JPS60169841U

JPS60169841U - Automatic supply and storage device for semiconductor wafers

Info

Publication number: JPS60169841U
Application number: JP5708684U
Authority: JP
Inventors: 綾部　時宏; 梅谷　正昭
Original assignee: 株式会社プラズマシステム
Priority date: 1984-04-18
Filing date: 1984-04-18
Publication date: 1985-11-11
Also published as: JPH0415714Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

図面は本考案の実施例を示し、第１図は側面からみた全
体の概略説明図、第２図は平面からの概略説明図、第３
図は一部切断の装置本体の側面図、第４図は同上平面図
、第５図は装置本体における部分的正面図、第６図はキ
ャリアの一例を示す平面図、第７図は同上縦断面図、第
８図はキャリア載置台とキャリアとの関係を示す正面図
である。１・・・処理室、２・・・搬送機構、３，３′・・・装
置本体、８，８′・・・昇降ねじ管、１５，１５’・・
・駆動源、１８．１８’・・・キャリア載置台、２０・
・・空隙部、３２，３２’、３３，３３’・・・搬送体
、３７゜３７’、４０・・・搬送体、４１・・・キャリ
ア、Ｐ・・・半導体ウェハ、Ｐ′・・・処理済半導体ウ
ェハ。 □−□“−リ］　　　　　Ｐグ４１．　　）ノThe drawings show an embodiment of the present invention, and FIG. 1 is a schematic explanatory view of the whole as seen from the side, FIG. 2 is a schematic explanatory view from a plane, and FIG.
The figure is a side view of the main body of the device partially cut away, FIG. 4 is a plan view of the same as above, FIG. 5 is a partial front view of the main body of the device, FIG. FIG. 8 is a front view showing the relationship between the carrier mounting table and the carrier. DESCRIPTION OF SYMBOLS 1...Processing chamber, 2...Transfer mechanism, 3, 3'...Device main body, 8,8'...Elevating screw pipe, 15,15'...
・Drive source, 18.18'...Carrier mounting table, 20・
...Gap, 32, 32', 33, 33'...Carrier, 37°37', 40...Carrier, 41...Carrier, P...Semiconductor wafer, P'... Processed semiconductor wafer. □-□“-ri] Pg41.)ノ

Claims

[Scope of utility model registration request]

An elevating mechanism disposed on a base, an approximately H-shaped carrier mounting table provided at the upper end of the elevating mechanism and having a gap through which a semiconductor wafer passes through which the semiconductor wafer moves up and down in unison, and a gap in the carrier mounting table. A semiconductor wafer transport mechanism disposed on the base on one side of the processing chamber and on the same transport line as the loading/unloading mechanism for the semiconductor wafer 1 to the processing chamber, and , and a device body having a connecting pulley rotatably supported on the other side of the cavity of the carrier mounting table, and a bottomless carrier body with openings on the opposing front and rear surfaces, and a semiconductor on the inner circumferential surface thereof. Grooves for horizontally inserting the wafer are provided in a multi-stage manner, and the front and rear openings are located in the same direction as the line of the semiconductor wafer transport mechanism of the apparatus main body, and the wafer is placed on the approximately H-shaped carrier mounting table of the apparatus main body. The apparatus main body is provided with two carriers in the front and back on the same transport line with a mechanism for loading and unloading semiconductor wafers into the processing chamber, and one transport mechanism and the other in the apparatus main body are provided. The carrier is connected to the connecting pulley via a transport body, and the semiconductor wafer at the bottom of the carrier is automatically moved into the processing chamber via the transport mechanism by raising the carrier through the lifting mechanism in the front feeding device. At the same time as being supplied, the processed semiconductor wafer is automatically inserted horizontally into the uppermost circumferential groove of the carrier in the rear storage device through the gap in the device main body of the feeding device by the reverse operation of the transfer mechanism. An automatic supply and storage device for semiconductor wafers characterized by a storage configuration.