JP2001110819A - Electronic parts-treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic parts-treating device with improved economy by drastically improving substrate productivity by providing a marking device. SOLUTION: The electronic parts-treating device is provided with a mounter 10 for applying a substrate 11 being supplied by a supply device 13 for supplying the substrate 11 onto a carrier path 35 into a ring frame 20 via an adhesive sheet S. A laser-marking device 15 is provided on the carrier path 35 of the supply device 13, thus marking a specific symbol to the substrate 11 while transferring the substrate 11 to the mounter 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component processing apparatus, and more particularly, to a method for attaching a substrate such as an IC or an LSI to a ring frame when a predetermined symbol is attached to the attachment surface of the substrate. TECHNICAL FIELD The present invention relates to an electronic component processing apparatus integrally provided with a structure for imparting a component.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 6 as an example, various ball grid array substrates 100 (hereinafter simply referred to as "BGA") formed by sealing a chip in which a number of circuits are formed on a semiconductor substrate in chip units. Substrate ") is known. The BGA substrate 100 is generally cut to the size of the chip 101 by pressing, and finally the chip 10 is cut.
The BGA substrate 100 is formed as a single substrate from which a plurality of substrates 1 can be taken out. The BGA substrate 100 is cut into a chip size by a press, picked up, and stored in a tray or the like. At this time, the BGA substrate cut to the size of the chip 101 is supplied in individual cut chip units,
It is common practice to mark the manufacturer or the like, the lot number, and the like on the back side of the mold 103 by using a laser marking device.

[0003] However, the BGA substrate 100 sealed in a conventional chip unit is cut by a press into a chip 1.
Separation into a size of 01 causes an inconvenience that the tip 101 is damaged by the impact of the cutting blade at the time of cutting, such as damage or cracking.

Therefore, recently, as shown in FIG. 5, a BGA substrate 11 for encapsulating chips at once has been developed. It is a common practice to imprint the manufacturer's display, lot number, and the like on the mold side of the BGA substrate 11 corresponding to the diced chip using a laser engraving device. This packaged BGA
The substrate 11 is stuck and held on the ring frame via an adhesive material such as an adhesive sheet by a mounter device.

[0005]

However, conventionally, the mounter device and the laser engraving device are separate dedicated devices, and the laser engraving device performs the engraving process and the attaching process continuously. Since there is no such property, stamping and sticking cannot be performed substantially simultaneously in a series of work steps, which is a factor that greatly reduces the production efficiency of electronic components.

[0006] In addition, a device for supplying substrates one by one is required for the mounter device, and a device for supplying substrates one by one is also required for the laser marking device. Therefore, if they are separate dedicated devices, two structurally similar supply devices are used together, which leads to an increase in the size of the manufacturing equipment and wasteful capital investment. Is caused.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of processing electronic components such as a BGA substrate, in which the BGA substrate can be provided with a mark such as an engraved mark, thereby making effective use of existing equipment. It is an object of the present invention to provide an electronic component processing apparatus which dramatically improves productivity while improving the economic efficiency.

[0008]

In order to achieve the above-mentioned object, the present invention provides a method for attaching an electronic component supplied by a supply device for supplying the electronic component to a predetermined position in a ring frame via an adhesive. In an electronic component processing apparatus provided with a sticking portion, a symbol assigning device for assigning a symbol to the electronic component is provided alongside the sticking portion. By adopting such a configuration, it is possible to process the symbol applying step continuously with the attaching step, and it is possible to secure the continuity of the step and greatly improve the production efficiency of electronic components. .

According to the present invention, there is provided an electronic component processing apparatus having a sticking section for sticking the electronic component supplied by a supply device for supplying the electronic component to a predetermined position in a ring frame via an adhesive. In the supply device is configured to include a transport path for transporting electronic components, on the transport path,
A configuration is adopted in which a laser engraving device for providing a symbol on the surface to which the electronic component is attached is provided, and the laser engraving device is provided alongside the application portion. With such a configuration, it becomes possible to incorporate the laser marking device while effectively using the supply device. The electronic component is
A semiconductor package substrate on which a plurality of semiconductor packages are formed can be processed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component processing apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 is an overall schematic perspective view of an electronic component processing apparatus 1. 5A to 5C.
FIG. 1 shows a conceptual diagram of a BGA substrate as an electronic component employed in the present embodiment. In these figures, the electronic component processing apparatus 1 mounts a BGA substrate (hereinafter, simply referred to as a “substrate 11”) as an electronic component on a back side mold 11A (see FIG. 5) serving as an attachment surface described later (see FIG. 5). A supply device 13 that supplies the substrate 11 one by one in a posture as described above, and a symbol providing surface 11D of the substrate 11 supplied by the supply device 13,
A laser engraving device 15 as a symbol providing device for providing a symbol such as a manufacturer and a lot number; a transfer device 17 for transferring the substrate 11 on which the symbol is stamped to the attaching portion 19 side of the mounter device 10; Ring frame 20 by attachment portion 19
Reversing device 22 for reversing the substrate 11 attached to the inner region of the ring frame 20 and the ring frame 20 reversed with the substrate 11
And a delivery device 27 that sends out the paper to a position where it is stored in the storage box 25. Here, the substrate 11
Is not particularly limited, but in the present embodiment,
A BGA substrate having a substantially rectangular planar shape with a plurality of circuits formed on the front surface and a molded back surface side, and having holes 11C formed at a plurality of locations along both edges thereof is to be processed.

As shown in FIG. 2, the supply device 13 includes a supply conveyor 32 provided at a position above the frame 30, a projecting plate 34 provided at a position lower than the supply conveyor 32, and A transport path 35 is provided above the frame 30 along the direction in which the protrusion plate 34 protrudes. Here, the supply conveyor 32 is adapted to transfer a substantially rectangular parallelepiped cassette 36 which is opened in a direction substantially perpendicular to the direction in which the protrusion plate 34 projects, and the cassette transferred to its end, that is, to the left end position in FIG. 36 is fed downward through a lowering device 40 indicated by a two-dot chain line to a discharge conveyor 38 arranged below. Although the detailed structure is omitted here, the lowering device 40 is configured by a robot that holds the cassettes 36 one by one and lowers them. The lowering device 40 is configured to move the substrate 1 accommodated in the lowermost stage of the cassette 36.
When the first circuit surface 11B is positioned on substantially the same plane as the transport path 35, that is, at a position substantially coinciding with the plane of the ejection plate 34, the lowering of the cassette 36 is temporarily stopped. After the substrate 11 is protruded toward the transport path 35, the substrate 11 is intermittently driven down so that the next higher substrate 11 can protrude. The protruding plate 34 is fixed to the tip of a piston rod 43 of the cylinder 42, and the protruding plate 34 is set to be substantially at the same height as the transport path 35.

The transport path 35 is formed by a groove 35A substantially corresponding to the short width of the substrate 11. And
At a position along the transport path 35, a substrate slide device 46 is provided. As shown in FIGS. 2 and 5, the substrate sliding device 46 includes two holes 11C formed on both ends in the short direction of the substrate 11 on the supply direction side.
Arm 51 with two pins 50 insertable into C
And a slider 53 that supports the arm 51 and a single-axis robot 54 that movably supports the slider 53. Further, a rail 56 is provided below the transport path 35 along the transport path 35, and a substrate transport device 57 is movably disposed on the rail 56. The substrate transport device 57 receives the substrate 11 transported to the intermediate position of the transport path 35 by the substrate slide device 46, supplies the substrate 11 to the laser engraving device 15, and then discharges the substrate 11 from the laser engraving device 15. It is configured as a device.
The substrate transfer device 57 includes a slide block 59 mounted on the rail 56, and a plurality of holes 11C provided on the slide block 59 and formed in the substrate 11.
6 that can be inserted from the lower circuit surface 11B side
0.

The laser marking device 15 includes a box 63 having an opening 62 on the side of the supply device 13 and a laser beam device (not shown) disposed in the box 63. The opening 62 is provided so as to be openable and closable by a door 65, and the door 65 is provided so as to be vertically movable via a door opening / closing device 66 provided on the outer surface of the box 63. Therefore, when the door 65 is at the lowered position, the opening 62 is closed. In addition, a duct 68 is connected to the box 63, and dust generated by engraving on the sign providing surface 11 </ b> D of the substrate 11 is discharged outside through the duct 68.

Although the detailed structure of the transfer device 17 is omitted here, the transfer device 17 includes an appropriate robot hand capable of sucking or gripping the substrate 11 on which the marking has been performed. Thus, the substrates 11 are provided so that they can be transferred one by one to the sticking portion 19 (see FIGS. 1 and 3) in the next step.

As shown in FIG. 3, the adhering section 19 includes a table 70, a table transfer device 72 for moving the table 70 forward and backward with respect to a predetermined adhering position, and an unillustrated material roll. A release plate 74 for peeling the adhesive S1 from the adhesive S with the release material fed out of the adhesive S
1 is provided with a press roller (not shown) for pressing the substrate 1 against the adherend. Here, the pressure-sensitive adhesive S with a release material in the present embodiment is not particularly limited, but a release material adhered to the release surface of the pressure-sensitive adhesive S1 is employed. A precut 75 substantially corresponding to the outer shape of the ring frame 20 holding the substrate 11 is formed, and the adhesive S1 on which the precut 75 is formed is attached to the substrate 11 and the ring frame 20. The pressure-sensitive adhesive S1 is peeled off from the release material by being sharply bent by the release plate 74, and then the pressure-sensitive adhesive S with the release material is sequentially wound up as a scrap on a take-up roll 77.

Although the detailed structure of the table 70 (see FIG. 3) is omitted here, the table 70 has a structure for holding and fixing the circuit surface 11B side of the substrate 11 mounted thereon and the ring frame 20 in a sucked state. This is provided so as not to be displaced when the adhesive S1 is adhered. Here, the ring frame 20 has a shape provided with notches 20A at two positions on its outer periphery, and the notches 20A are positioned by engaging with pins (not shown) provided on the upper surface of the table 70. . Also,
On the lower surface side of the table 70, a slide block 80 is provided which is screwed with a feed screw shaft 79 of the table transfer device 72. The motor 82 of the table transfer device 72 rotates, and the Is provided so as to be able to advance and retreat. Note that the table 70 corresponds to FIGS.
2, the ring frame 20 is positioned with the position shown by the solid line as the initial position, and two substrates 11 are transferred by the transfer device 17 to the inner region of the ring frame 20. Then, an adhesive S1 is attached to the upper surface side of the substrate 11 and the ring frame 20 by using the position indicated by the two-dot chain line in FIG.
Are returned to the initial position shown by the solid line after the integrated body 21 is formed. Here, the substrate 11 on the table 70 has a back surface on which the above-described engraving is performed,
That is, the sticking surface to the adhesive S1 is on the upper surface side. Although the number of the substrates 11 to be attached is two in the present embodiment, the number is not particularly limited and can be increased or decreased as necessary.

The ring frame 20 includes a table 70
Are stored in a stacked state on a magazine (not shown) at a position adjacent to the table 7 via the ring frame transfer device 85 one by one from the top ring frame 20.
0. Although the detailed structure of the ring frame transfer device 85 is omitted here, for example, the ring frame transfer device 85 can be configured to include a robot hand having a vacuum mechanism that sucks the surface of the ring frame 20 at a plurality of locations.

The reversing device 22 is supported by the support rod 87 erected at a position adjacent to the table 70, a lift slider 89 movably provided along the support column 87, and supported by the lift slider 89. And an arm 90. The arm 90 is provided so as to be rotatable in the circumferential direction about its axis, and is provided with a plurality of suction portions (not shown) at its tip.
By adsorbing the upper surface of one ring frame 20 at a plurality of locations, the ring frame 20 can be held. The reversing device 22 is for reversing the adhered body 21 by approximately 180 degrees.
The sticking surface of the substrate 11, that is, the symbol providing surface 11D is on the lower surface side, while the circuit surface 11B of the substrate 11 is on the upper surface side.

Between the reversing device 22 and the sending device 27 (see FIG. 4) adjacent thereto, the ring frame 20 integrated with the substrate 11 is moved from the reversing device 22 to the sending device 2.
7 is provided with a delivery device 92 (see FIG. 3) for delivery. The transfer device 92 is configured by a device having a mechanism capable of appropriately adsorbing the surface of the ring frame 20 of the adhesive body 21 and moving from the reversing device 22 to the sending device 27.

As shown in FIG. 4, the delivery device 27 includes a delivery path 94 provided on the upper surface of the table 93,
A pusher 96 is provided on the delivery path 94. The pusher 96 is provided so as to be able to advance and retreat along the delivery path 94 via an appropriate cylinder device or the like (not shown), whereby the adhesive body 21 placed on the delivery path 94 by the delivery device 92 is removed. Delivery path 9
4 can be sent to the storage box 25 on the downstream side. Here, the storage box 25 is supported by an elevating mechanism (not shown), and is configured to be lowered one by one after one piece of the adhered body 21 is stored.

Next, the overall operation of the electronic component processing apparatus 1 will be described.

In FIG. 2, when the cassette 36 containing the substrates 11 is fed to the end position of the supply conveyor 32, the cassette 36 is moved by the lowering device 40 between the leading end of the protruding plate 34 and the starting end of the transport path 35. It is lowered in between. Then, the substrate 1 at the bottom of the cassette 36
When 1 is lowered to the plane height position of the protruding plate 34, the lowering of the cassette 36 is temporarily interrupted,
At this time, the protruding plate 34 moves forward and protrudes one substrate 11 onto the transport path 35 with the circuit surface 11B side down. The ejection plate 34 then retreats, and the cassette 36 is lowered by the lowering device 40 so that the next substrate 11 is at the ejection position, and waits until the next ejection timing.

When the substrate 11 is protruded onto the transport path 35, the pins 50 of the substrate slide device 46 are inserted from above into the two holes 11C on the moving direction side of the holes 11C formed at both ends of the substrate 11. The substrate 11 is transported halfway along the transport path 35. Thereafter, the substrate transfer device 57 located below the transfer path 35 is driven, and the pins 60 of the substrate transfer device 57 are inserted into the holes 11C of the substrate 11 from below. Next, the substrate transfer device 57
Transfers the substrate 11 along the rail 56 into the box 63 of the laser marking device 15. At this time, the door 65 of the box 63 is in the open position, and closes the opening 62 when a sensor (not shown) detects that the substrate 11 has reached a predetermined position in the box 63.

The substrate 11 sent into the laser marking device 15 in this manner is marked on the symbol providing surface 11D of the substrate 11 according to preset marking information. At this time, dust generated by the marking is transferred to the duct 68.
Is discharged to the outside.

When the engraving is completed, the substrate transfer device 57
Is returned to the solid line position in FIGS. 1 and 2, and at the same time, the transfer device 17 is driven to transfer the stamped substrate 11 onto the table 70. At this time, on the table 70,
One ring frame 20 is transferred via the ring frame transfer device 85 described above. Thus, the two substrates 1 are provided in the inner region of the ring frame 20.
When 1 is arranged with the circuit surface 11B side down, the suction mechanism incorporated in the table 70 operates to suction-hold the substrate 11 and the ring frame 20 to fix the position. And
The table 70 moves to the position of the sticking section 19 via the table transfer device 72.

When the table 70 is moved to the position of the sticking portion 19, the substantially circular adhesive S1 which has been precut 75 is peeled off by the peeling plate 74 while being supplied, and its lead end is stuck to the ring frame 20. Then, in this state, the adhesive S1 is attached to the entire area of the ring frame 20 while moving the table 70 to the position indicated by the solid line in FIGS.
Mold 11A of substrate 11 fixedly arranged at the center of
The side is adhered to the inner region of the ring frame 20 with the adhesive S1 to form the adhered body 21.

When the bonding of the substrate 11 is completed and the ring frame 20 on which the bonded body 21 is formed returns to the position indicated by the solid line in FIGS. 1 and 3, the reversing device 22 is driven. Then, as the elevating slider 89 of the reversing device 22 descends,
When the ring frame 20 of the sticking body 21 is sucked through a suction portion (not shown) provided at the tip of the arm 90, and thereafter, the elevating slider 89 rises and reaches a height position where it does not interfere with the table 70. Then, the arm 90 is rotated to rotate the bonded body 21 by approximately 180 degrees,
Is turned to the position where the adhesive surface is on the lower surface side, and the circuit surface 11B which has been located on the lower surface side is turned to the upper surface side, and this circuit surface 11B becomes the surface to be diced in a later step.

The inverted sticky body 21 is transferred to the delivery device 9.
2 (see FIG. 3) and transferred to the sending device 27 (see FIG. 4). Then, the pusher 96 of the transmission device 27
Has moved in the direction of the arrow in FIG. 4, and the bonded body 21 has been pushed out from the delivery path 94. The pushed-out bonded body 21
It will be stored in the storage box 25. When the storage box 25 stores one piece of the attached body 21, the storage box 25 is lowered by one step in preparation for storing the next attached body 21.

Therefore, according to such an embodiment, since the laser engraving device 15 is incorporated in the process of integrating the substrate 11 and the ring frame 20, the single supply device 13 is shared. It is possible to reduce the equipment cost, and also to improve the productivity by securing the continuity of the electronic component processing steps.

In the above-described embodiment, the case where the symbol providing device is constituted by the laser marking device 15 has been illustrated and described. However, the present invention is not limited to this, and the substrate 11 is provided with a predetermined symbol. Anything that can do it is enough. Therefore, a non-contact printing device such as an ink jet printer can be used as the symbol providing device.

The structure of the electronic component processing apparatus that performs each of the above-described processes is not limited to the illustrated configuration example, and may be appropriately modified as long as it can perform substantially the same operation. Can be.

Further, the ring frame 20 of the present invention
Is not limited to the illustrated shape, and for example, a square or polygonal ring frame or the like can be applied. In short, the ring frame 20 of the present invention can be of various shapes as long as the ring frame 20 has an inside opening shape in which the substrate 11 can be arranged and adhered by the adhesive S1.

In the above embodiment, a ball grid array (BGA) substrate has been described as an example. However, the present invention is also applicable to a land grid array substrate on which a plurality of land grid array (LGA) type semiconductor packages are formed. Can be applied.

[0035]

As described above, according to the present invention,
Since a sign assigning device for assigning a sign to an electronic component is provided in the sticking section, the sign assigning step can be processed continuously with the sticking step, and the continuity of the process can be ensured to secure the electronic component. It is possible to greatly improve production efficiency,
It is possible to provide an electronic component processing apparatus exhibiting unprecedented excellent effects.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an electronic component processing apparatus showing an overall configuration according to an embodiment.

FIG. 2 is an enlarged perspective view of a supply device area in the embodiment.

FIG. 3 is an enlarged perspective view of a sticking area in the embodiment.

FIG. 4 is an enlarged perspective view of a delivery device region of the attached body in the embodiment.

5A and 5B are schematic views of a BGA substrate employed in the present embodiment, wherein FIG. 5A is a perspective view of the BGA substrate as viewed from the back side (mold side), and FIG. 5B is from the front side (circuit side). FIG. 5C is a perspective view as seen, and FIG. 5C is a side view of FIG.

FIG. 6 is a schematic perspective view of a main part showing another BGA substrate.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component processing device 10 mounter device 11 BGA substrate (electronic component) 13 supply device 15 laser engraving device (symbol assigning device) 19 sticking section 20 ring frame 21 sticking body 22 reversing device 35 transport path S adhesive with release material S1 Adhesive

Continued on the front page (72) Inventor Takeshi Onogami 4-1-17 Ishigaki Higashi, Beppu City, Oita Prefecture Lofty 1202 Minami Ishigaki Park 1202 (72) Inventor Kensho Murata 10 Sets of Kosaka, Beppu City, Oita Prefecture (72) Inventor Mutsumi Masumoto Oita Beppu City Spa Land Tokai 17-9

Claims (4)

[Claims] 1. An electronic component processing apparatus comprising: a sticking section that sticks the electronic component supplied by a supply device that supplies the electronic component to a predetermined position in a ring frame via an adhesive. An electronic component processing apparatus, characterized in that a symbol assigning device for assigning a symbol to a component is provided in said sticking section. 2. An electronic component processing apparatus comprising: a sticking portion for sticking the electronic component supplied by a supply device that supplies the electronic component to a predetermined position in a ring frame via an adhesive. The apparatus is provided with a transport path for transporting the electronic component, and on the transport path, a laser engraving device for providing a mark on a sticking surface of the electronic component is provided, and the laser engraving device is attached to the attaching portion. An electronic component processing apparatus characterized in that: 3. The electronic component processing apparatus according to claim 1, wherein the electronic component is a ball grid array substrate. 4. The electronic component processing apparatus according to claim 1, wherein the electronic component is a semiconductor package substrate on which a plurality of semiconductor packages are formed.