JPS60167340A - ステツチボンデイング部の接合状態の検査方法 - Google Patents

ステツチボンデイング部の接合状態の検査方法

Info

Publication number
JPS60167340A
JPS60167340A JP59023254A JP2325484A JPS60167340A JP S60167340 A JPS60167340 A JP S60167340A JP 59023254 A JP59023254 A JP 59023254A JP 2325484 A JP2325484 A JP 2325484A JP S60167340 A JPS60167340 A JP S60167340A
Authority
JP
Japan
Prior art keywords
lead terminal
copper wire
bonding
indentation
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59023254A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038586B2 (enExample
Inventor
Saneyasu Hirota
弘田　実保
Kiyotaka Okinari
沖成　清隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59023254A priority Critical patent/JPS60167340A/ja
Publication of JPS60167340A publication Critical patent/JPS60167340A/ja
Publication of JPH038586B2 publication Critical patent/JPH038586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07531—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/934—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP59023254A 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法 Granted JPS60167340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59023254A JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59023254A JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Publications (2)

Publication Number Publication Date
JPS60167340A true JPS60167340A (ja) 1985-08-30
JPH038586B2 JPH038586B2 (enExample) 1991-02-06

Family

ID=12105458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59023254A Granted JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Country Status (1)

Country Link
JP (1) JPS60167340A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474224A (en) * 1993-07-16 1995-12-12 Kaijo Corporation Wire bonder and wire bonding method
CN100336191C (zh) * 2005-03-04 2007-09-05 汕头华汕电子器件有限公司 用铜线形成半导体器件内引线的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474224A (en) * 1993-07-16 1995-12-12 Kaijo Corporation Wire bonder and wire bonding method
CN100336191C (zh) * 2005-03-04 2007-09-05 汕头华汕电子器件有限公司 用铜线形成半导体器件内引线的方法

Also Published As

Publication number Publication date
JPH038586B2 (enExample) 1991-02-06

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