JPS60182147A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS60182147A
JPS60182147A JP59037129A JP3712984A JPS60182147A JP S60182147 A JPS60182147 A JP S60182147A JP 59037129 A JP59037129 A JP 59037129A JP 3712984 A JP3712984 A JP 3712984A JP S60182147 A JPS60182147 A JP S60182147A
Authority
JP
Japan
Prior art keywords
bonding
wire
lead frame
area
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59037129A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363811B2 (enExample
Inventor
Koichi Chiba
宏一 千葉
Yoshio Terasaka
寺坂　良夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59037129A priority Critical patent/JPS60182147A/ja
Publication of JPS60182147A publication Critical patent/JPS60182147A/ja
Publication of JPH0363811B2 publication Critical patent/JPH0363811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59037129A 1984-02-28 1984-02-28 ワイヤボンデイング方法 Granted JPS60182147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59037129A JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59037129A JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS60182147A true JPS60182147A (ja) 1985-09-17
JPH0363811B2 JPH0363811B2 (enExample) 1991-10-02

Family

ID=12488998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59037129A Granted JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS60182147A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
JP5700482B2 (ja) * 2012-11-16 2015-04-15 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
CN104813455A (zh) * 2012-11-16 2015-07-29 株式会社新川 引线接合装置以及半导体装置的制造方法
US9793236B2 (en) 2012-11-16 2017-10-17 Shinkawa Ltd. Wire-bonding apparatus and method of manufacturing semiconductor device
CN104813455B (zh) * 2012-11-16 2017-11-21 株式会社新川 引线接合装置以及半导体装置的制造方法

Also Published As

Publication number Publication date
JPH0363811B2 (enExample) 1991-10-02

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