JPS60178629A - アライメント方法 - Google Patents

アライメント方法

Info

Publication number
JPS60178629A
JPS60178629A JP59033984A JP3398484A JPS60178629A JP S60178629 A JPS60178629 A JP S60178629A JP 59033984 A JP59033984 A JP 59033984A JP 3398484 A JP3398484 A JP 3398484A JP S60178629 A JPS60178629 A JP S60178629A
Authority
JP
Japan
Prior art keywords
wafer
alignment mark
wafer alignment
mark
reticle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59033984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570925B2 (enrdf_load_stackoverflow
Inventor
Kyoichi Suwa
恭一 諏訪
Hidemi Kawai
秀実 川井
Masakazu Murakami
雅一 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP59033984A priority Critical patent/JPS60178629A/ja
Priority to US06/703,941 priority patent/US4679942A/en
Publication of JPS60178629A publication Critical patent/JPS60178629A/ja
Publication of JPH0570925B2 publication Critical patent/JPH0570925B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP59033984A 1984-02-24 1984-02-24 アライメント方法 Granted JPS60178629A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59033984A JPS60178629A (ja) 1984-02-24 1984-02-24 アライメント方法
US06/703,941 US4679942A (en) 1984-02-24 1985-02-21 Method of aligning a semiconductor substrate and a photomask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59033984A JPS60178629A (ja) 1984-02-24 1984-02-24 アライメント方法

Publications (2)

Publication Number Publication Date
JPS60178629A true JPS60178629A (ja) 1985-09-12
JPH0570925B2 JPH0570925B2 (enrdf_load_stackoverflow) 1993-10-06

Family

ID=12401742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59033984A Granted JPS60178629A (ja) 1984-02-24 1984-02-24 アライメント方法

Country Status (1)

Country Link
JP (1) JPS60178629A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442128A (en) * 1987-08-08 1989-02-14 Mitsubishi Electric Corp Semiconductor substrate with alignment mark formed thereon
EP0640880A1 (en) * 1993-08-18 1995-03-01 AT&T Corp. Alignment of wafers for lithographic patterning
US7341927B2 (en) 2001-04-17 2008-03-11 California Institute Of Technology Wafer bonded epitaxial templates for silicon heterostructures
US7755109B2 (en) 2001-04-17 2010-07-13 California Institute Of Technology Bonded semiconductor substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442128A (en) * 1987-08-08 1989-02-14 Mitsubishi Electric Corp Semiconductor substrate with alignment mark formed thereon
EP0640880A1 (en) * 1993-08-18 1995-03-01 AT&T Corp. Alignment of wafers for lithographic patterning
US7341927B2 (en) 2001-04-17 2008-03-11 California Institute Of Technology Wafer bonded epitaxial templates for silicon heterostructures
US7755109B2 (en) 2001-04-17 2010-07-13 California Institute Of Technology Bonded semiconductor substrate

Also Published As

Publication number Publication date
JPH0570925B2 (enrdf_load_stackoverflow) 1993-10-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term