JPS6160481A - Article transporter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention provides an article transfer device suitable for use in transferring plate-shaped articles such as semiconductor wafers from a first storage body to a second storage body all at once. Regarding.

[Background technology]

■Published by Press Journal, r Sem1conduct
orWo r 1d special issue, 84 Buyers'G
uide & DirectoryJ (1983/10
Monthly publication P353) describes a transport case for transporting semiconductor wafers.

The above-mentioned transport case is used when transporting semiconductor wafers from a crystal manufacturer to a semiconductor manufacturer, or in the manufacturing process of a semiconductor manufacturer, but it is necessary to transfer them from the first transport case to the second transport case. There is. In such cases, the semiconductor wafers were picked up one by one with vacuum tweezers and manually transferred to the second transport case.

According to studies by the inventors, the vacuum tweezers may come into contact with the semiconductor wafer adjacent to the semiconductor wafer to be picked up and damage it, or the outer periphery may be damaged due to strong contact with the guide grooves formed in the transport case. It was found that undesirable accidents such as cracking occurred and the manufacturing yield decreased.

[Purpose of the invention]

It is an object of the present invention to transfer semiconductor wafers from a first storage body to a second storage body in one step without using vacuum tweezers, thereby preventing scratches on the semiconductor wafers due to unexpected accidents, etc. An object of the present invention is to provide a transfer device that can reduce the

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief summary of the invention disclosed in this application is as follows:
It is as follows.

That is, a first storage body containing semiconductor wafers and an empty second storage body are overlapped to form a substantially continuous guide groove, and the first and second storage bodies are vertically connected. According to the present invention, a plurality of semiconductor wafers can be transferred at once and without damage by switching the semiconductor wafers from a first storage body to a second storage body while supporting the semiconductor wafers with a holder. It accomplishes its purpose.

〔Example〕

Next, an embodiment of an article transfer apparatus to which the present invention is applied will be described with reference to FIGS. 1 (A1 to 5).

The feature of this embodiment is that the second storage body is superimposed on the first storage body in which the semiconductor wafer is stored, and the two are integrated and repositioned vertically, and while supporting the semiconductor wafer with a holder, for example Twenty-five semiconductor wafers are transferred to the second storage body at once.

As shown in FIGS. 1A and 1B, 25 semiconductor wafers 2 are housed inside the first storage body 1 along a guide groove 3. As shown in FIGS. In this storage body 10 frame part,
Guide holes 4a and 4b are provided, and the second storage body 5
When the two are placed one on top of the other, guide pins 6a and 6b are inserted to position them. Also,
A guide groove 7 is also formed on the inner surface of the storage body 5, and is formed so that the guide groove 3.7 becomes a substantially continuous guide groove when the above-described overlapping is performed.

Regarding the method of transferring the semiconductor wafers 2, as described above, the first storage body 1 and the second storage body 5 are overlapped, and the second
The holder 11 is inserted into the bottom opening 8 of the storage body 5 as shown in FIG. The height of this holder 11 and the depth d of the second storage body.

are almost the same, but are slightly different from <d, so that the holder 11 does not come into contact with the outer periphery of the semiconductor wafer 2 during the insertion. This prevents damage to the semiconductor wafer 2 during the above operation.

Next, as shown in FIG. 3, the first and second storage bodies 1.5 are vertically repositioned and placed on the pedestal 21. As a result, when the holder 11 is gradually lowered, the support plate work 3
Both are lowered together with the semiconductor wafer 2 supported on top. At this time, each semiconductor wafer 2 is lowered along the substantially continuous guide grooves 7 and 3, so that the rubbing between the semiconductor wafer 2 and the guide grooves 7 and 3 is minimized and scratches are prevented. The occurrence of cracks and cracks is greatly reduced.

As a result of the above-described transfer, when the holder 11 is completely lowered into the pedestal 21, the semiconductor wafers 2 are transferred at once into the second storage body 5 as shown by dotted lines in FIG. Next, as shown in FIG. 5, when the empty first container 1 is removed, the transfer of the semiconductor wafer 2 into the second container 5, in other words, the transfer is completed.

Therefore, according to the above-mentioned transfer device, semiconductor wafers can be transferred all at once without damaging them, improving work efficiency and improving product yield.

〔effect〕

(1) By transferring the semiconductor wafers all at once along the guide grooves formed in the first and second storage bodies without using a vacuum bin set, the semiconductor wafers are not damaged, and the efficiency is extremely high. Semiconductor wafers can be transferred using

(2) From 1 above, there is no damage to the wafer;
Improved manufacturing yield can be measured.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the holder 11 may be lowered automatically using an air cylinder or the like instead of manually.

[Application field]

In the above description, the invention made by the present inventor has mainly been explained in relation to the field of application, which is the background thereof, which is the transportation of semiconductor wafers, but the present invention is not limited thereto.

For example, it can be used to transport records.

[Brief explanation of the drawing]

1st. 1 (Figure B1 shows a perspective view of the first and second storage bodies showing an embodiment of the present invention, and Figure 2 is a perspective view of the first and second storage bodies stacked together) 3 shows a perspective view showing the transfer of the semiconductor wafer, FIG. 4 shows a side view showing the positional relationship between the pedestal, the first and second storage bodies, and the semiconductor wafer, and FIG. 5 shows the transfer. A perspective view showing the completion status is shown. 1... First storage body, 2... Semiconductor wafer, 3° 7... Guide groove, 4a, 4b... Guide hole, 5...
・Second storage body, 6a, 6b...guide bin, 11・
... Holder, 13... Support plate, 21... Frame. 1,;-1,7,. “・-1 Figure 3 Figure 4 Figure 5 (
h

Claims (1)

[Claims] 1. A first storage body in which an article is stored, a second storage body in which the article is stored by transfer, and the first and second storage bodies are overlapped and the first storage body is moved from the second storage body. What is claimed is: 1. An article transfer device comprising: a holder that controls the transfer speed of the article;