JPS60174252U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS60174252U
JPS60174252U JP1984062144U JP6214484U JPS60174252U JP S60174252 U JPS60174252 U JP S60174252U JP 1984062144 U JP1984062144 U JP 1984062144U JP 6214484 U JP6214484 U JP 6214484U JP S60174252 U JPS60174252 U JP S60174252U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
power transistor
locking groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984062144U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025539Y2 (enrdf_load_stackoverflow
Inventor
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1984062144U priority Critical patent/JPS60174252U/ja
Publication of JPS60174252U publication Critical patent/JPS60174252U/ja
Application granted granted Critical
Publication of JPH025539Y2 publication Critical patent/JPH025539Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984062144U 1984-04-25 1984-04-25 混成集積回路 Granted JPS60174252U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984062144U JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984062144U JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS60174252U true JPS60174252U (ja) 1985-11-19
JPH025539Y2 JPH025539Y2 (enrdf_load_stackoverflow) 1990-02-09

Family

ID=30591078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984062144U Granted JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS60174252U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008262990A (ja) * 2007-04-10 2008-10-30 ▲がい▼笛森光電股▲ふん▼有限公司 発光ダイオード封入構造、及びその製造方法。

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008262990A (ja) * 2007-04-10 2008-10-30 ▲がい▼笛森光電股▲ふん▼有限公司 発光ダイオード封入構造、及びその製造方法。

Also Published As

Publication number Publication date
JPH025539Y2 (enrdf_load_stackoverflow) 1990-02-09

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