JPS60167286A - 電子デバイスにおける電気的接続部の構造 - Google Patents

電子デバイスにおける電気的接続部の構造

Info

Publication number
JPS60167286A
JPS60167286A JP59021926A JP2192684A JPS60167286A JP S60167286 A JPS60167286 A JP S60167286A JP 59021926 A JP59021926 A JP 59021926A JP 2192684 A JP2192684 A JP 2192684A JP S60167286 A JPS60167286 A JP S60167286A
Authority
JP
Japan
Prior art keywords
electrode terminal
wire
electronic device
parts
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59021926A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6329950B2 (enExample
Inventor
裕一 正木
関村　信行
深谷　正樹
古島　輝彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP59021926A priority Critical patent/JPS60167286A/ja
Publication of JPS60167286A publication Critical patent/JPS60167286A/ja
Publication of JPS6329950B2 publication Critical patent/JPS6329950B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
JP59021926A 1984-02-10 1984-02-10 電子デバイスにおける電気的接続部の構造 Granted JPS60167286A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59021926A JPS60167286A (ja) 1984-02-10 1984-02-10 電子デバイスにおける電気的接続部の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59021926A JPS60167286A (ja) 1984-02-10 1984-02-10 電子デバイスにおける電気的接続部の構造

Publications (2)

Publication Number Publication Date
JPS60167286A true JPS60167286A (ja) 1985-08-30
JPS6329950B2 JPS6329950B2 (enExample) 1988-06-15

Family

ID=12068668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59021926A Granted JPS60167286A (ja) 1984-02-10 1984-02-10 電子デバイスにおける電気的接続部の構造

Country Status (1)

Country Link
JP (1) JPS60167286A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63127077U (enExample) * 1987-02-10 1988-08-19

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52133970U (enExample) * 1976-04-01 1977-10-12
JPS5342173U (enExample) * 1976-09-16 1978-04-11
JPS5363556U (enExample) * 1976-11-01 1978-05-29
JPS5470056U (enExample) * 1977-10-27 1979-05-18
JPS55160073U (enExample) * 1979-05-04 1980-11-17
JPS5791265U (enExample) * 1980-11-26 1982-06-04
JPS57165272A (en) * 1981-04-03 1982-10-12 Toshiba Corp Connecting method for wire bonding

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52133970U (enExample) * 1976-04-01 1977-10-12
JPS5342173U (enExample) * 1976-09-16 1978-04-11
JPS5363556U (enExample) * 1976-11-01 1978-05-29
JPS5470056U (enExample) * 1977-10-27 1979-05-18
JPS55160073U (enExample) * 1979-05-04 1980-11-17
JPS5791265U (enExample) * 1980-11-26 1982-06-04
JPS57165272A (en) * 1981-04-03 1982-10-12 Toshiba Corp Connecting method for wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63127077U (enExample) * 1987-02-10 1988-08-19

Also Published As

Publication number Publication date
JPS6329950B2 (enExample) 1988-06-15

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