier to be bonded together in a heated atmosphere.

Conventionally, in order to hermetically seal a semiconductor device package using gold-tin brazing material, a carrier that has undergone wire bonding and a sealing cap to which a preform of gold-tin brazing material is temporarily attached are stacked one on top of the other. This was housed in a sealing jig, and a spring was used to hold the sealing cap against the carrier, holding and fixing the carrier and sealing cap.Then, the carrier and sealing cap were held and fixed in a conveyor furnace in a nitrogen atmosphere at a temperature of 300 to 400℃. The gold-tin brazing material was melted by heating, and the carrier and the sealing cap were bonded together using the gold-tin brazing material to achieve an airtight seal. However, by adding a load using a spring, extra man-hours are required to set the chiarry and the sealing cap, which increases costs.
In addition, since the load is controlled by a spring, the spring characteristics deteriorate at temperatures of 300 to 400 degrees Celsius, the load becomes small, the solderability of the gold-tin filler metal deteriorates, and the yield at the hermetic sealing knee level deteriorates. It had one drawback.

The present invention solves the above-mentioned problems by housing a carrier and a sealing cap that are bonded to each other in a high-temperature atmosphere using a brazing material such as gold-tin or solder, or an adhesive such as glass or epoxy resin. A part of the hollow airtight sealing jig,
An arm is provided for crimping the sealing caps and the gear rear stacked one above the other, and the arm is stored in such a manner that the opening 11 of the jig is open at room temperature and the arm is in a position to press the top of the sealing cap at high temperature. It is characterized by being constructed from a processed shape memory alloy.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of the hermetically sealed ceramic chip carrier, which is an example of an integrated circuit package, and 10 is a Kov
The sealing cap is made of a material such as argon and is plated with gold, and a gold-tin preform 12 is temporarily installed on the surface facing the gear carrier 11 made of ceramic. A semiconductor element 13 is wire-bonded to the carrier 11 using a thin wire 14 made of gold or aluminum.

FIG. 2 shows an embodiment of the hermetic sealing jig of the present invention. That is, 15 is a heat-resistant hollow airtight sealing jig that accommodates the carrier 11 and sealing cap 10 inserted through the upper opening 15a. On both sides of the upper opening 15a of the air-tight sealing jig 15, arms 16.16 for crimping the sealing cap 10 and the carrier 11 stacked one above the other are mounted facing each other.
As shown in FIG. 3(a), 6° 16 extends upward in the shape of a straight bar at room temperature and opens the opening 15a of the jig 15.
As shown in FIG. 3(b), it is made of a shape memory alloy that has been subjected to a memory treatment so that it assumes a position in which it presses against the sealing cap 10 at high temperatures. As the shape memory alloy, a nickel-titanium alloy, a copper-submarine aluminum alloy, or the like is used.

In the embodiment, to achieve airtight sealing, the carrier 11 and sealing cap 10 are inserted into the jig 15 through the arms 16 and 16 at room temperature, and the jig 15 is inserted into a heated atmosphere such as a conveyor furnace. . Then, the arms i6, 16 bend due to the high heat and press against the sealing cap 10, thereby pressing the sealing cap 10 against the cap 11. In this state, the gold-tin preform 1.2 is melted and the sealing cap 10 and the cap 11 are bonded and hermetically sealed. After hermetically sealing, the hermetic sealing jig that comes out of the conveyor furnace is cooled and returns to the state shown in FIG. 3(a), and the sealed ceramic chip carrier is passed between the arms 16 and 16. Remove from the airtight sealing jig 15.

As described above, the present invention includes, as a part of the hermetic sealing jig, an arm for crimping the sealing cap and the carrier stacked one above the other, and the arm is used to open the opening of the jig at room temperature. It is made of a shape memory alloy that has been subjected to memory treatment so that it can be pressed against the sealing cap at high temperatures, so it is easy to hold and fix the carrier and the sealing cap, and to remove the cage after sealing. This has the effect that it is easy to perform, and high-quality airtight sealing without drawbacks such as deterioration of sealing properties due to high heat can be expected.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a ceramic chip carrier, FIG. 2 is a perspective view of an airtight sealing jig according to an embodiment of the present invention, and FIG.
a) ', (+) is a cross-sectional view for explaining the action of the hermetic sealing jig of the present invention. 10... Sealing cap, 11... Carrier, 12...
・Gold-tin preform, 16...Semiconductor element, 15...
・Jig body, 16...Arm Patent applicant: NEC Corporation Patent attorney Naka Kanno

Claims (1)

[Claims] (1) A hollow hermetic sealing jig that accommodates a carrier and a sealing cap that are bonded to each other in a high fluf W atmosphere using a brazing material such as gold tin or solder, or an adhesive such as glass or epoxy resin. A part of the tool is equipped with an arm that presses the sealing cap and the carrier stacked one above the other, and the arm is placed in a position where the opening of the jig is open at room temperature and the arm is pressed onto the sealing cap at high temperature. An airtight sealing jig characterized in that it is made of a shape memory alloy that has been subjected to a memory treatment so that it retains its shape.